The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Crystal Frequency | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No RF8889A | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 26 | RF MICRO DEVICES INC | 90 °C | -30 °C | UNSPECIFIED | HQCCN | HQCCN, | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | Transferred | 2.75 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | unknown | R-XQCC-N26 | OTHER | 0.9 mm | RF AND BASEBAND CIRCUIT | 3.8 mm | 3 mm | ||||||||||||||||
![]() | Mfr Part No HT9302F | Holtek Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | HOLTEK SEMICONDUCTOR INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP18(UNSPEC) | DIP18(UNSPEC) | RECTANGULAR | IN-LINE | Active | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T18 | Not Qualified | COMMERCIAL | 2 mA | 3.58 MHz | |||||||||||||||
![]() | Mfr Part No RFFM8200SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | Transferred | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 0.5 mm | unknown | S-PQCC-N16 | Not Qualified | INDUSTRIAL | 230 mA | ||||||||||||||||
![]() | Mfr Part No STSAFA110DFALF01 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No L9000230-01 | TE Connectivity | Datasheet | 16 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SI3230M-KT | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | SILICON LABORATORIES INC | , | Obsolete | No | unknown | SLIC | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No HA16820NT | Hitachi Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 30 | HITACHI LTD | 70 °C | -20 °C | PLASTIC/EPOXY | SDIP | SDIP, SDIP30,.4 | SDIP30,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | Obsolete | DIP | No | 7.8 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 1.778 mm | unknown | 30 | R-PDIP-T30 | Not Qualified | COMMERCIAL | 0.12 mA | 5.06 mm | TELEPHONE MULTIFUNCTION CIRCUIT | 27.1 mm | 10.16 mm | |||||||
![]() | Mfr Part No L3240B1 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | STMICROELECTRONICS | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | COMMERCIAL | 5.08 mm | TELEPHONE RINGER CIRCUIT | 7.62 mm | ||||||||||||||
![]() | Mfr Part No PSB2196H | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | QFP | PLASTIC, MQFP-44 | SQUARE | FLATPACK | Obsolete | QFP | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | not_compliant | 44 | S-PQFP-G44 | Not Qualified | COMMERCIAL | 2.45 mm | ISDN CONTROLLER | 10 mm | 10 mm | ||||||||||
![]() | Mfr Part No RS8953SPBEPF | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | CONEXANT SYSTEMS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP-80 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 3.3 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | compliant | 80 | R-PQFP-G80 | Not Qualified | INDUSTRIAL | 21.1 mA | 1168 Mbps | 3.1 mm | FRAMER | 20 mm | 14 mm | |||||
![]() | Mfr Part No BCM5382M | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | BROADCOM CORP | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.2 V | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 324 | S-PBGA-B324 | Not Qualified | ETHERNET SWITCH | ||||||||||||||||||
![]() | Mfr Part No MC33742EGR2 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | FREESCALE SEMICONDUCTOR INC | 3 | Obsolete | Yes | e3 | MATTE TIN | 260 | unknown | 40 | ||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM20736A0KML2G | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | INFINEON TECHNOLOGIES AG | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | QFN-32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 1.2 V | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-XQCC-N32 | OTHER | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||||||
![]() | Mfr Part No EHV62-H36B1 | TDK Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 2 | TDK CORP | 125 °C | -40 °C | UNSPECIFIED | ROHS COMPLIANT, PACKAGE-2 | ROUND | LONG FORM | Active | 8542.39.00.01 | AXIAL | WIRE | 1 | unknown | O-XALF-W2 | AUTOMOTIVE | GAS DISCHARGE TUBE SUPPRESSOR | |||||||||||||||||||||
![]() | Mfr Part No MC34014FN | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | MOTOROLA INC | 60 °C | -20 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC20,.4SQ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | No | e0 | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | S-PQCC-J20 | Not Qualified | COMMERCIAL | 4.57 mm | TELEPHONE SPEECH CIRCUIT | 8.965 mm | 8.965 mm | |||||||||||
![]() | Mfr Part No TISP61060D | Power Innovations International, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | POWER INNOVATIONS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 1.75 mm | SURGE PROTECTION CIRCUIT | 4.9 mm | 3.9 mm | |||||||||||||||
![]() | Mfr Part No TISP61060D | Bourns Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | BOURNS INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | 8 | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 1.75 mm | SURGE PROTECTION CIRCUIT | 4.9 mm | 3.905 mm | ||||||||||
![]() | Mfr Part No SK70708PE | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | INTEL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5 V | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 1168 Mbps | 4.57 mm | DIGITAL SLIC | 16.5862 mm | 16.5862 mm | ||||||||||
![]() | Mfr Part No MDBT42Q-PAT | Raytec Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM7100 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM CORP | , | Obsolete | No | compliant |
RF8889A
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
HT9302F
Holtek Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
RFFM8200SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
STSAFA110DFALF01
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
L9000230-01
TE Connectivity
Package:Interface - Telecom
Price: please inquire
SI3230M-KT
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
HA16820NT
Hitachi Ltd
Package:Interface - Telecom
Price: please inquire
L3240B1
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
PSB2196H
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
RS8953SPBEPF
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
BCM5382M
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
MC33742EGR2
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
BCM20736A0KML2G
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
EHV62-H36B1
TDK Corporation
Package:Interface - Telecom
Price: please inquire
MC34014FN
Motorola Semiconductor Products
Package:Interface - Telecom
Price: please inquire
TISP61060D
Power Innovations International, Inc.
Package:Interface - Telecom
Price: please inquire
TISP61060D
Bourns Inc
Package:Interface - Telecom
Price: please inquire
SK70708PE
Intel Corporation
Package:Interface - Telecom
Price: please inquire
MDBT42Q-PAT
Raytec Corporation
Package:Interface - Telecom
Price: please inquire
BCM7100
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
