The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Dielectric Material | Insert Material | Number of Terminals | Base Product Number | Brand | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Base Part Number | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Note | Memory Size | Speed | RAM Size | Cable Length | Shell Size, MIL | Lead Style | Core Processor | Peripherals | Program Memory Size | Connectivity | Reset | Architecture | Voltage - Threshold | Number of Voltages Monitored | Reset Timeout | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Includes | Max Frequency | Wavelength | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU49DR-1FSVF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | MAX198 | Analog Devices Inc./Maxim Integrated | 622 | Tape & Reel (TR) | Obsolete | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FFVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Panduit Corp | 366 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | - | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Radial | - | Vishay Foil Resistors (Division of Vishay Precision Group) | 366 | Bulk | Active | -55°C ~ 125°C | S | 0.300 L x 0.105 W (7.62mm x 2.67mm) | ±0.01% | 2 | ±2ppm/°C | 1.09244 kOhms | Metal Foil | 0.6W | - | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Moisture Resistant, Non-Inductive | 0.336 (8.53mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 10-WFDFN | 10-uDFN (2x2) | MAX16034 | Analog Devices Inc./Maxim Integrated | 561 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | - | Battery Backup Circuit | Push-Pull, Totem Pole | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Active Low | MCU, FPGA | 2.63V | 1 | 140ms Minimum | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVG1517E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 1517-FCBGA (40x40) | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked | EPCOS - TDK Electronics | 561 | Bulk | Obsolete | 40V | 63V | -55°C ~ 125°C | SilverCap™ B32561 | 0.453 L x 0.177 W (11.50mm x 4.50mm) | ±20% | PC Pins | General Purpose | 1 µF | 0.394 (10.00mm) | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 0.272 (6.90mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 1156-BBGA, FCBGA | Bulkhead - Front Side Nut | Circular | Composite | 1156-FCBGA (35x35) | Plastic | D38999/24MA | 20 | TE Connectivity Deutsch Connectors | 366 | Bulk | Active | -65°C ~ 200°C | Military, MIL-DTL-38999 Series III, ACT | Receptacle Housing | For Female Sockets | 3 | Threaded | Crimp | B | Shielded | Environment Resistant | Electroless Nickel | 9-98 | Silver | Contacts Not Included | 533MHz, 1.333GHz | 256KB | A | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0402 (1005 Metric) | 1517-FCBGA (40x40) | Vishay Vitramon | 561 | Bulk | Obsolete | 100V | -55°C ~ 150°C | VJ | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±10% | C0G, NP0 | Automotive | 18 pF | - | - | 500MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | 0.024 (0.60mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 093090 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Base | - | - | Intel | 744 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | 240 V | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 0 m | 0 m | 0 m | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-2FFVC900E | AMD | Datasheet | 668 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Black | 533MHz, 600MHz, 1.3GHz | 256KB | 762 mm | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH1F35I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Beige | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVD1760I | AMD | Datasheet | 660 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1LSEVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F35E2LG | ALTERA | Datasheet | 503 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F35E2LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965050 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F35E2SG | ALTERA | Datasheet | 739 |
| Min: 1 Mult: 1 | FBGA-1152 | D38999/26FF | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Corsair | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | Bag | 965285 | Active | Details | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U19C8N | ALTERA | Datasheet | 1680 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA6U19C8N | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.07 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B484 | 66 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 773.9 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 8 | FPGA - 110K Logic Elements | 110000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX065HH3F35I2VG | Intel | Datasheet | 547 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 392 | Tray | Active | Compliant | 28 V | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Green | 42 mA | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 525 nm | FPGA - 650K Logic Elements | - | 35 mm |
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XCZU49DR-1FSVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9EG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
3,907.933500
-
AGFB014R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX040HH1F35I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-2FFVD1760I
AMD
Package:Embedded - System On Chip (SoC)
10,074.669598
-
XCVC1902-1LSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F35E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
2,247.807142
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10AS027H3F35E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,598.606718
-
5CSEBA6U19C8N
ALTERA
Package:Embedded - System On Chip (SoC)
239.597698
-
AGFB014R24C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX065HH3F35I2VG
Intel
Package:Embedded - System On Chip (SoC)
3,764.318132