The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
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- Part Status
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- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Screening Level | Telecom IC Type | Neg Supply Voltage-Nom | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No SIW3500GIG3SR | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 96 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | compliant | 96 | S-PBGA-B96 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 6 mm | 6 mm | |||||||
![]() | Mfr Part No TH7122ENE | Melexis Microelectronic Integrated Systems | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | MELEXIS N V | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP32,.35SQ,32 | QFP32,.35SQ,32 | SQUARE | FLATPACK | Obsolete | Yes | 3 V | e3 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | compliant | S-PQFP-G32 | Not Qualified | INDUSTRIAL | 32.7 mA | ||||||||||||
![]() | Mfr Part No TA31002 | Unisonic Technologies Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | UNISONIC TECHNOLOGIES CO LTD | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Active | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T8 | Not Qualified | INDUSTRIAL | ||||||||||||||||||
![]() | Mfr Part No TP3040AJ-1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | NATIONAL SEMICONDUCTOR CORP | 125 °C | -25 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | Not Qualified | OTHER | 6.4 mA | 5.08 mm | TELECOM CIRCUIT | -5 V | 19.43 mm | 7.62 mm | |||||||
![]() | Mfr Part No PEB2260NV2.1 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 88W8388V-BDK1 | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TA31031P | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Active | DIP | No | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 20 | R-PDIP-T20 | Not Qualified | INDUSTRIAL | 4.45 mm | TELEPHONE SPEECH CIRCUIT | 24.6 mm | 7.62 mm | |||||||
![]() | Mfr Part No HA16841MA | Hitachi Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | HITACHI LTD | 70 °C | -20 °C | PLASTIC/EPOXY | QFI | QFI, | RECTANGULAR | FLATPACK | Obsolete | QFI | No | 3 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | BUTT | 1 | 0.762 mm | unknown | 44 | R-PQFP-B44 | Not Qualified | COMMERCIAL | 16 mA | 2.4 mm | TELECOM CIRCUIT | 10.8 mm | 10 mm | ||||||
![]() | Mfr Part No TEA1069H | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.5SQ,32 | QFP44,.5SQ,32 | SQUARE | FLATPACK | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | unknown | S-PQFP-G44 | Not Qualified | OTHER | ||||||||||||||
![]() | Mfr Part No LTC1757-1EMS8 | Linear Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | LINEAR TECHNOLOGY CORP | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | not_compliant | R-PDSO-G8 | Not Qualified | OTHER | TELECOM CIRCUIT | ||||||||||||||
![]() | Mfr Part No RTL8201CP-VD | Realtek Semiconductor | Datasheet | 4160 | - | Min: 1 Mult: 1 | YES | 48 | REALTEK SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | LFQFP | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026BBC, LQFP-48 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | S-PQFP-G48 | COMMERCIAL | 1.7 mm | MANCHESTER ENCODER/DECODER | 7 mm | 7 mm | ||||||||||||||
![]() | Mfr Part No PEB8090HV1.1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | SIEMENS A G | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Transferred | 8542.39.00.01 | QUAD | GULL WING | 1 | unknown | S-PQFP-G64 | Not Qualified | TELECOM CIRCUIT | |||||||||||||||||||||
![]() | Mfr Part No PT7A9085J | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | PERICOM SEMICONDUCTOR CORP | 70 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 1 | unknown | 68 | S-PQCC-J68 | Not Qualified | OTHER | 50 mA | TELECOM CIRCUIT | ||||||||||
![]() | Mfr Part No SL5019P | Kodenshi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | KODENSHI AUK CORP | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | 4 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | COMMERCIAL | 4.8 mA | |||||||||||||||
![]() | Mfr Part No BCM3350KPP | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM INC | , | Active | compliant | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No PEB3394EV1.3 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC9270D | Hangzhou Silan Microelectronics CO LTD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | Yes | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | R-PDIP-T18 | Not Qualified | INDUSTRIAL | 7 mA | DTMF SIGNALING CIRCUIT | ||||||||||||
![]() | Mfr Part No LAN9303-ABZJ-TR | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | MICROCHIP TECHNOLOGY INC | 70 °C | UNSPECIFIED | HVQCCN | VQFN-56 | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 3.3 V | EAR99 | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-XQCC-N56 | COMMERCIAL | 1 mm | TS 16949 | ETHERNET SWITCH | 8 mm | 8 mm | ||||||||||
![]() | Mfr Part No ADL5360XCPZ-WP | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | ANALOG DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 6 X 6 MM, LFCSP-36 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 36 | S-XQCC-N36 | Not Qualified | INDUSTRIAL | 1 mm | RF FRONT END CIRCUIT | 6 mm | 6 mm | |||||||||
![]() | Mfr Part No PSB8510-1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 |
SIW3500GIG3SR
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
TH7122ENE
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
TA31002
Unisonic Technologies Co Ltd
Package:Interface - Telecom
Price: please inquire
TP3040AJ-1
Texas Instruments
Package:Interface - Telecom
Price: please inquire
PEB2260NV2.1
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
88W8388V-BDK1
Marvell Technology Group Ltd
Package:Interface - Telecom
Price: please inquire
TA31031P
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
HA16841MA
Hitachi Ltd
Package:Interface - Telecom
Price: please inquire
TEA1069H
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
LTC1757-1EMS8
Linear Technology
Package:Interface - Telecom
Price: please inquire
RTL8201CP-VD
Realtek Semiconductor
Package:Interface - Telecom
Price: please inquire
PEB8090HV1.1
Siemens
Package:Interface - Telecom
Price: please inquire
PT7A9085J
Pericom Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
SL5019P
Kodenshi Corporation
Package:Interface - Telecom
Price: please inquire
BCM3350KPP
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
PEB3394EV1.3
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
SC9270D
Hangzhou Silan Microelectronics CO LTD
Package:Interface - Telecom
Price: please inquire
LAN9303-ABZJ-TR
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
ADL5360XCPZ-WP
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
PSB8510-1
Siemens
Package:Interface - Telecom
Price: please inquire
