The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Carrier Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No LXT9781BC | Cortina Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 272 | CORTINA SYSTEMS INC | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | COMMERCIAL | 2.32 mm | ETHERNET TRANSCEIVER | 27 mm | 27 mm | |||||||||||||||
![]() | Mfr Part No LXT9781BC | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 272 | INTEL CORP | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA272,20X20,50 | BGA272,20X20,50 | SQUARE | GRID ARRAY | Transferred | BGA | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 272 | S-PBGA-B272 | Not Qualified | COMMERCIAL | 1.1 mA | 100000 Mbps | 2.32 mm | ETHERNET TRANSCEIVER | 8 | 27 mm | 27 mm | ||||||||
![]() | Mfr Part No PMB2200SV2.1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPD98412N7-H6 | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | YES | 576 | NEC ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | 576 | S-PBGA-B576 | Not Qualified | INDUSTRIAL | 1.7 mm | ATM/SONET/SDH SWITCHING CIRCUIT | 40 mm | 40 mm | |||||||||||
![]() | Mfr Part No UPD98412N7-H6 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 576 | RENESAS ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA576,30X30,50 | BGA576,30X30,50 | SQUARE | GRID ARRAY | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B576 | Not Qualified | INDUSTRIAL | 1300 mA | ||||||||||||||||
![]() | Mfr Part No ATA5702F1000M-WDQW-V04 | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RF6519 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | RF MICRO DEVICES INC | UNSPECIFIED | QCCN | QCCN, LCC28,.2X.24,25 | LCC28,.2X.24,25 | SQUARE | CHIP CARRIER | Transferred | Yes | 4.2 V | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | 1 | 0.635 mm | unknown | S-XQCC-N20 | Not Qualified | TELECOM CIRCUIT | |||||||||||||||||||
![]() | Mfr Part No PEB4266 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | INTEL CORP | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | No | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G20 | Not Qualified | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | ||||||||||||||
![]() | Mfr Part No SK70742QE | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | INTEL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP64,.66SQ,32 | QFP64,.66SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | compliant | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 65 mA | 3 mm | FRAMER | 14 mm | 14 mm | |||||||||
![]() | Mfr Part No T7522APE | ITT Interconnect Solutions | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC14408B80VDX | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | NATIONAL SEMICONDUCTOR CORP | PLASTIC/EPOXY | QFP | QFP, QFP80,.68SQ | QFP80,.68SQ | SQUARE | FLATPACK | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.635 mm | unknown | S-PQFP-G80 | Not Qualified | |||||||||||||||||||||
![]() | Mfr Part No BCM8702 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM INC | , | Active | compliant | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LAN9311I-NZW-TR | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | MICROCHIP TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, XVTQFP-128 | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Yes | 3.3 V | e3 | EAR99 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.4 mm | compliant | S-PQFP-G128 | Not Qualified | INDUSTRIAL | 295 mA | 1.2 mm | TS 16949 | ETHERNET SWITCH | 14 mm | 14 mm | ||||||||
![]() | Mfr Part No PEB55504 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | INFINEON TECHNOLOGIES AG | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 144 | S-PQFP-G144 | Not Qualified | 1.6 mm | TELECOM CIRCUIT | 20 mm | 20 mm | ||||||||||||||||||
![]() | Mfr Part No SWG30-48S75C01 | Artesyn Embedded Technologies | Datasheet | - | - | Min: 1 Mult: 1 | NO | 11 | COMPUTER PRODUCTS POWER CONVERSION | 70 °C | UNSPECIFIED | , | SQUARE | MICROELECTRONIC ASSEMBLY | Obsolete | DMA | 48 V | 8542.39.00.01 | DUAL | PIN/PEG | 1 | unknown | 11 | S-XDMA-P11 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | ||||||||||||||||||||
![]() | Mfr Part No MJ1445 | Dynex Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | GEC PLESSEY SEMICONDUCTORS | 70 °C | -10 °C | CERAMIC | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | Not Qualified | COMMERCIAL | 0.04 mA | 2048 Mbps | PCM RECEIVER | CEPT PCM-30/E-1 | |||||||||||||
![]() | Mfr Part No GD82R600ABH | Thinking Electronic Industrial Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 2 | THINKING ELECTRONIC INDUSTRIAL CO LTD | 85 °C | -30 °C | UNSPECIFIED | , | ROUND | SPECIAL SHAPE | Obsolete | Yes | 8542.39.00.01 | DUAL | WIRE | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | O-XDSS-W2 | OTHER | GAS DISCHARGE TUBE SUPPRESSOR | ||||||||||||||||||||
![]() | Mfr Part No PBL38772/1SOA | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | INFINEON TECHNOLOGIES AG | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | Not Qualified | INDUSTRIAL | 2.64 mm | SLIC | 17.83 mm | 7.5 mm | ||||||||||||||
![]() | Mfr Part No TH72035.2 | Melexis Microelectronic Integrated Systems | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AZCAN1040T.RDG | Amazing Microelectronic Corp | Datasheet | - | - | Min: 1 Mult: 1 | AMAZING MICROELECTRONIC CORP | , | Active | 8542.39.00.01 | unknown |
LXT9781BC
Cortina Systems Inc
Package:Interface - Telecom
Price: please inquire
LXT9781BC
Intel Corporation
Package:Interface - Telecom
Price: please inquire
PMB2200SV2.1
Siemens
Package:Interface - Telecom
Price: please inquire
UPD98412N7-H6
NEC Electronics Group
Package:Interface - Telecom
Price: please inquire
UPD98412N7-H6
Renesas Electronics Corporation
Package:Interface - Telecom
Price: please inquire
ATA5702F1000M-WDQW-V04
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
RF6519
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
PEB4266
Intel Corporation
Package:Interface - Telecom
Price: please inquire
SK70742QE
Intel Corporation
Package:Interface - Telecom
Price: please inquire
T7522APE
ITT Interconnect Solutions
Package:Interface - Telecom
Price: please inquire
SC14408B80VDX
Texas Instruments
Package:Interface - Telecom
Price: please inquire
BCM8702
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
LAN9311I-NZW-TR
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
PEB55504
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
SWG30-48S75C01
Artesyn Embedded Technologies
Package:Interface - Telecom
Price: please inquire
MJ1445
Dynex Semiconductor
Package:Interface - Telecom
Price: please inquire
GD82R600ABH
Thinking Electronic Industrial Co Ltd
Package:Interface - Telecom
Price: please inquire
PBL38772/1SOA
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
TH72035.2
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
AZCAN1040T.RDG
Amazing Microelectronic Corp
Package:Interface - Telecom
Price: please inquire
