The category is 'Memory Connectors - Accessories'
- All Manufacturers
- Access Mode
- Access Time-Max
- Additional Feature
- Clock Frequency-Max (fCLK)
- Factory Lead Time
- I/O Type
- Ihs Manufacturer
- Interleaved Burst Length
- JESD-30 Code
- Length
- Memory Density
- Supply Current-Max
- Supply Current-Max:
0.33 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer Part Number | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Max Supply Current | Supply Current-Max | Access Time | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | I/O Type | Memory IC Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width |
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![]() | Mfr Part No IS43DR83200A-3DBLI | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | YES | 60 | 60 | 0.45 ns | 333 MHz | INTEGRATED SILICON SOLUTION INC | IS43DR83200A-3DBLI | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA60,9X11,32 | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | 40 | 5.84 | Compliant | Yes | 1.8 V | e1 | Yes | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | AUTO/SELF REFRESH | 8542.32.00.24 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 60 | R-PBGA-B60 | Not Qualified | 1.8 V | 1.9 V | 1.8 V | INDUSTRIAL | 1.7 V | 1.9 V | 1.7 V | 32 MB | 1 | 330 mA | SYNCHRONOUS | 135 mA | 0.33 mA | 3 ns | 8 b | 32MX8 | 3-STATE | 1.2 mm | 8 | 15 b | 256 Mb | 0.005 A | 268435456 bit | 333 MHz | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | FOUR BANK PAGE BURST | YES | 10.5 mm | 8 mm | |
![]() | Mfr Part No IS43DR83200A-3DBLI-TR | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | YES | 60 | 0.45 ns | 333 MHz | INTEGRATED SILICON SOLUTION INC | IS43DR83200A-3DBLI-TR | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA60,9X11,32 | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 5.84 | Yes | 1.8 V | AUTO/SELF REFRESH | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B60 | Not Qualified | 1.9 V | 1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.33 mA | 32MX8 | 3-STATE | 1.2 mm | 8 | 0.005 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | FOUR BANK PAGE BURST | YES | 10.5 mm | 8 mm |

