The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | 1st Contact Gender | 2nd Contact Gender | Base Product Number | Brand | Cable Types | Contact Finish Mating | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Overall Impedance | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Composition | Color | Applications | Number of Rows | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Pitch | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Style | Reach Compliance Code | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Number of Outputs | Qualification Status | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Row Spacing | Note | Speed | RAM Size | Shell Size, MIL | Lead Style | Core Processor | Peripherals | Program Memory Size | Connectivity | Cable Opening | Reset | Architecture | Voltage - Threshold | Number of Voltages Monitored | Contact Termination | Reset Timeout | Number of Inputs | Seated Height-Max | Utilized IC / Part | Supplied Contents | Programmable Logic Type | Product Type | 1st Connector | 2nd Connector | Primary Attributes | Embedded | Secondary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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![]() | Mfr Part No XCVC1702-2LLEVSVA1596 | AMD | Datasheet | 732 |
| Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | MS27496E25B | Corsair | 500 | Bag | Active | 0°C ~ 100°C (TJ) | * | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB022R31C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Male | Male | Q-2I01A0 | RG-316 | 6 GHz | Amphenol Custom Cable | 720 | 50 Ohms | Bag | Active | - | - | Copper | - | MCX to N-Type | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | MCX Plug, Right Angle | N-Type Plug | FPGA - 2.2M Logic Elements | - | Shielded | 39.4 (1.0m) 3.3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E1F29E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | 10AS032E1F29E1SG | Fox Electronics | 360 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | -- | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E3F27I2SG | ALTERA | Datasheet | 723 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | RJMG2 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E3F27I2SG | 1.2 GHz | Amphenol ICC (Commercial Products) | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964925 | Active | Obsolete | NOT SPECIFIED | 5.43 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | - | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H4F34I3LG | ALTERA | Datasheet | 735 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | MAX147 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H4F34I3LG | 1.2 GHz | Analog Devices Inc./Maxim Integrated | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Box | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965347 | Active | Obsolete | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | - | Active | Power Management | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | Battery Charger | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | MAX14750 | Board(s) | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | - | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E3F27I2SG | ALTERA | Datasheet | 776 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 672 | ERC55 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E3F27I2SG | 1.2 GHz | Vishay Dale | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965290 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | ERC | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±1% | Active | 2 | ±50ppm/°C | 127 kOhms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Moisture Resistant | SoC FPGA | - | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057N3F40I2SG | ALTERA | Datasheet | 668 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 121121 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057N3F40I2SG | 1.2 GHz | Molex | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 964986 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H3F34E2LG | ALTERA | Datasheet | 589 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | YES | 1152-FCBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS066H3F34E2LG | Vishay Vitramon | 492 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.45 | Yes | 0.93 V | 0.87 V | 0.9 V | 100V | -55°C ~ 150°C | Tray | GA | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.5pF | Active | C0G, NP0 | Automotive | 8542.39.00.01 | 1.5 pF | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | - | - | 35 mm | 35 mm | 0.038 (0.97mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E3F29E2SG | ALTERA | Datasheet | 777 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | YES | 780 | VJ0603 | INTEL CORP | Intel Corporation | 10AS048E3F29E2SG | Vishay Vitramon | 360 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | 50V | -55°C ~ 125°C | Tray | VJ HIFREQ | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.5pF | Active | C0G, NP0 | RF, Microwave, High Frequency | 8542.39.00.01 | 4.7 pF | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | High Q, Low Loss | - | 29 mm | 29 mm | 0.037 (0.94mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K2F35E2LG | ALTERA | Datasheet | 658 |
| Min: 1 Mult: 1 | 1206 (3216 Metric) | YES | 1206 | 1152 | INTEL CORP | Intel Corporation | 10AS057K2F35E2LG | Vishay Dale | 396 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.45 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 125°C | Tray | TNPU e3 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | Active | 2 | ±5ppm/°C | 46.4 kOhms | Thin Film | 0.25W, 1/4W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 570K Logic Elements | 570000 | -- | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K2F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | 121129 | INTEL CORP | Intel Corporation | 10AS066K2F35I1SG | Molex | 396 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E4F27I3SG | ALTERA | Datasheet | 713 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E4F27I3SG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 100 °C | -40 °C | Tape & Box (TB) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964720 | Active | Active | NOT SPECIFIED | 1.95 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RNF | 0.093 Dia x 0.250 L (2.35mm x 6.35mm) | ±1% | Active | 2 | ±100ppm/°C | 124 kOhms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | Flame Retardant Coating, Safety | SoC FPGA | - | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057N3F40E2SG | ALTERA | Datasheet | 727 |
| Min: 1 Mult: 1 | Surface Mount | 4-WFBGA, CSPBGA | YES | 4-UCSP (1x1) | 1517 | MAX16073 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057N3F40E2SG | 1.2 GHz | Analog Devices Inc./Maxim Integrated | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | 100 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965073 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 85°C (TA) | Tray | nanoPower | Active | Simple Reset/Power-On Reset | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | Push-Pull, Totem Pole | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Active High | MCU, FPGA | 3.08V | 1 | 34ms Minimum | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066N4F40E3LG | ALTERA | Datasheet | 421 |
| Min: 1 Mult: 1 | 2512 (6432 Metric) | YES | 2512 | 1517 | TNPW2512 | INTEL CORP | Intel Corporation | 10AS066N4F40E3LG | Vishay Dale | 588 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | TNPW e3 | 0.248 L x 0.122 W (6.30mm x 3.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 169 Ohms | Thin Film | 0.5W, 1/2W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | Moisture Resistant | 0.030 (0.75mm) | 40 mm | 40 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H4F35I3LG | ALTERA | Datasheet | 459 |
| Min: 1 Mult: 1 | Panel Mount | YES | Flange | Composite | Thermoplastic | 1152 | - | ACT90 | Gold | Copper Alloy | INTEL CORP | Intel Corporation | 10AS032H4F35I3LG | TE Connectivity Deutsch Connectors | 384 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Composite | Discontinued at Digi-Key | NOT SPECIFIED | 5.45 | Yes | 0.93 V | 0.87 V | 0.9 V | - | -65°C ~ 200°C | Tray | MIL-DTL-38999 Series III, ACT | Active | Crimp | Receptacle, Male Pins | 6 | Silver | Aerospace, Military | 8542.39.00.01 | Threaded | Field Programmable Gate Arrays | 23A | CMOS | BOTTOM | N (Normal) | BALL | Shielded | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Nickel | 17-6 | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | E | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | -- | - | 35 mm | 35 mm | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K2F35E2LG | ALTERA | Datasheet | 460 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 1812 (4532 Metric) | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K2F35E2LG | 1.2 GHz | Vishay Vitramon | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973520 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 50V | -55°C ~ 150°C | Tray | GA | 0.177 L x 0.126 W (4.50mm x 3.20mm) | ±2% | Active | C0G, NP0 | Automotive | 8542.39.00.01 | 0.012 µF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | - | SoC FPGA | - | 35 mm | 35 mm | 0.086 (2.18mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H3F35E2LG | ALTERA | Datasheet | 778 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | 203152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H3F35E2LG | 1.2 GHz | Molex | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965060 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H4F34I3SG | ALTERA | Datasheet | 427 |
| Min: 1 Mult: 1 | Free Hanging (In-Line) | FBGA-1152 | YES | 1152 | 034985 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H4F34I3SG | 1.2 GHz | Molex | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965297 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | MX150 34985 | Active | Receptacle | 16 | Black | 2 | 8542.39.00.01 | Latch Holder | SOC - Systems on a Chip | Female Socket | 0.138 (3.50mm) | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | - | Contacts Not Included | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Crimp | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Sealed | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H4F35E3SG | ALTERA | Datasheet | 749 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | 221050 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F35E3SG | 1.2 GHz | Molex | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964945 | Active | Active | NOT SPECIFIED | 1.92 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F27I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 672 | RN731J | INTEL CORP | Intel Corporation | 10AS022E3F27I1SG | KOA Speer Electronics, Inc. | 240 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | BGA672,26X26,40 | SQUARE | GRID ARRAY | Obsolete | Obsolete | NOT SPECIFIED | 5.67 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 34 Ohms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 220K Logic Elements | 220000 | -- | Moisture Resistant | 0.022 (0.55mm) | 27 mm | 27 mm |
XCVC1702-2LLEVSVA1596
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AGFB022R31C2I3V
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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