The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Propagation Delay | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() | Mfr Part No M1AGL600V5-CS281 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V5-CS281 | Microchip Technology | Yes | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL600V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | OTHER | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-1CQ208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | A54SX72 | 250 MHz | 1 | MICROSEMI CORP | A54SX72A-1CQ208 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 171 I/O | 70 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 5.25 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0°C ~ 70°C (TA) | A54SX72A | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | unknown | S-CQFP-F208 | 171 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 171 | 6036 CLBS, 108000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AGL600V2-FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FG256I | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P400-1FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P400 | 350 MHz | 160 | MICROSEMI CORP | A3P400-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 272 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 6.8 kB | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 272 MHz | 1 | 9216 | 9216 | 400000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000L-FGG256 | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000L-FG256 | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FGG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000L-FGG144I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP2C70F896C7N | Intel | Datasheet | 348 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 896-BGA | YES | 622 | 0°C~85°C TJ | Tray | Cyclone® II | e1 | Active | 3 (168 Hours) | 896 | 3A001.A.7.A | TIN SILVER COPPER | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP2C70 | S-PBGA-B896 | 606 | Not Qualified | 1.21.5/3.33.3V | 450MHz | 622 | FIELD PROGRAMMABLE GATE ARRAY | 68416 | 1152000 | 4276 | 2.6mm | 31mm | 31mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP1SGX40DF1020C7 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1020-BBGA | YES | 624 | 0°C~85°C TJ | Tray | Stratix® GX | e0 | Obsolete | 3 (168 Hours) | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 220 | 1.5V | 1mm | 30 | EP1SGX40 | S-PBGA-B1020 | 638 | Not Qualified | 1.51.5/3.3V | 638 | 4697 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 41250 | 3423744 | 4125 | 4697 | 3.5mm | 33mm | 33mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EPF10K50SQC240-3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 240-BFQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KS® | e3 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~2.625V | QUAD | GULL WING | 245 | 2.5V | 0.5mm | compliant | 40 | EPF10K50 | S-PQFP-G240 | 189 | Not Qualified | 2.52.5/3.3V | 0.5 ns | 189 | LOADABLE PLD | 2880 | 40960 | 199000 | 360 | MIXED | 4.1mm | 32mm | 32mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL010TS-VFG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL010 | 119 | MICROSEMI CORP | M2GL010TS-VFG256 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL010TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPF300T-1FCG784I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | BGA-784 | 1 | + 100 C | - 40 C | Yes | SMD/SMT | 388 I/O | 300000 LE | Details | This product may require additional documentation to export from the United States. | 1.08 V | 0.97 V | 20.6 Mbit | PolarFire | 2.842997 oz | Tray | MPF300T | 1.05 V | 12.5 Gb/s | 16 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EPF10K50VRC240-1 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 240-BFQFP Exposed Pad | YES | 189 | 0°C~70°C TA | Tray | FLEX-10K® | Obsolete | 3 (168 Hours) | 240 | 3A991 | TIN/LEAD (SN/PB) | 8542.39.00.01 | 3V~3.6V | QUAD | GULL WING | 220 | 3.3V | 0.5mm | 30 | EPF10K50 | S-PQFP-G240 | 310 | Not Qualified | 3.3V | 0.4 ns | 310 | LOADABLE PLD | 2880 | 20480 | 116000 | 360 | REGISTERED | 4 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2V4000-5BF957I | Xilinx Inc. | Datasheet | 21 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 957-BBGA, FCBGA | 957 | 684 | -40°C~100°C TJ | Tray | 2007 | Virtex®-II | e0 | no | Obsolete | 4 (72 Hours) | 957 | 3A991.D | Tin/Lead (Sn63Pb37) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1.27mm | 30 | XC2V4000 | 957 | 684 | 1.5V | 270kB | FIELD PROGRAMMABLE GATE ARRAY | 2211840 | 4000000 | 5760 | 5 | 46080 | 0.39 ns | 40mm | 40mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10CL010YU256C8G | Intel | Datasheet | 432 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LFBGA | YES | 176 | 0°C~85°C TJ | Tray | Cyclone® 10 LP | Active | 3 (168 Hours) | 256 | 1.2V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | FIELD PROGRAMMABLE GATE ARRAY | 10320 | 423936 | 645 | 645 | 1.5mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP20K60EQC208-1X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 148 | 0°C~85°C TJ | Tray | APEX-20KE® | e0 | Obsolete | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.71V~1.89V | QUAD | GULL WING | 220 | 1.8V | 0.5mm | compliant | 30 | EP20K60 | S-PQFP-G208 | 140 | Not Qualified | 1.81.8/3.3V | 160MHz | 1.72 ns | 140 | LOADABLE PLD | 32768 | 162000 | 2560 | MACROCELL | 4 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2V500-4FGG456C | Xilinx Inc. | Datasheet | 368 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 456-BBGA | 456 | 264 | 0°C~85°C TJ | Tray | 2007 | Virtex®-II | e1 | yes | Obsolete | 3 (168 Hours) | 456 | EAR99 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 30 | XC2V500 | 456 | 264 | 1.5V | 1.51.5/3.33.3V | 72kB | 650MHz | FIELD PROGRAMMABLE GATE ARRAY | 589824 | 500000 | 768 | 4 | 6144 | 768 | 6912 | 2.6mm | 23mm | 23mm | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP3SE260H780I4N | Intel | Datasheet | 334 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 780-BBGA, FCBGA | YES | 488 | -40°C~100°C TJ | Tray | Stratix® III E | Active | 3 (168 Hours) | 780 | 3A001.A.7.A | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | 8542.39.00.01 | 0.86V~1.15V | BOTTOM | BALL | 0.9V | 1mm | EP3SE260 | S-PBGA-B780 | 488 | Not Qualified | 1.2/3.3V | 717MHz | 488 | FIELD PROGRAMMABLE GATE ARRAY | 255000 | 16672768 | 10200 | 3.5mm | 33mm | 33mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC6VSX315T-2FF1156C | Xilinx Inc. | Datasheet | 80 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 1156-BBGA, FCBGA | 600 | 0°C~85°C TJ | Tray | 2008 | Virtex®-6 SXT | e0 | no | Active | 4 (72 Hours) | 3A991.D | Tin/Lead (Sn63Pb37) | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | not_compliant | NOT SPECIFIED | XC6VSX315T | S-PBGA-B1156 | 600 | Not Qualified | 1V | 3.1MB | 220 ps | 600 | FIELD PROGRAMMABLE GATE ARRAY | 314880 | 25952256 | 24600 | 2 | 3.5mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCS10XL-5VQ100C | Xilinx Inc. | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-TQFP | 100 | 77 | 0°C~85°C TJ | Tray | 1999 | Spartan®-XL | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | TIN LEAD | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 30 | XCS10XL | 100 | 112 | 3.3V | 784B | FIELD PROGRAMMABLE GATE ARRAY | 466 | 6272 | 10000 | 196 | 5 | 616 | 1 ns | 196 | 196 | 3000 | 1.2mm | 14mm | 14mm | No | Non-RoHS Compliant | Contains Lead |
M1AGL600V5-CS281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A54SX72A-1CQ208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AGL600V2-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P400-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000L-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000L-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000L-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP2C70F896C7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP1SGX40DF1020C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EPF10K50SQC240-3N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL010TS-VFG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
MPF300T-1FCG784I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EPF10K50VRC240-1
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2V4000-5BF957I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
10CL010YU256C8G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP20K60EQC208-1X
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2V500-4FGG456C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP3SE260H780I4N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC6VSX315T-2FF1156C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XCS10XL-5VQ100C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
