The category is 'Embedded - Microprocessors'

  • All Manufacturers
  • Package / Case
  • Packaging
  • Moisture Sensitivity Level (MSL)
  • RoHS Status
  • Core Processor
  • Graphics Acceleration
  • Number of Cores/Bus Width
  • Operating Temperature
  • Part Status
  • RAM Controllers
  • Series
  • USB

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Package / Case

Surface Mount

Number of Terminals

Cache Memory

Clock Frequency-Max

Code Name

Coil resistance

Core

Dielectric strength

Embedded Options

Factory Pack Quantity

Family Name

Gross weight

I/O Voltage-Max

Ihs Manufacturer

Interface Type

L1 Cache Data Memory

L1 Cache Instruction Memory

Maximum Clock Frequency

Maximum Operating Temperature

Memory Types

Minimum Operating Temperature

Moisture Sensitivity Levels

Mounting hole size

Mounting Method

Mounting Styles

No of I/O Lines

No of Terminals

Number of contacts in group/number of groups (total contacts)

Number of switching cycles (electrical)

Operating Temp Range

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Processor Series

RoHS

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Switching scheme

System Bus Speed

System Bus Type

TDP - Max

Transport packaging size/quantity

Watchdog Timers

Packaging

Series

JESD-609 Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Depth

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Contact resistance

Temperature Grade

Memory Size

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Program Memory Type

Supply Current-Max

Bit Size

Family

Data Bus Width

Seated Height-Max

Address Bus Width

Operating temperature range

Rated current

Switching voltage

Boundary Scan

Low Power Mode

External Data Bus Width

Format

Integrated Cache

RAM (words)

Number of Cores

Number of External Interrupts

Product

Height

Length

Width

PK8071305073301S RM7E

Mfr Part No

PK8071305073301S RM7E

Intel Datasheet

-

-

Min: 1

Mult: 1

FCLGA-4677

82.5 MB

Sapphire Rapids

Embedded

2.7 GHz

-

DDR5

-

SMD/SMT

Intel Xeon Platinum 8458P

-

-

350 W

8458P

4 TB

Intel Xeon

-

44 Core

Server Processors

PK8071305120102S RMGF

Mfr Part No

PK8071305120102S RMGF

Intel Datasheet

-

-

Min: 1

Mult: 1

FCLGA-4677

37.5 MB

Sapphire Rapids

Embedded

2.5 GHz

-

DDR5

-

SMD/SMT

Intel Xeon Gold 6426Y

-

-

185 W

6426Y

4 TB

Intel Xeon

-

16 Core

Server Processors

PK8071305075701S RM7S

Mfr Part No

PK8071305075701S RM7S

Intel Datasheet

-

-

Min: 1

Mult: 1

FCLGA-4677

105 MB

Sapphire Rapids

Embedded

2.1 GHz

-

DDR5

-

SMD/SMT

Intel Xeon Platinum 8468H

-

-

330 W

8468H

4 TB

Intel Xeon

-

48 Core

Server Processors

AST2500A2-GP

Mfr Part No

AST2500A2-GP

Aspeed Technology Inc Datasheet

-

-

Min: 1

Mult: 1

1000 (at U_brk.dc=500 V) MOhm

1500 (50 Hz, 1 min) V

6.30

ASPEED TECHNOLOGY INC

Ф6 mm

3/ 2 (6P)

10000 min

TFBGA-456

Contact Manufacturer

ON-ON, DPDT

42*28*18.5/2500

35.6 mm

unknown

20 mOhm max

-25…+85 °C

3 (6) A

250 (125) V

13.2 mm

12.7 mm

8155PP5

Mfr Part No

8155PP5

Exar Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

576

EXAR CORP

70 °C

PLASTIC/EPOXY

BGA

BGA, BGA576,30X30,50

BGA576,30X30,50

SQUARE

GRID ARRAY

Obsolete

No

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

S-PBGA-B576

Not Qualified

COMMERCIAL

PIC64GX1000-C/FCS

Mfr Part No

PIC64GX1000-C/FCS

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FCSG-325

RISC-V

1

CAN, I2C, SPI, UART

32 kB

32 kB

400 kHz

DDR4

SMD/SMT

RoHS Compliant

Watchdog Timer

Tray

970 mV to 1.08 V

16 bit

IMST805-F20S

Mfr Part No

IMST805-F20S

STMicroelectronics Datasheet

-

-

Min: 1

Mult: 1

YES

100

STMICROELECTRONICS

70 °C

CERAMIC

QFP

QFP100(UNSPEC)

FLATPACK

Obsolete

No

5 V

e0

TIN LEAD

8542.31.00.01

QUAD

GULL WING

not_compliant

Not Qualified

COMMERCIAL

20 MHz

MICROPROCESSOR, RISC

230 mA

32

 R9A09G057H41GBG#BC0

Mfr Part No

R9A09G057H41GBG#BC0

Renesas Datasheet

-

-

Min: 1

Mult: 1

1800MHz

RZ/V2H

3.3V

3

Surface Mount

86

1368

-40°C to +85°C

3V to 3.6V

6MB

Cortex-A55 x 4

RAM

32b

 R9A09G057H44GBG#BC0

Mfr Part No

R9A09G057H44GBG#BC0

Renesas Datasheet

-

-

Min: 1

Mult: 1

1800MHz

RZ/V2H

3.3V

3

Surface Mount

86

1368

-40°C to +85°C

3V to 3.6V

64B

Cortex-A55 x 4

RAM

32b

 R9A09G057H48GBG#BC0

Mfr Part No

R9A09G057H48GBG#BC0

Renesas Datasheet

-

-

Min: 1

Mult: 1

1800MHz

RZ/V2H

3.3V

3

Surface Mount

86

1368

-40°C to +85°C

3V to 3.6V

6MB

Cortex-A55 x 4

RAM

32b

 R9A08G045S15GBG#BC0

Mfr Part No

R9A08G045S15GBG#BC0

Renesas Datasheet

-

-

Min: 1

Mult: 1

100MHz

RZ/G3S

3.3V

3

Surface Mount

82

-40°C to +85°C

3V to 3.6V

1024kB

ARM® Cortex®-A55

RAM

 R9A08G045S31GBG#BC0

Mfr Part No

R9A08G045S31GBG#BC0

Renesas Datasheet

-

-

Min: 1

Mult: 1

RZ/G3S

3

Surface Mount

82

-40°C to +85°C

3V to 3.6V

1024kB

Cortex-A55 x 1

RAM

BCM1255

Mfr Part No

BCM1255

Broadcom Limited Datasheet

-

-

Min: 1

Mult: 1

BROADCOM CORP

,

Obsolete

No

8542.31.00.01

compliant

SB80486DX2SC-40

Mfr Part No

SB80486DX2SC-40

Intel Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

208

INTEL CORP

CERAMIC

QFP

QFP, QFP208,1.2SQ,20

QFP208,1.2SQ,20

SQUARE

FLATPACK

Obsolete

QFP

No

3.3 V

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

GULL WING

0.5 mm

compliant

208

S-XQFP-G208

Not Qualified

40 MHz

MICROPROCESSOR, RISC

450 mA

32

XPC7451RX800RE

Mfr Part No

XPC7451RX800RE

NXP Semiconductors Datasheet

-

-

Min: 1

Mult: 1

NXP SEMICONDUCTORS

,

Obsolete

8542.31.00.01

unknown

MICROPROCESSOR, RISC

MC9328MX21CVG

Mfr Part No

MC9328MX21CVG

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

289

32 MHz

FREESCALE SEMICONDUCTOR INC

3

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, MAPBGA-289

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

1.65 V

1.45 V

e0

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

0.65 mm

not_compliant

30

289

S-PBGA-B289

Not Qualified

INDUSTRIAL

266 MHz

MICROPROCESSOR

1.49 mm

26

YES

YES

32

FIXED POINT

YES

14 mm

14 mm

PPC405GP-3DE133C

Mfr Part No

PPC405GP-3DE133C

Applied Micro Circuits Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

456

66.66 MHz

APPLIED MICRO CIRCUITS CORP

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA, BGA456,26X26,40

BGA456,26X26,40

SQUARE

GRID ARRAY

Obsolete

BGA

No

2.7 V

2.3 V

2.5 V

e0

3A991.A.2

TIN LEAD

ALSO REQUIRES 3.3V SUPPLY

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

456

S-PBGA-B456

Not Qualified

INDUSTRIAL

133 MHz

MICROPROCESSOR, RISC

32

2.65 mm

32

YES

YES

32

FIXED POINT

YES

27 mm

27 mm

IDT79RV4600-100MS

Mfr Part No

IDT79RV4600-100MS

Integrated Device Technology Inc Datasheet

-

-

Min: 1

Mult: 1

YES

208

50 MHz

INTEGRATED DEVICE TECHNOLOGY INC

85 °C

PLASTIC/EPOXY

FQFP

CAVITY DOWN, MQUAD-208

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

QFP

No

3.465 V

3.135 V

3.3 V

e0

3A991.A.2

TIN LEAD

8542.31.00.01

QUAD

GULL WING

0.5 mm

not_compliant

208

S-PQFP-G208

Not Qualified

OTHER

100 MHz

MICROPROCESSOR, RISC

1275 mA

64

3.86 mm

64

NO

YES

64

FLOATING POINT

NO

0

7

27.69 mm

27.69 mm

TSPC603RMGU8LC

Mfr Part No

TSPC603RMGU8LC

Teledyne e2v Datasheet

-

-

Min: 1

Mult: 1

YES

255

200 MHz

TELEDYNE E2V (UK) LTD

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA,

SQUARE

GRID ARRAY

Obsolete

BGA

2.625 V

2.375 V

2.5 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

255

S-CBGA-B255

Not Qualified

MILITARY

200 MHz

MICROPROCESSOR, RISC

32

3 mm

32

YES

YES

64

FLOATING POINT

YES

21 mm

21 mm

TSPC603RMGU8LC

Mfr Part No

TSPC603RMGU8LC

Atmel Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

255

66.7 MHz

ATMEL CORP

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA255,16X16,50

BGA255,16X16,50

SQUARE

GRID ARRAY

Transferred

BGA

No

2.625 V

2.375 V

2.5 V

e0

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

255

S-CBGA-B255

Not Qualified

MILITARY

200 MHz

MICROPROCESSOR, RISC

32

3 mm

32

YES

YES

64

FLOATING POINT

YES

21 mm

21 mm