The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | 1st Connector Mounting Type | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | 2nd Connector Mounting Type | 1st Connector Mounting Feature | 1st Contact Gender | 2nd Connector Mounting Feature | 2nd Contact Gender | Base Product Number | Brand | Cable Types | Contact Finish Mating | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Overall Impedance | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Composition | Color | Power (Watts) | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Style | Reach Compliance Code | Current Rating | Frequency | Pitch - Mating | Frequency Stability | Output | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Contact Finish - Post | Operating Supply Voltage | Failure Rate | Power Supplies | Contact Resistance | Temperature Grade | Current - Supply (Disable) (Max) | Note | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Utilized IC / Part | Supplied Contents | Programmable Logic Type | Product Type | 1st Connector | 2nd Connector | Speed Grade | Termination Post Length | Pitch - Post | Number of Transceivers | Absolute Pull Range (APR) | Primary Attributes | Embedded | Secondary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 10AS066H3F34E2SG | ALTERA | Datasheet | 496 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H3F34E2SG | 1.2 GHz | + 100 C | Panduit Corp | 0 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964989 | Active | Obsolete | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | - | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 900 mV | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 24 Transceiver | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057K4F35E3SG | ALTERA | Datasheet | 772 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 015266 | INTEL CORP | Intel Corporation | 10AS057K4F35E3SG | Molex | 396 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.45 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Premo-Flex 15266 | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 570K Logic Elements | 570000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H4F34I3SGES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | - | - | - | Male | - | - | CASNM48 | - | INTEL CORP | Intel Corporation | 10AS066H4F34I3SGES | TE Connectivity Laird | 492 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | 0.93 V | 0.87 V | 0.9 V | - | Tray | - | Discontinued at Digi-Key | - | 8542.39.00.01 | BOTTOM | BALL | - | 1 mm | RP-BNC to N-Type | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | N-Type Plug | - | FPGA - 660K Logic Elements | -- | - | 48.0 (1.2m) 4.0 | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K2F40I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066K2F40I1SG | Renesas Electronics America Inc | 696 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50I1VG | ALTERA | Datasheet | 500 |
| Min: 1 Mult: 1 | 007700 | Molex | 704 | Bulk | Active | -40°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K2F40E2LG | ALTERA | Datasheet | 662 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 112180 | INTEL CORP | Intel Corporation | 10AS066K2F40E2LG | Molex | 696 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 696 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048E2F29I2LG | ALTERA | Datasheet | 796 |
| Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 780 | RN731J | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048E2F29I2LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 360 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 965350 | Active | Obsolete | NOT SPECIFIED | 5.49 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.1% | Active | 2 | ±10ppm/°C | 787 Ohms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.022 (0.55mm) | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H2F34E2SG | ALTERA | Datasheet | 751 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Free Hanging (In-Line) | Panel Mount | - | Male | Bulkhead - Front Side Nut | Female | Q-1X03D0 | Intel / Altera | RG-58 | - | 1 | 11 GHz | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H2F34E2SG | 1.2 GHz | Amphenol Custom Cable | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | 100 °C | 50 Ohms | Bag | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973516 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | - | Tray | - | Active | Black | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | - | 1 mm | SMA to N-Type | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | SMA Plug | N-Type Jack | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Shielded | SoC FPGA | 12.00 (304.80mm) | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E3F27I2LG | ALTERA | Datasheet | 540 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 672 | RN732A | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E3F27I2LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 973477 | Active | Obsolete | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.5% | Active | 2 | ±10ppm/°C | 305 Ohms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.024 (0.60mm) | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24B2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | 085643 | Molex | 768 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-3SFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L2FFVB1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 488 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095T-FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Polyamide (PA46), Nylon 4/6, Glass Filled | -- | Beryllium Copper | Brass | Gold | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -55°C ~ 105°C | Bulk | PGM | Active | Solder | PGA | 3A | 0.100 (2.54mm) | Tin | -- | - | 857.6KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | 0.165 (4.19mm) | 0.100 (2.54mm) | FPGA - 93K Logic Modules | 128KB | -- | 10.0µin (0.25µm) | 200.0µin (5.08µm) | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | - | 510KBA | Skyworks Solutions Inc. | 480 | Strip | Active | -40°C ~ 85°C | Si510 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 1.8V | 100 MHz | ±25ppm | CMOS | Enable/Disable | Crystal | 26mA | 18mA | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 2.3M Logic Elements | - | 0.050 (1.28mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2HSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 726 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 2 | ±50ppm/°C | 48.1 kOhms | Thin Film | 0.1W, 1/10W | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | Moisture Resistant | 0.024 (0.60mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Analog Devices Inc./Maxim Integrated | 720 | Box | Active | 0°C ~ 100°C (TJ) | - | Power Management | Power Supply Supervisor/Tracker/Sequencer | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | MAX34460 | Board(s) | 12 Channel Sequencer and Monitor | No | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB019R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | D38999/24MC | TE Connectivity Deutsch Connectors | 480 | Bag | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVC1156I | AMD | Datasheet | 658 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU11 | Vishay Sfernice | 360 | Bag | Active | -40°C ~ 100°C (TJ) | RCMS | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW4373IUBGT | Cypress | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | Free Hanging (In-Line) | Bulkhead - Front Side Nut | Female | - | Male | Q-2F02R0 | RG-58 | 11 GHz | Amphenol Custom Cable | 50 Ohms | Bag | Active | - | - | Black | - | SMA to N-Type | SMA Jack, Right Angle | N-Type Plug, Right Angle | Shielded | 48.0 (1.2m) 4.0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H4F34E3LG | ALTERA | Datasheet | 613 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F34E3LG | 1.2 GHz | Vishay Foil Resistors (Division of Vishay Precision Group) | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964972 | Active | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 125°C | Tray | HZ | 0.500 Dia x 1.500 L (12.70mm x 38.10mm) | ±0.005% | Active | 4 | ±0.2ppm/°C | 100 Ohms | Metal Foil | 2.5W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | Non-Inductive | SoC FPGA | - | 35 mm | 35 mm |
-
10AS066H3F34E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,987.923281
-
10AS057K4F35E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,324.119999
-
10AS066H4F34I3SGES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066K2F40I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX250LU3F50I1VG
ALTERA
Package:Embedded - System On Chip (SoC)
19,247.499750
-
10AS066K2F40E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
6,296.390684
-
10AS048E2F29I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
3,734.721408
-
10AS048H2F34E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,027.556783
-
10AS027E3F27I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,697.944849
-
AGFB014R24B2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-3SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS095T-FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA023R25A2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2HSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R31C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB019R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L1FFVC1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
CYW4373IUBGT
Cypress
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H4F34E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,504.587575