The category is 'Interface - Telecom'
Interface - Telecom (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Applications | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Neg Supply Voltage-Nom | Length | Width |
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![]() | Mfr Part No RFFM6401SR | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Transferred | 3.6 V | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | 1 | unknown | R-XBGA-B28 | INDUSTRIAL | 1.25 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||||||||||||||||||
![]() | Mfr Part No ACS8526 | Semtech Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | SEMTECH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP64,.47SQ,20 | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | No | TIN LEAD | SDH; SONET | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 1.6 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 10 mm | 10 mm | |||||||||
![]() | Mfr Part No MSM6955GS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | LAPIS SEMICONDUCTOR CO LTD | 70 °C | PLASTIC/EPOXY | QFF | QFF, QFL44,.37X.4,32 | QFL44,.37X.4,32 | RECTANGULAR | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | FLAT | 0.8 mm | unknown | R-PQFP-F44 | Not Qualified | COMMERCIAL | |||||||||||||||||||
![]() | Mfr Part No ADN2809XCP | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | ANALOG DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | VQCCN | 7 X 7 MM, LFCSP-48 | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | QFN | No | 3.3 V | e0 | 5A991.B.3 | TIN LEAD | SDH; SONET | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 48 | S-PQCC-N48 | Not Qualified | INDUSTRIAL | 0.38 mA | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 7 mm | 7 mm | ||||||||
![]() | Mfr Part No TISP61089B | Bourns Inc | Datasheet | 138 | - | Min: 1 Mult: 1 | 2019-08-19 | BOURNS INC | , | Active | 8542.39.00.01 | unknown | SURGE PROTECTION CIRCUIT | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RFMD2080TR7 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC32,.2SQ,20 | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | 5A991.G | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 0.95 mm | MODEM-MODULATOR | 5 mm | 5 mm | ||||||||||||
![]() | Mfr Part No TCM1501BP | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | TEXAS INSTRUMENTS INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T8 | Not Qualified | COMMERCIAL | 0.0013 mA | 5.08 mm | TELEPHONE RINGER CIRCUIT | 9.81 mm | 7.62 mm | ||||||||||||
![]() | Mfr Part No AD8315ACHIPS | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | ANALOG DEVICES INC | UNSPECIFIED | DIE | DIE, | RECTANGULAR | UNCASED CHIP | Active | DIE | 2.7 V | 8542.39.00.01 | UPPER | NO LEAD | 1 | compliant | R-XUUC-N | Not Qualified | TELECOM CIRCUIT | ||||||||||||||||||||||||
![]() | Mfr Part No RFFC2072SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | Yes | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | ||||||||||
![]() | Mfr Part No FX613P | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 14 | CML MICROCIRCUITS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 3.3 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | 14 | R-PDIP-T14 | Not Qualified | INDUSTRIAL | 30 mA | TONE DECODER CIRCUIT | ||||||||||||||||||
![]() | Mfr Part No TA31025N | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | TOSHIBA CORP | 85 °C | -30 °C | PLASTIC/EPOXY | SDIP | SDIP, | RECTANGULAR | IN-LINE, SHRINK PITCH | Active | DIP | No | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 1.778 mm | unknown | 24 | R-PDIP-T24 | Not Qualified | OTHER | 4.5 mm | TELEPHONE SPEECH CIRCUIT | 22 mm | 7.62 mm | ||||||||||||
![]() | Mfr Part No BGS8L2 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | BCC | BCC, | RECTANGULAR | CHIP CARRIER | Not Recommended | 1.8 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.4 mm | unknown | R-PBCC-B6 | INDUSTRIAL | 0.4 mm | RF FRONT END CIRCUIT | 1.1 mm | 0.7 mm | ||||||||||||||||||
![]() | Mfr Part No TCA3383A-DP | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | MOTOROLA INC | 60 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.2 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | COMMERCIAL | 5.08 mm | TELEPHONE SPEECH CIRCUIT | 36.83 mm | 15.24 mm | |||||||||||||
![]() | Mfr Part No TCA3383A-DP | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.2 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | 5.2 V | COMMERCIAL | |||||||||||||||||||
![]() | Mfr Part No AW-CU300 | AzureWave Technologies | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SIW3500GIG3 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 96 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | compliant | 96 | S-PBGA-B96 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||||||||||||
![]() | Mfr Part No RFPA3807PCK-410 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | HSOP | HSOP, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | Transferred | 5 V | 5B991 | 9030.82.00.00 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | INDUSTRIAL | 1.8288 mm | RF AND BASEBAND CIRCUIT | 4.8895 mm | 3.8989 mm | |||||||||||||||||
![]() | Mfr Part No PEB2465H | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TH72036 | Melexis Microelectronic Integrated Systems | Datasheet | 4000 | - | Min: 1 Mult: 1 | YES | 10 | MELEXIS N V | 125 °C | -40 °C | UNSPECIFIED | HVSON | HVSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3 V | e3 | MATTE TIN | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | Not Qualified | AUTOMOTIVE | 1 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||||||||||||
![]() | Mfr Part No SC11004CN | Sierra Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | SIERRA SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 1 Mbps | MODEM | -5 V |
RFFM6401SR
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
ACS8526
Semtech Corporation
Package:Interface - Telecom
Price: please inquire
MSM6955GS
LAPIS Semiconductor Co Ltd
Package:Interface - Telecom
Price: please inquire
ADN2809XCP
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
TISP61089B
Bourns Inc
Package:Interface - Telecom
Price: please inquire
RFMD2080TR7
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
TCM1501BP
Texas Instruments
Package:Interface - Telecom
Price: please inquire
AD8315ACHIPS
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
RFFC2072SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
FX613P
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
TA31025N
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
BGS8L2
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TCA3383A-DP
Motorola Semiconductor Products
Package:Interface - Telecom
Price: please inquire
TCA3383A-DP
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
AW-CU300
AzureWave Technologies
Package:Interface - Telecom
Price: please inquire
SIW3500GIG3
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
RFPA3807PCK-410
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
PEB2465H
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
TH72036
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
SC11004CN
Sierra Semiconductor
Package:Interface - Telecom
Price: please inquire
