The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
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- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Neg Supply Voltage-Nom | Linear Coding | Crystal Frequency | Fax Rate | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MSM6963RS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | LAPIS SEMICONDUCTOR CO LTD | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | COMMERCIAL | 11 mA | PCM CODEC | YES | A-LAW | -5 V | NOT AVAILABLE | |||||||||||||||
| Mfr Part No MSM6963RS | OKI Electric Industry Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | OKI ELECTRIC INDUSTRY CO LTD | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | Not Qualified | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 4.55 mm | PCM CODEC | YES | A-LAW | -5 V | 19.1 mm | 7.62 mm | ||||||||||||||
| Mfr Part No RFFM8500SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | Transferred | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 0.5 mm | unknown | S-PQCC-N16 | Not Qualified | INDUSTRIAL | 260 mA | ||||||||||||||||||||||
| Mfr Part No MX165CLH | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | CML MICROCIRCUITS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC24,.44SQ | LDCC24,.44SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 3.3 V | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 24 | S-PQCC-J24 | Not Qualified | INDUSTRIAL | 0.0042 mA | 3.7 mm | TELECOM CIRCUIT | 10 mm | 10 mm | ||||||||||||||||
| Mfr Part No R8071J | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | Not Qualified | COMMERCIAL | 47.6 mA | |||||||||||||||||||||
| Mfr Part No QN9022 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 2016-04-14 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3 V | QUAD | NO LEAD | 1 | 0.4 mm | unknown | S-PQCC-N40 | INDUSTRIAL | 0.9 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||||||||||||
| Mfr Part No SX1308IMLTRT-CUT | Semtech Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IDT82V3355TF | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | compliant | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 1.4 mm | TELECOM CIRCUIT | 10 mm | 10 mm | |||||||||||||
| Mfr Part No SY8702AABC | Silergy Corporation | Datasheet | 244640 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SA1620BE | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP48,.35SQ,20 | QFP48,.35SQ,20 | SQUARE | FLATPACK | Transferred | No | 3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G48 | Not Qualified | INDUSTRIAL | |||||||||||||||||||||
| Mfr Part No BCM3022KPF | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RFX96V12 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QFP | QFP, LDCC68,1.0SQ | LDCC68,1.0SQ | RECTANGULAR | FLATPACK | Transferred | QFP | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | COMMERCIAL | 119 mA | 9 Mbps | 2.3 mm | MODEM-DATA/FAX/VOICE | 9.6 kbps | 20 mm | 14 mm | |||||||||||
| Mfr Part No TXC-03108AIBG | Tri-Star Electronics International | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MH88634T-2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 21 | MICROSEMI CORP | 70 °C | PLASTIC/EPOXY | SIP21H,.6 | Transferred | No | 5 V | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | Not Qualified | COMMERCIAL | 13 mA | -5 V | ||||||||||||||||||||||||||||
| Mfr Part No MH88634T-2 | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 21 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | , SIP21H,.6 | SIP21H,.6 | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | Not Qualified | COMMERCIAL | 0.013 mA | -5 V | |||||||||||||||||||||||||
 | Mfr Part No PEB3035NV1.1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | SIEMENS A G | 85 °C | PLASTIC/EPOXY | , | RECTANGULAR | CHIP CARRIER | Transferred | QLCC | 5 V | 8542.39.00.01 | QUAD | J BEND | 1 | unknown | 28 | R-PQCC-J28 | Not Qualified | OTHER | TELECOM CIRCUIT | ||||||||||||||||||||||||
 | Mfr Part No PBL38541/1N | Ericsson | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | ERICSSON POWER MODULES AB | 1 | 70 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 2.2 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-PDIP-T18 | Not Qualified | OTHER | 5.33 mm | TELEPHONE SPEECH CIRCUIT | 22.48 mm | 7.62 mm | ||||||||||||||||
| Mfr Part No HT9312B | Holtek Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 22 | HOLTEK SEMICONDUCTOR INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP22(UNSPEC) | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T22 | Not Qualified | COMMERCIAL | 2 mA | 3.58 MHz | |||||||||||||||||||||
| Mfr Part No SIW1711FIF | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | MLF | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 1.8 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 0.9 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||||||
| Mfr Part No NE5750N | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT |
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MSM6963RS
LAPIS Semiconductor Co Ltd
Package:Interface - Telecom
Price: please inquire
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MSM6963RS
OKI Electric Industry Co Ltd
Package:Interface - Telecom
Price: please inquire
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RFFM8500SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
MX165CLH
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
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R8071J
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
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QN9022
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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SX1308IMLTRT-CUT
Semtech Corporation
Package:Interface - Telecom
Price: please inquire
-
IDT82V3355TF
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
-
SY8702AABC
Silergy Corporation
Package:Interface - Telecom
Price: please inquire
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SA1620BE
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
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BCM3022KPF
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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RFX96V12
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
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TXC-03108AIBG
Tri-Star Electronics International
Package:Interface - Telecom
Price: please inquire
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MH88634T-2
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
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MH88634T-2
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
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PEB3035NV1.1
Siemens
Package:Interface - Telecom
Price: please inquire
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PBL38541/1N
Ericsson
Package:Interface - Telecom
Price: please inquire
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HT9312B
Holtek Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
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SIW1711FIF
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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NE5750N
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire