The category is 'Embedded - PLDs (Programmable Logic Device)'
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- Base Part Number
- Moisture Sensitivity Level (MSL)
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- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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 | Mfr Part No XC7354-7WC68C | AMD Xilinx | Datasheet | 546 | - | Min: 1 Mult: 1 | YES | 68 | 95.2 MHz | XILINX INC | 1 | 42 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | 54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 108 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 68 | S-CQCC-J68 | Not Qualified | COMMERCIAL | 16.5 ns | 8 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | MACROCELL | 54 | NO | 8 | NO | 24.13 mm | 24.13 mm | |||||||||||||
 | Mfr Part No XH95216-7HQG208I | AMD Xilinx | Datasheet | 744 | - | Min: 1 Mult: 1 | YES | 208 | XILINX INC | 3 | 168 | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | Yes | 5 V | e3 | Yes | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | ||||||||||||||||||||||
 | Mfr Part No XCR5128-12TQ128C | AMD Xilinx | Datasheet | 156 | - | Min: 1 Mult: 1 | YES | 128 | 63 MHz | XILINX INC | 1 | 97 | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP128,.63X.87,20 | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | YES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 128 | R-PQFP-G128 | Not Qualified | COMMERCIAL | 14.5 ns | 2 DEDICATED INPUTS, 97 I/O | 1.6 mm | EE PLD | MACROCELL | 128 | YES | 2 | YES | 20 mm | 14 mm | |||||||||||||
 | Mfr Part No XC73108-15WB225I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 225 | 45.5 MHz | XILINX INC | 1 | 78 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WBGA | WBGA, BGA225,15X15 | BGA225,15X15 | SQUARE | GRID ARRAY, WINDOW | Obsolete | BGA | No | 5.5 V | 4.5 V | 5 V | 108 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS | 8542.39.00.01 | BOTTOM | BALL | 1.5 mm | unknown | 225 | S-CBGA-B225 | Not Qualified | INDUSTRIAL | 36 ns | 12 DEDICATED INPUTS, 78 I/O | UV PLD | MACROCELL | 108 | NO | 12 | NO | |||||||||||||||
| Mfr Part No PZ3064DS12BP | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | No | e0 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 13.5 ns | EE PLD | 64 | YES | YES | ||||||||||||||||||||||||
 | Mfr Part No XH95288-7HQG304C | AMD Xilinx | Datasheet | 181 | - | Min: 1 Mult: 1 | YES | 304 | XILINX INC | 192 | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-304 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | 5 V | e3 | Yes | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 304 | S-PQFP-G304 | Not Qualified | 0 DEDICATED INPUTS, 192 I/O | 4.5 mm | MASK PLD | MACROCELL | 40 mm | 40 mm | ||||||||||||||||||||||||
 | Mfr Part No XC7272A-25WC84M | AMD Xilinx | Datasheet | 154 | - | Min: 1 Mult: 1 | YES | 84 | 40 MHz | XILINX INC | 1 | 42 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QFJ | No | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-CQCC-J84 | Not Qualified | MILITARY | 40 ns | 12 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | MACROCELL | 72 | NO | 12 | NO | 29.21 mm | 29.21 mm | |||||||||||
| Mfr Part No M425R2GA3BB0-CQKOL | Samsung Electronics Co. Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PLS173/BLA | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | PHILIPS SEMICONDUCTORS | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | 10 | Not Qualified | MILITARY | 40 ns | PLA-TYPE | 22 | OT PLD | 38535Q/M;38534H;883B | 42 | |||||||||||||||||||||
| Mfr Part No PLS173/BLA | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | PHILIPS COMPONENTS | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | , | RECTANGULAR | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-CDIP-T24 | Not Qualified | MILITARY | 40 ns | 12 DEDICATED INPUTS, 10 I/O | OT PLD | COMBINATORIAL | 12 | ||||||||||||||||||||||||||
| Mfr Part No XC2C64-4CPG56C | AMD | Datasheet | 576 | - | Min: 1 Mult: 1 | YES | 56 | 213 MHz | ADVANCED MICRO DEVICES INC | 3 | 45 | 70 °C | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | Yes | 1.9 V | 1.7 V | 1.8 V | e1 | TIN SILVER COPPER | FAST ZERO POWER DESIGN TECHNOLOGY | BOTTOM | BALL | 260 | 0.5 mm | compliant | 30 | S-PBGA-B56 | 45 | Not Qualified | COMMERCIAL | 4 ns | PLA-TYPE | 45 | 0 DEDICATED INPUTS, 45 I/O | 1.35 mm | FLASH PLD | MACROCELL | 64 | 6 mm | 6 mm | ||||||||||||
 | Mfr Part No XC9572F-7PC84C | AMD Xilinx | Datasheet | 387 | - | Min: 1 Mult: 1 | YES | 84 | 83 MHz | XILINX INC | 3 | 69 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn85Pb15) | NO | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | 30 | 84 | S-PQCC-J84 | Not Qualified | COMMERCIAL | 7.5 ns | 0 DEDICATED INPUTS, 69 I/O | 5.08 mm | FLASH PLD | MACROCELL | 72 | YES | NO | 29.3116 mm | 29.3116 mm | ||||||||||
 | Mfr Part No XC95108F-20PQ160I | AMD Xilinx | Datasheet | 444 | - | Min: 1 Mult: 1 | YES | 160 | 50 MHz | XILINX INC | 3 | 108 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | compliant | 160 | S-PQFP-G160 | Not Qualified | INDUSTRIAL | 20 ns | 0 DEDICATED INPUTS, 108 I/O | 4.1 mm | FLASH PLD | MACROCELL | 28 mm | 28 mm | ||||||||||||||||
| Mfr Part No XCR3128-10PQ160C | AMD Xilinx | Datasheet | 144 | - | Min: 1 Mult: 1 | YES | 160 | 77 MHz | XILINX INC | 3 | 96 | 70 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | QFP | No | 3.63 V | 2.97 V | 3.3 V | e0 | TIN LEAD | YES | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.65 mm | not_compliant | 30 | 160 | S-PQFP-G160 | Not Qualified | COMMERCIAL | 10 ns | 2 DEDICATED INPUTS, 96 I/O | 4.1 mm | EE PLD | MACROCELL | 128 | YES | 2 | YES | 28 mm | 28 mm | |||||||||
 | Mfr Part No XC95432-10BG432C | AMD Xilinx | Datasheet | 456 | - | Min: 1 Mult: 1 | YES | 432 | XILINX INC | 3 | 232 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 5 V | e0 | 3A991.D | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 432 | S-PBGA-B432 | Not Qualified | COMMERCIAL | 10 ns | 232 I/O | 1.7 mm | FLASH PLD | MACROCELL | 40 mm | 40 mm | ||||||||||||||||||
| Mfr Part No XH95180-10HQ208I | AMD Xilinx | Datasheet | 60 | - | Min: 1 Mult: 1 | YES | 208 | XILINX INC | 3 | 168 | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | ||||||||||||||||||||||
| Mfr Part No XH95180-10HQ208I | AMD | Datasheet | 60 | - | Min: 1 Mult: 1 | YES | 208 | ADVANCED MICRO DEVICES INC | 3 | 168 | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | No | 5 V | e0 | TIN LEAD | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | ||||||||||||||||||||||||||
| Mfr Part No XH95180-10PQ160C | AMD Xilinx | Datasheet | 796 | - | Min: 1 Mult: 1 | YES | 160 | XILINX INC | 3 | 133 | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | QFP | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | compliant | 160 | S-PQFP-G160 | Not Qualified | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | |||||||||||||||||||||
| Mfr Part No XH95180-10PQ160C | AMD | Datasheet | 796 | - | Min: 1 Mult: 1 | YES | 160 | ADVANCED MICRO DEVICES INC | 3 | 133 | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | TIN LEAD | QUAD | GULL WING | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | |||||||||||||||||||||||||
| Mfr Part No P3Z22V10IBD-T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 65 MHz | NXP SEMICONDUCTORS | 10 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | 3.6 V | 3 V | 3.3 V | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G24 | Not Qualified | INDUSTRIAL | 15 ns | 11 DEDICATED INPUTS, 10 I/O | 2.65 mm | EE PLD | MACROCELL | 11 | 15.4 mm | 7.5 mm |
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XC7354-7WC68C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
-
XH95216-7HQG208I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR5128-12TQ128C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC73108-15WB225I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
-
PZ3064DS12BP
Philips Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XH95288-7HQG304C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC7272A-25WC84M
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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M425R2GA3BB0-CQKOL
Samsung Electronics Co. Ltd
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PLS173/BLA
Philips Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PLS173/BLA
YAGEO Corporation
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC2C64-4CPG56C
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC9572F-7PC84C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC95108F-20PQ160I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR3128-10PQ160C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC95432-10BG432C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XH95180-10HQ208I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XH95180-10HQ208I
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
-
XH95180-10PQ160C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
-
XH95180-10PQ160C
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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P3Z22V10IBD-T
NXP Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire