The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Contact Sizes | Data Converters | Data RAM Size | Device Logic Gates | Device Logic Units | Device System Gates | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Operation | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Temperature Coefficient | Type | Resistance | Terminal Finish | Composition | Color | Power (Watts) | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | Pin Count | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | ESR (Equivalent Series Resistance) | Failure Rate | Power Supplies | Wire Gauge | Temperature Grade | Current - Supply (Disable) (Max) | Configuration | Oscillator Type | Load Capacitance | Speed | RAM Size | Operating Mode | Voltage - Supply (Vcc/Vdd) | Core Processor | Frequency Tolerance | Peripherals | Program Memory Type | Core Size | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Terminal Type | Specifications | EEPROM Size | Screening Level | Depth Behind Panel | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Module Capacity | Lamp Type | Features | Contacts | IP Rating | Height Seated (Max) | Length | Width | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU6EG-L1FFVB1156I | AMD | Datasheet | 159 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCZU6 | Suntsu Electronics, Inc. | 328 | Bulk | Active | -40°C ~ 85°C | SXT214 | 0.079 L x 0.063 W (2.00mm x 1.60mm) | MHz Crystal | 37.4 MHz | ±25ppm | 100 Ohms | 15pF | 500MHz, 600MHz, 1.2GHz | 256KB | Fundamental | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | ±25ppm | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | 0.020 (0.50mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-2FFVB1156E | AMD | Datasheet | 504 |
| Min: 1 Mult: 1 | 1210 (3225 Metric) | 1210 | SG73P2 | 0.892 V | KOA Speer Electronics, Inc. | 0.808 V | 328 | Tape & Reel (TR) | Active | 0.8500 V | -55°C ~ 155°C | SG73P-RT | 0.126 L x 0.102 W (3.20mm x 2.60mm) | ±0.5% | 2 | ±200ppm/°C | 6.19 kOhms | Thick Film | 0.5W, 1/2W | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | Anti-Sulfur, Automotive AEC-Q200, Pulse Withstanding | 0.028 (0.70mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-2CLG484E | AMD | Datasheet | 2120 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | USBFTVX7 | 1.05 V | Amphenol Socapex | 0.95 V | 200 | Box | Active | 1.0000 V | 0 to 100 °C | USBF TVX | - | Shielded | 24 AWG, 28 AWG | A Female to A Male (Circular Coupling) | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | USB 2.0 | 2 | Artix™-7 FPGA, 65K Logic Cells | - | Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount | 3.28 (1.00m) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-2FFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 64-LQFP | 64-LQFP (10x10) | CY9AF312 | A/D 9x12b SAR | 0.892 V | Infineon Technologies | 0.808 V | 51 | Tray | Active | 0.8500 V | -40°C ~ 105°C (TA) | FM3 CY9A310 | External, Internal | 40MHz | 16K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 128KB (128K x 8) | CSIO, I²C, LINbus, SPI, UART/USART | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-3FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVC1156E | AMD | Datasheet | 523 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU11 | 0.892 V | AMD | 0.808 V | 360 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L1SFVA625I | AMD | Datasheet | 588 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | AMD | 180 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2SFVC784I | AMD | Datasheet | 793 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | 192,150 | 0.892 V | AMD | 0.808 V | 252 | Tray | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 784 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | CSA, IEC, UL | M2S005 | 64 kB | MICROSEMI CORP | - | - | ABB | MP1-42L10L8 | 166 MHz | Microchip Technology | SMD/SMT | 169 | 6060 LE | Momentary | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | Fingersafe Screw | 1.91 | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | LED | 1NO | IP66 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG256I | Microchip | Datasheet | 31 | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A2F200 | 100 MHz | 200000 | 200000 | MICROSEMI CORP | ABB | ACH580-BCR-027A-6+E213+K465+L512 | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FGG484I | Microchip | Datasheet | 1910 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG400 | Microchip | Datasheet | 2360 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | MICROSEMI CORP | Microsemi Corporation | M2S060T-VFG400 | PEI-Genesis | 3 | 207 | 85 °C | Bulk | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VF400I | Microchip | Datasheet | 31 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | SJT5 | - | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-VF400I | 166 MHz | Amphenol PCD | SMD/SMT | 195 | 12084 LE | Box | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SJT | 4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm) | e0 | Rail | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 8 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Knowles Syfer | 561 | Tape & Reel (TR) | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H1F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-SMD, No Lead | YES | 1152-FBGA (35x35) | 1152 | 580 | INTEL CORP | Intel Corporation | 10AS027H1F34E1SG | CTS-Frequency Controls | 384 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 85°C | Tray | 580 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Discontinued at Digi-Key | TCXO | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1 mm | compliant | 16 MHz | ±280ppb | Clipped Sine Wave | S-PBGA-B1152 | Standby (Power Down) | Crystal | 6mA | OTHER | 10µA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 270K Logic Elements | -- | 0.079 (2.00mm) | 35 mm | 35 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2I3E | Intel | Datasheet | 445 |
| Min: 1 Mult: 1 | Axial | Axial | Stackpole Electronics Inc | 576 | Bulk | Active | -55°C ~ 235°C | RSF | 0.177 Dia x 0.433 L (4.50mm x 11.00mm) | ±5% | 2 | ±200ppm/°C | 390 Ohms | Metal Oxide Film | 1W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | Flame Retardant Coating, Safety | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R25A2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | DIV46E19 | TE Connectivity Deutsch Connectors | 480 | Bag | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2E3V | Intel | Datasheet | 719 |
| Min: 1 Mult: 1 | - | - | 094266 | Molex | 720 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD019R25A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 6-SMD, No Lead | - | Skyworks Solutions Inc. | 480 | Tape & Reel (TR) | Active | -40°C ~ 85°C | Ultra™ Si545 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 1.8V ~ 3.3V | 106.5 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 127mA | 112mA | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 1.9M Logic Elements | - | 0.052 (1.33mm) | - |
-
XCZU6EG-L1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9EG-2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
4,356.623404
-
XC7Z014S-2CLG484E
AMD
Package:Embedded - System On Chip (SoC)
167.639746
-
XCZU15EG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-1FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,966.030692
-
M2S005S-1VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
449.682123
-
M2S060T-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
218.085987
-
M2S010T-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
89.131852
-
XCZU43DR-1FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H1F34E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
9,707.319838
-
AGFB023R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB027R31B2E3V
Intel
Package:Embedded - System On Chip (SoC)
24,938.509948
-
AGFD019R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire