The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Applications | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TJA1021TK | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PQ8023A | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | BROADCOM INC | 70 °C | PLASTIC/EPOXY | DIP | DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | Not Qualified | COMMERCIAL | |||||||||||||||||||
| Mfr Part No S3526B | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM5032C | SamHop Microelectronics Corp. | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | SAMHOP MICROELECTRONICS CORP | 70 °C | -10 °C | PLASTIC/EPOXY | SOP | SOP, SOP14(UNSPEC) | SOP14(UNSPEC) | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | 8542.39.00.01 | DUAL | GULL WING | unknown | R-PDSO-G14 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | ||||||||||||||||||||||
 | Mfr Part No BA8240F-T1 | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ROHM CO LTD | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 24 | R-PDSO-G24 | Not Qualified | 2.01 mm | TELECOM CIRCUIT | 15 mm | 5.4 mm | ||||||||||||||||||
| Mfr Part No TH7122.1 | Melexis Microelectronic Integrated Systems | Datasheet | 7 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM54994EB0KFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No T23-A230X | TDK Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 3 | TDK CORP | 90 °C | -40 °C | UNSPECIFIED | PACKAGE-3 | ROUND | SPECIAL SHAPE | Active | Yes | 8542.39.00.01 | UNSPECIFIED | WIRE | NOT SPECIFIED | 1 | compliant | NOT SPECIFIED | O-XXSS-W3 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | |||||||||||||||||||||
| Mfr Part No TC8070P | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | TOSHIBA CORP | PLASTIC/EPOXY | SDIP | SDIP, | RECTANGULAR | IN-LINE, SHRINK PITCH | Active | DIP | No | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 1.778 mm | unknown | NOT SPECIFIED | 28 | R-PDIP-T28 | Not Qualified | 4.1 mm | ADPCM CODEC | NO | MU-LAW | 25.6 mm | 10.16 mm | |||||||||||||
| Mfr Part No NJG1128HB6 | New Japan Radio Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NEW JAPAN RADIO CO LTD | 85 °C | -40 °C | PLASTIC/EPOXY | VQCCN | 1.50 X 1.50 MM, 0.55 MM HEIGHT, PLASTIC, USB-8 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Transferred | QFN | 2.8 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | 8 | S-PQCC-N8 | Not Qualified | INDUSTRIAL | 0.6 mm | RF AND BASEBAND CIRCUIT | 1.5 mm | 1.5 mm | |||||||||||||||
| Mfr Part No ADN2818ACP | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | ANALOG DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 5 X 5 MM, MO-220-VHHD-2, LFCSP-32 | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | No | 3.3 V | e0 | No | TIN LEAD | SDH; SONET | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 5 mm | 5 mm | |||||||||
 | Mfr Part No TM1062HUA1 | Pulse Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | PULSE ELECTRONICS CORP | 1 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | No | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | MILITARY | TELECOM CIRCUIT | |||||||||||||||
| Mfr Part No RFFM6201 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | , | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.72 mm | unknown | S-XQMA-N24 | INDUSTRIAL | 1.05 mm | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | |||||||||||||||||||
 | Mfr Part No SA5217D | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOT-163-1, SOL-20 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | e4 | NICKEL PALLADIUM GOLD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | Not Qualified | INDUSTRIAL | 13.5 mA | 2.65 mm | TELECOM CIRCUIT | 12.8 mm | 7.5 mm | ||||||||||
| Mfr Part No RF5322 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | RF MICRO DEVICES INC | 2 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.20 X 2.20 MM, 0.40 MM HEIGHT, ROHS COMPLIANT, QFN-8 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | Yes | 5A991.G | Matte Tin (Sn) - annealed | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-XQCC-N8 | OTHER | 0.5 mm | RF AND BASEBAND CIRCUIT | 2.2 mm | 2.2 mm | ||||||||
| Mfr Part No PC33889DW | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | FREESCALE SEMICONDUCTOR INC | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | Not Qualified | AUTOMOTIVE | 2.65 mm | INTERFACE CIRCUIT | 17.925 mm | 7.5 mm | ||||||||||||||||
| Mfr Part No SN65HVD1050 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CMX980AL6 | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 1999-11-05 | CML MICROCIRCUITS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Not Recommended | LCC | Yes | 3.3 V | e3 | Yes | Matte Tin (Sn) | 8542.39.00.01 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 0.052 mA | 4.57 mm | TELECOM CIRCUIT | 16.585 mm | 16.585 mm | ||||||
| Mfr Part No ZED-F9K-01A | u-blox AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LXT9781BC | Cortina Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 272 | CORTINA SYSTEMS INC | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | COMMERCIAL | 2.32 mm | ETHERNET TRANSCEIVER | 27 mm | 27 mm |
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TJA1021TK
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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PQ8023A
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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S3526B
onsemi
Package:Interface - Telecom
Price: please inquire
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SM5032C
SamHop Microelectronics Corp.
Package:Interface - Telecom
Price: please inquire
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BA8240F-T1
ROHM Semiconductor
Package:Interface - Telecom
Price: please inquire
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TH7122.1
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
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BCM54994EB0KFSBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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T23-A230X
TDK Corporation
Package:Interface - Telecom
Price: please inquire
-
TC8070P
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
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NJG1128HB6
New Japan Radio Co Ltd
Package:Interface - Telecom
Price: please inquire
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ADN2818ACP
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
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TM1062HUA1
Pulse Electronics Corporation
Package:Interface - Telecom
Price: please inquire
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RFFM6201
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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SA5217D
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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RF5322
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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PC33889DW
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
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SN65HVD1050
Texas Instruments
Package:Interface - Telecom
Price: please inquire
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CMX980AL6
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
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ZED-F9K-01A
u-blox AG
Package:Interface - Telecom
Price: please inquire
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LXT9781BC
Cortina Systems Inc
Package:Interface - Telecom
Price: please inquire