The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No M2GL010TS-1VF256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL010 | 119 | MICROSEMI CORP | M2GL010TS-1VF256I | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 138 I/O | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | 14 X 14 MM, 0.80 MM PITCH, VFBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL010TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-2FG896I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 870 MHz | 27 | MICROSEMI CORP | AX2000-2FG896I | 870 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX2000 | e0 | TIN LEAD | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 740 ps | 740 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 870 MHz | 32256 | 21504 | 2 | 21504 | 0.74 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||
| Mfr Part No XCV1000E-8FG680C | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 680-LBGA Exposed Pad | 512 | 0°C~85°C TJ | Tray | 1999 | Virtex®-E | e0 | no | Obsolete | 3 (168 Hours) | 680 | 3A991.D | Tin/Lead (Sn63Pb37) | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 1mm | 30 | XCV1000E | 680 | 512 | 1.8V | 48kB | 416MHz | 512 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 393216 | 1569178 | 6144 | 8 | 0.4 ns | 331776 | 1.9mm | 40mm | 40mm | No | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP20K200CF484C7 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BBGA | 484-FBGA (23x23) | 376 | 0°C~85°C TJ | Tray | APEX-20KC® | Obsolete | 3 (168 Hours) | 1.71V~1.89V | EP20K200 | 8320 | 106496 | 526000 | 832 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP4CE55F29C6N | Intel | Datasheet | 2201 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 780-BGA | YES | 374 | 0°C~85°C TJ | Tray | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 780 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 245 | 1.2V | 1mm | 40 | EP4CE55 | S-PBGA-B780 | 377 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 377 | FIELD PROGRAMMABLE GATE ARRAY | 55856 | 2396160 | 3491 | 2.4mm | 29mm | 29mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV1000-4BG560I | Xilinx Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 560-LBGA Exposed Pad, Metal | 404 | -40°C~100°C TJ | Tray | 2010 | Virtex® | e0 | Obsolete | 3 (168 Hours) | 560 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 225 | 2.5V | 1.27mm | not_compliant | 30 | XCV1000 | 560 | S-PBGA-B560 | 404 | Not Qualified | 1.2/3.62.5V | 16kB | 250MHz | 404 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 131072 | 1124022 | 6144 | 0.8 ns | 1.7mm | 42.5mm | 42.5mm | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5AGXBB7D4F35I5N | Intel | Datasheet | 2400 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 1152-BBGA, FCBGA Exposed Pad | YES | 544 | -40°C~100°C TJ | Tray | Arria V GX | e1 | Active | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5AGXBB7 | S-PBGA-B1152 | 544 | Not Qualified | 1.11.2/3.32.5V | 622MHz | 544 | FIELD PROGRAMMABLE GATE ARRAY | 504000 | 27695104 | 23780 | 2.7mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCKU040-1FBVA676I | Xilinx Inc. | Datasheet | 662 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 676-BBGA, FCBGA | 676 | 312 | -40°C~100°C TJ | Tray | 2012 | Kintex® UltraScale™ | e1 | Active | 4 (72 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 0.922V~0.979V | BOTTOM | BALL | NOT SPECIFIED | 0.95V | NOT SPECIFIED | 312 | Not Qualified | 950mV | 0.95V | 2.6MB | FIELD PROGRAMMABLE GATE ARRAY | 530250 | 21606000 | 30300 | 1 | 484800 | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-2FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS600 | 60 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 172 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-2FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FGG484I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-2FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P250 | 350 MHz | 160 | MICROSEMI CORP | M1A3P250-2FG144 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-1FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS600 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-2FGG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-2FGG676 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-1FGG256K | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | AFS600 | 90 | Microchip Technology | Yes | 119 | 7000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS600 | 100 °C | -55 °C | 1.425V ~ 1.575V | 13.5 kB | 110592 | 600000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FCSG325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-FCSG325I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC | , BGA325,21X21,20 | BGA325,21X21,20 | Active | Active | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | compliant | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-1FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | 176 | MICROSEMI CORP | M2GL050TS-1FCS325 | Microchip Technology | Yes | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL050TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL025 | 60 | MICROSEMI CORP | M2GL025T-FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 27696 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL025T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | STD | 4 Transceiver | 27696 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-PLG84A | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | A40MX04 | 116 MHz | 16 | MICROSEMI CORP | A40MX04-PLG84A | 120 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 69 I/O | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.59 | Details | Yes | 5.25 V | 4.75 V | 5 V | Actel | 0.239083 oz | -40°C ~ 125°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | 5 V | AUTOMOTIVE | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | STD | 2.2 ns | 547 | 6000 | 3.68 mm | 29.31 mm | 29.31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC6SLX150-3CSG484C | Xilinx Inc. | Datasheet | 44 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 484-FBGA, CSPBGA | 484 | 338 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX150 | 484 | 330 | Not Qualified | 1.2V | 603kB | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 147443 | 4939776 | 11519 | 3 | 184304 | 0.21 ns | 1.8mm | 19mm | 19mm | ROHS3 Compliant |
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M2GL010TS-1VF256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AX2000-2FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCV1000E-8FG680C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP20K200CF484C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4CE55F29C6N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCV1000-4BG560I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5AGXBB7D4F35I5N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCKU040-1FBVA676I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,129.916670
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AFS600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS600-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE1500-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS600-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE1500-2FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS600-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090-FCSG325I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050TS-1FCS325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL025T-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-PLG84A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC6SLX150-3CSG484C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire