The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Current Short Circuit (Isc) | Data RAM Size | Device Logic Units | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Number of Terminations | Temperature Coefficient | Type | Resistance | Terminal Finish | Composition | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Failure Rate | Power Supplies | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Family | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Voltage @ Pmpp | Power (Watts) - Max | Current @ Pmpp | Voltage - Open Circuit | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No XCZU9CG-2FFVB1156E | AMD | Datasheet | 603 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | 0.892 V | AMD | 0.808 V | 328 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SFVA625I | AMD | Datasheet | 1892 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | 154,350 | 180 | 0.892 V | AMD | 0.808 V | 180 | Bulk | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 625 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 141,120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-3FFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | 599,550 | 1.03 V | AMD | 0.97 V | 204 | Tray | Active | FCBGA | 1.0000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 900 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 548,160 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-L2FFVB1156E | AMD | Datasheet | 673 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU15 | 0.742, 0.892 V | AMD | 0.698, 0.808 V | 328 | Tray | Active | 0.72, 0.85 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FGG484I | Microchip | Datasheet | 1612 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN73R2A | KOA Speer Electronics, Inc. | 576 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RN73R | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.5% | 2 | ±50ppm/°C | 59 Ohms | Thin Film | 0.125W, 1/8W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24B2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Cell (36) | - | TPS-12 | 2.19 A | Tycon Systems Inc. | 768 | Box | Active | -40°C ~ 85°C | - | 21.457 L x 19.291 W x 1.378 H (545.00mm x 490.00mm x 35.00mm) | Monocrystalline | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 16.92 V | 35 W | 2.07 A | 20.87 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B3I3E | Intel | Datasheet | 607 |
| Min: 1 Mult: 1 | - | - | PEI-Genesis | 720 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVF1517E | AMD | Datasheet | 630 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | 653,100 | 464 | 0.979 V | AMD | 0.922 V | 464 | Tray | Active | 0.9500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | XCZU11EG | MCU, FPGA | Extended Industrial | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | 597,120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-L2SFVC784E | AMD | Datasheet | 2165 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1FG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-2FBVB900E | AMD | Datasheet | 471 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-1FFVB1156E | AMD | Datasheet | 428 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | 599,550 | 328 | 0.979 V | AMD | 0.922 V | 328 | Tray | Active | 0.9500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | XCZU9EG | MCU, FPGA | Extended Industrial | 1 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 548,160 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FGG676I | Microchip | Datasheet | 1696 | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | MICROSEMI CORP | Microsemi Corporation | M2S060TS-FGG676I | Microchip Technology | 3 | 387 | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1VFG256I | Microchip | Datasheet | 31 |
| Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010-1VFG256I | Microchip Technology | 3 | 138 | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG676I | Microchip | Datasheet | 2332 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | Microchip Technology | 387 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF256I | Microchip | Datasheet | 31 |
| Min: 1 Mult: 1 | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1VF256 | Microchip | Datasheet | 1809 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-L2SFVA625E | AMD | Datasheet | 1732 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - |
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XCZU9CG-2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
4,073.397248
-
XCZU3CG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
518.469506
-
XCZU9EG-3FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU15EG-L2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
418.394854
-
AGFA008R24C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB014R24B2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB027R31B3I3E
Intel
Package:Embedded - System On Chip (SoC)
28,207.200539
-
10AS048
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-1FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU2EG-L2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
513.810990
-
M2S025T-1FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7CG-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,611.899180
-
XCZU9EG-1FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
3,552.177802
-
M2S060TS-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
77.193401
-
M2S060-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
270.885912
-
M2S005S-1VF256I
Microchip
Package:Embedded - System On Chip (SoC)
46.584002
-
M2S025-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU1EG-L2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
497.338835