The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Filter | Companding Law | Neg Supply Voltage-Nom | Standard | Gain Tolerance-Max | Linear Coding | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MAS7838N | Micro Analog Systems Oy | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MICRO ANALOG SYSTEMS OY | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | COMMERCIAL | 6 mA | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No SKY66111-11-R | Skyworks Solutions Inc | Datasheet | 2800 | - | Min: 1 Mult: 1 | YES | 20 | SKYWORKS SOLUTIONS INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | MCM-20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | 3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.25 mm | unknown | R-XQCC-N20 | INDUSTRIAL | 0.9 mm | TELECOM CIRCUIT | 3.3 mm | 3 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No UJA1169ATK | NXP Semiconductors | Datasheet | 65884 | - | Min: 1 Mult: 1 | YES | 20 | NXP SEMICONDUCTORS | PLASTIC/EPOXY | HVSON | HVSON-20 | SOLCC20,.14,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 13 V | DUAL | NO LEAD | 1 | 0.5 mm | compliant | R-PDSO-N20 | 67 mA | 15000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 5.5 mm | 3.5 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No TCM29C16ADWR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | No | FULL DUPLEX | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | not_compliant | NOT SPECIFIED | R-PDSO-G16 | Not Qualified | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 9 mA | 2.65 mm | PCM CODEC | YES | MU-LAW | -5 V | 0.08 dB | NOT AVAILABLE | 10.3 mm | 7.5 mm | |||||||||||||||||
![]() | Mfr Part No STEL-2000A 45/CR | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | INTEL CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP100,.7X.9 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Active | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.635 mm | compliant | R-PQFP-G100 | Not Qualified | COMMERCIAL | 380 mA | ||||||||||||||||||||||||||||||
![]() | Mfr Part No RCV336DPFL/SP | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP100,.7X.9 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.635 mm | compliant | R-PQFP-G100 | Not Qualified | COMMERCIAL | 136 mA | MODEM | |||||||||||||||||||||||||||||
![]() | Mfr Part No RFFM6403SR | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, LCC28,.24SQ,28 | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | Yes | 3.6 V | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | NOT SPECIFIED | 1 | 0.7 mm | compliant | NOT SPECIFIED | S-XBGA-B28 | Not Qualified | INDUSTRIAL | 1.05 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||||||||||||||||||||||||
![]() | Mfr Part No S20-A140X | TDK Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 2 | TDK CORP | 90 °C | -40 °C | UNSPECIFIED | , | RECTANGULAR | SPECIAL SHAPE | Active | Yes | DUAL | UNSPECIFIED | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | R-XDSS-X2 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TEA1068T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | NXP SEMICONDUCTORS | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 20 | R-PDSO-G20 | Not Qualified | COMMERCIAL EXTENDED | 0.0013 mA | 2.65 mm | TELEPHONE SPEECH CIRCUIT | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No TEA1068T | Philips Semiconductors | Datasheet | 2896 | - | Min: 1 Mult: 1 | YES | 20 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | OTHER | 1.3 mA | ||||||||||||||||||||||||||||||
![]() | Mfr Part No RF1201 | RF Micro Devices Inc | Datasheet | 15264 | - | Min: 1 Mult: 1 | YES | 6 | RF MICRO DEVICES INC | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 2.65 V | 5A991.G | 8541.29.00.75 | QUAD | NO LEAD | 1 | 0.65 mm | unknown | 6 | S-XQCC-N6 | Not Qualified | OTHER | 0.9 mm | RF AND BASEBAND CIRCUIT | 2 mm | 2 mm | |||||||||||||||||||||||||
![]() | Mfr Part No SI4743-C10-AM | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | SILICON LABORATORIES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 4 X 4 MM, 0.825 MM HEIGHT, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-XQCC-N24 | INDUSTRIAL | 0.9 mm | AEC-Q100 | TELECOM CIRCUIT | 4 mm | 4 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No ICS1893BK | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | INTEGRATED DEVICE TECHNOLOGY INC | MLF | 3 | 70 °C | PLASTIC/EPOXY | HVQCCN | 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 3.3 V | e0 | No | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | NO LEAD | 240 | 1 | 0.5 mm | not_compliant | 30 | 56 | S-PQCC-N56 | Not Qualified | COMMERCIAL | 0.16 mA | 100000 Mbps | 1 mm | INTERFACE CIRCUIT | 1 | 8 mm | 8 mm | ||||||||||||||||
![]() | Mfr Part No SARA-U280-00S-01 | u-blox AG | Datasheet | 2 | - | Min: 1 Mult: 1 | YES | 96 | U-BLOX AG | 4 | 55 °C | -20 °C | UNSPECIFIED | BCC | PACKAGE-96 | RECTANGULAR | CHIP CARRIER | Obsolete | Yes | 3.8 V | ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V | 8542.39.00.01 | BOTTOM | BUTT | 1 | unknown | R-XBCC-B96 | COMMERCIAL | 3.25 mm | TELECOM CIRCUIT | 26 mm | 16 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No INT5200 | Qualcomm | Datasheet | - | - | Min: 1 Mult: 1 | QUALCOMM INC | , | Contact Manufacturer | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TXC-05870AIBG | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.5 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | 27 mm | 27 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No TISP61060P | Bourns Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | BOURNS INC | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | NOT SPECIFIED | 8 | R-PDIP-T8 | Not Qualified | INDUSTRIAL | 5.08 mm | SURGE PROTECTION CIRCUIT | 9.5 mm | 7.62 mm | |||||||||||||||||||||||||
![]() | Mfr Part No UPD72103LP | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT8931BE | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | ZARLINK SEMICONDUCTOR INC | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | INDUSTRIAL | 192 Mbps | 6.35 mm | DIGITAL SLIC | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.4 V | 37.4 mm | 10.16 mm | ||||||||||||||||||
![]() | Mfr Part No PMB2200T | Siemens | Datasheet | - | - | Min: 1 Mult: 1 |
MAS7838N
Micro Analog Systems Oy
Package:Interface - Telecom
Price: please inquire
SKY66111-11-R
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
UJA1169ATK
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TCM29C16ADWR
Texas Instruments
Package:Interface - Telecom
Price: please inquire
STEL-2000A 45/CR
Intel Corporation
Package:Interface - Telecom
Price: please inquire
RCV336DPFL/SP
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
RFFM6403SR
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
S20-A140X
TDK Corporation
Package:Interface - Telecom
Price: please inquire
TEA1068T
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TEA1068T
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
RF1201
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
SI4743-C10-AM
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
ICS1893BK
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
SARA-U280-00S-01
u-blox AG
Package:Interface - Telecom
Price: please inquire
INT5200
Qualcomm
Package:Interface - Telecom
Price: please inquire
TXC-05870AIBG
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
TISP61060P
Bourns Inc
Package:Interface - Telecom
Price: please inquire
UPD72103LP
NEC Electronics Group
Package:Interface - Telecom
Price: please inquire
MT8931BE
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
PMB2200T
Siemens
Package:Interface - Telecom
Price: please inquire
