The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of External Interrupts | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No OMAP3503ECBC | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 600MHz | OMAP3503 | 515 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1012AXN7HKB | NXP USA Inc. | Datasheet | 196 |
| Min: 1 Mult: 1 | 24 Weeks | 211-VFLGA | -40°C~105°C | 2016 | QorIQ® Layerscape | Active | 3 (168 Hours) | 800MHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TA80C188XL20 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 99 Weeks | Through Hole | 68 | 20MHz | Bulk | 1996 | Discontinued | 68 | 3A991.A.2 | 85°C | -40°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 20MHz | 68 | 5V | 5V | INDUSTRIAL | 5V | 5.5V | 4.5V | MICROPROCESSOR | 90mA | 16 | 20 μs | 20 | NO | YES | 8 | FIXED POINT | NO | 0 | 5 | 2 | 5.21mm | 29.464mm | 29.464mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1023AXN7MQB | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | 621-FBGA, FCBGA | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OMAPL137BZKBT3 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA | 256 | -40°C~125°C TJ | Tray | OMAP-L1x | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 375MHz | OMAPL137 | 256 | 1.2V | 1.32V | 1.32V | 1.14V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 13 | YES | YES | 16 | FLOATING POINT | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | LCD | 2.05mm | 17mm | ROHS3 Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LS1023AXN8MQB | NXP USA Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1043ASN8MQB | NXP USA Inc. | Datasheet | 96 |
| Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | Active | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TN80C186EB13 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | LCC | 85°C | -40°C | Bulk | e0 | 84 | 3A991.A.2 | Tin/Lead (Sn/Pb) | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | QUAD | J BEND | NOT SPECIFIED | 5V | 1.27mm | 13MHz | NOT SPECIFIED | 84 | S-PQCC-J84 | Not Qualified | 5V | INDUSTRIAL | 5V | MICROPROCESSOR | 73mA | 16 | 13 μs | 20 | NO | YES | 16 | FIXED POINT | NO | 0 | 2 | 6 | 4.83mm | 29.3116mm | 29.3116mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC7448HX600ND | NXP USA Inc. | Datasheet | 1722 |
| Min: 1 Mult: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.05V | 1.31.8/2.5V | 0.95V | 600MHz | MICROPROCESSOR, RISC | PowerPC G4 | 600MHz | 32 | NO | YES | FIXED POINT | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | 2.8mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1026AXE8MQA | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | -40°C~105°C | Tray | QorIQ® Layerscape | Active | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | S-PBGA-B780 | 0.93V | 0.87V | 1.2GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 2 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No Z84C0006PEC | Zilog | Datasheet | 412 | - | Min: 1 Mult: 1 | Through Hole | 40-DIP (0.620, 15.75mm) | 40 | -40°C~100°C TA | Tube | 2000 | Z80 | e0 | no | Obsolete | 1 (Unlimited) | 40 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | DRAM REFRESH COUNTER | 8542.31.00.01 | DUAL | 5V | 2.54mm | 6MHz | Z84C00 | 40 | 5V | 5V | 5V | 64kB | 6.17 MHz | MICROPROCESSOR | 8 | 6 μs | 8b | 16 | Z8 | NO | YES | FIXED POINT | NO | 0 | 5.0V | 1 Core 8-Bit | No | 2 | 4.75mm | 52.325mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8378VRALG | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2008 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No R8A77220AC266BGV | Renesas Electronics America | Datasheet | 116 | - | Min: 1 Mult: 1 | 16 Weeks | 449-FBGA | ROMless | 184 | -20°C~75°C TA | Tray | Obsolete | 3 (168 Hours) | 266MHz | R8A77220 | I2C, IrDA, SCI, USB | External | SH-4AL-DSP | DMA, LCD, PWM, WDT | 3.30V | 1 Core 32-Bit | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No T1013NSE7MQA | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 18 Weeks | 525-FBGA, FCBGA | 0°C~105°C TA | 2014 | QorIQ T1 | Active | 3 (168 Hours) | 1.2GHz | PowerPC e5500 | GbE (8) | 1 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC755BPX350LE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 1 Core 32-Bit | No | 2.77mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S80C188XL20 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP | 80 | Bulk | e0 | 80 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 70°C | 0°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | GULL WING | 5V | 0.8mm | 20MHz | 80 | Not Qualified | 5V | 5V | COMMERCIAL | 5V | 5.5V | 4.5V | MICROPROCESSOR | 90mA | 16 | 20 | NO | YES | 8 | FIXED POINT | NO | 0 | 5 | 2 | 3.15mm | 20mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No R7S721010VCBG#AC0 | Renesas Electronics America | Datasheet | 36 | - | Min: 1 Mult: 1 | 20 Weeks | 256-LFBGA | YES | 256 | ROMless | 115 | -40°C~85°C TA | Tray | RZ/A1M | yes | Active | 3 (168 Hours) | 256 | BOTTOM | BALL | 1.18V | 0.5mm | 400MHz | 256 | 1.26V | 1.1V | CAN, EBI/EMI, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB | External | MICROCONTROLLER, RISC | ARM® Cortex®-A9 | DMA, POR, PWM, WDT | 32 | YES | YES | YES | 26 | ARM | 32 | 1.2V 3.3V | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | Yes | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | DVD, VDC | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ATSAMA5D26A-CUR | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 289-LFBGA | YES | 289 | External Program Memory | 128 | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAMA5D2 | yes | Active | 3 (168 Hours) | 289 | BOTTOM | BALL | 1.2V | 0.8mm | 500MHz | ATSAMA5D26 | 1.32V | 1.1V | EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 26 | ARM | YES | YES | 32 | FLOATING POINT | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.4mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XPC8260CZUIFBC | NXP USA Inc. | Datasheet | 180 | - | Min: 1 Mult: 1 | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | 480 | 5A991 | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 1.9V | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MPC8313ZQAGDC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 32 | 15 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | 2.55mm | 27mm | Non-RoHS Compliant |
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OMAP3503ECBC
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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LS1012AXN7HKB
NXP USA Inc.
Package:Embedded - Microprocessors
31.408267
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TA80C188XL20
Intel
Package:Embedded - Microprocessors
Price: please inquire
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LS1023AXN7MQB
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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OMAPL137BZKBT3
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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LS1023AXN8MQB
NXP USA Inc.
Package:Embedded - Microprocessors
55.048218
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LS1043ASN8MQB
NXP USA Inc.
Package:Embedded - Microprocessors
65.669255
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TN80C186EB13
Intel
Package:Embedded - Microprocessors
Price: please inquire
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MC7448HX600ND
NXP USA Inc.
Package:Embedded - Microprocessors
246.574747
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LS1026AXE8MQA
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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Z84C0006PEC
Zilog
Package:Embedded - Microprocessors
Price: please inquire
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MPC8378VRALG
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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R8A77220AC266BGV
Renesas Electronics America
Package:Embedded - Microprocessors
Price: please inquire
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T1013NSE7MQA
NXP USA Inc.
Package:Embedded - Microprocessors
92.714483
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MPC755BPX350LE
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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S80C188XL20
Intel
Package:Embedded - Microprocessors
Price: please inquire
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R7S721010VCBG#AC0
Renesas Electronics America
Package:Embedded - Microprocessors
Price: please inquire
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ATSAMA5D26A-CUR
Microchip Technology
Package:Embedded - Microprocessors
Price: please inquire
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XPC8260CZUIFBC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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MPC8313ZQAGDC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire