The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Carrier Type (2) | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Supply Current-Max | Seated Height-Max | Screening Level | Telecom IC Type | Neg Supply Voltage-Nom | Carrier Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No S2070B | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | APPLIED MICRO CIRCUITS CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP64,.66SQ,32 | QFP64,.66SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 64 | S-PQFP-G64 | Not Qualified | COMMERCIAL | 235 mA | 2.35 mm | ETHERNET TRANSCEIVER | 14 mm | 14 mm | |||||||||||||||
 | Mfr Part No ZL50402GDG | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | CONEXANT SYSTEMS | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | NOT SPECIFIED | 208 | S-PBGA-B208 | Not Qualified | INDUSTRIAL | 1.4 mm | LAN SWITCHING CIRCUIT | 17 mm | 17 mm | ||||||||||||||
| Mfr Part No ZL50402GDG | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | ZARLINK SEMICONDUCTOR INC | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Transferred | BGA | No | 1.8 V | e0 | No | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 208 | S-PBGA-B208 | Not Qualified | INDUSTRIAL | 1.4 mm | LAN SWITCHING CIRCUIT | 17 mm | 17 mm | ||||||||||||
| Mfr Part No TM266FCA1 | Pulse Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | PULSE ELECTRONICS CORP | 1 | 125 °C | -55 °C | UNSPECIFIED | SSOP | SSOP, SOP28,.76 | SOP28,.76 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Active | QFP | No | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.65 mm | compliant | 28 | R-XDSO-G28 | Not Qualified | MILITARY | 3.81 mm | TELECOM CIRCUIT | |||||||||||||||
| Mfr Part No HM9110C | Hualon Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | HUALON MICROELECTRONICS CORP | , | Contact Manufacturer | unknown | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LXT360LE | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | T-1(DS1) | INTEL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP44,.47SQ,32 | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Transferred | QFP | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 44 | S-PQFP-G44 | Not Qualified | INDUSTRIAL | 1.6 mm | PCM TRANSCEIVER | CEPT PCM-30/E-1 | 10 mm | 10 mm | ||||||||||
 | Mfr Part No BCM3416 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | BROADCOM CORP | PLASTIC/EPOXY | QFP | QFP, | UNSPECIFIED | FLATPACK | Obsolete | QFP | No | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | compliant | 48 | X-PQFP-G48 | Not Qualified | TELECOM CIRCUIT | ||||||||||||||||||||||
 | Mfr Part No RS8235 | Mindspeed Technologies Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | MINDSPEED TECHNOLOGIES INC | 85 °C | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 3.3 V | No | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 208 | S-PQFP-G208 | Not Qualified | OTHER | 4.1 mm | ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE | 28 mm | 28 mm | |||||||||||||
| Mfr Part No PT7A8952J | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | PERICOM SEMICONDUCTOR CORP | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | RECTANGULAR | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 28 | R-PQCC-J28 | Not Qualified | INDUSTRIAL | 3.86 mm | ISDN CONTROLLER | 11.53 mm | 11.53 mm | ||||||||||
| Mfr Part No BCM8011 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | BROADCOM LTD | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 324 | S-PBGA-B324 | Not Qualified | ETHERNET TRANSCEIVER | |||||||||||||||||||||||
| Mfr Part No AWT5008Q7 | Coherent Thermal Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | II-VI INC | 3 | PLASTIC/EPOXY | HVSON | 3 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, SMT-10 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | Yes | 3.4 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.6 mm | unknown | S-PDSO-N10 | 1 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||||||||||||||||||||
| Mfr Part No LAN9311-NZW-TR | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | MICROCHIP TECHNOLOGY INC | 3 | 70 °C | PLASTIC/EPOXY | TFQFP | HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, XVTQFP-128 | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Yes | 3.3 V | e3 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.4 mm | compliant | S-PQFP-G128 | Not Qualified | COMMERCIAL | 295 mA | 1.2 mm | TS 16949 | ETHERNET SWITCH | 14 mm | 14 mm | |||||||||||
| Mfr Part No PMB6270 | Infineon Technologies AG | Datasheet | 7999 | - | Min: 1 Mult: 1 | INFINEON TECHNOLOGIES AG | , | Obsolete | unknown | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TXC-04011-BIPQ | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 120 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 120 | S-PQFP-G120 | Not Qualified | INDUSTRIAL | 175 mA | 4.1 mm | TELECOM CIRCUIT | 28 mm | 28 mm | |||||||||||||||
| Mfr Part No OQ2541HPB-S | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 48 | S-PQFP-G48 | Not Qualified | INDUSTRIAL | 1.6 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | -3.3 V | 7 mm | 7 mm | ||||||||||||||||
 | Mfr Part No SE5008L | Skyworks Solutions Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | SKYWORKS SOLUTIONS INC | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 16 | S-XQCC-N16 | INDUSTRIAL | 0.9 mm | TELECOM CIRCUIT | 3 mm | 3 mm | |||||||||||||||
| Mfr Part No MRFIC0001 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP20,.25 | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G20 | Not Qualified | 3/5 V | OTHER | 12 mA | |||||||||||||||||||
| Mfr Part No TISP61CAP3P | Power Innovations International, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | POWER INNOVATIONS LTD | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Transferred | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | Not Qualified | 5.08 mm | SURGE PROTECTION CIRCUIT | 7.62 mm | |||||||||||||||||||||||
 | Mfr Part No TISP61CAP3P | Bourns Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | BOURNS INC | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | not_compliant | NOT SPECIFIED | 8 | R-PDIP-T8 | Not Qualified | SURGE PROTECTION CIRCUIT | |||||||||||||||||||||
| Mfr Part No TSOT0410G14 | Avago Technologies | Datasheet | - | - | Min: 1 Mult: 1 | YES | 600 | AVAGO TECHNOLOGIES INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | 2.5 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.27 mm | unknown | 30 | S-PBGA-B600 | Not Qualified | INDUSTRIAL | 3.05 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 45 mm | 45 mm |
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S2070B
Applied Micro Circuits Corporation
Package:Interface - Telecom
Price: please inquire
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ZL50402GDG
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
ZL50402GDG
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
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TM266FCA1
Pulse Electronics Corporation
Package:Interface - Telecom
Price: please inquire
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HM9110C
Hualon Microelectronics Corp
Package:Interface - Telecom
Price: please inquire
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LXT360LE
Intel Corporation
Package:Interface - Telecom
Price: please inquire
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BCM3416
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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RS8235
Mindspeed Technologies Inc
Package:Interface - Telecom
Price: please inquire
-
PT7A8952J
Pericom Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
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BCM8011
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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AWT5008Q7
Coherent Thermal Solutions
Package:Interface - Telecom
Price: please inquire
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LAN9311-NZW-TR
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
-
PMB6270
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
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TXC-04011-BIPQ
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
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OQ2541HPB-S
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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SE5008L
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
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MRFIC0001
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
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TISP61CAP3P
Power Innovations International, Inc.
Package:Interface - Telecom
Price: please inquire
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TISP61CAP3P
Bourns Inc
Package:Interface - Telecom
Price: please inquire
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TSOT0410G14
Avago Technologies
Package:Interface - Telecom
Price: please inquire