The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Data RAM Type | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Frequency | Operating Supply Voltage | Power Supplies | Temperature Grade | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Utilized IC / Part | Programmable Logic Type | Protocol | Total RAM Bits | Power - Output | Speed Grade | RF Family/Standard | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Logic Cells | Modulation | Number of Cores | Flash Size | ADC Resolution | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S060TS-FG676 | Microchip Technology | Datasheet | 1736 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1FG484I | Microchip Technology | Datasheet | 2388 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FG484 | Microchip Technology | Datasheet | 2168 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S090TS-1FG484 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VF400I | Microchip Technology | Datasheet | 264 |
| Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025-VF400I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FC1152I | Microchip Technology | Datasheet | 668 |
| Min: 1 Mult: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | ARM Cortex M3 | 64 kB | 24 | MICROSEMI CORP | - | - | M2S150TS-1FC1152I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-VFG256I | Microchip Technology | Datasheet | 287 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (17x17) | M2S010 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VF256I | Microchip Technology | Datasheet | 2216 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 138 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FCSG325 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050-FCSG325 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | 200 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | VFPBGA-256 | 256-FPBGA (17x17) | M2S005 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FCSG325 | Microchip Technology | Datasheet | 152 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025-FCSG325 | 166 MHz | 1.26 V | Microchip Technology | Yes | 3 | 180 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1FGG484 | Microchip Technology | Datasheet | 62 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | MSL 3 - 168 hours | 209 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1FG484 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-1FG484 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG676 | Microchip Technology | Datasheet | 2300 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S060T-1FG676 | 166 MHz | Microchip Technology | Yes | 3 | 387 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG484I | Microchip Technology | Datasheet | 1755 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG256 | Microchip Technology | Datasheet | 1964 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S025 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S025-VFG256 | 166 MHz | Microchip Technology | Yes | 3 | 138 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG896 | Microchip Technology | Datasheet | 2154 |
| Min: 1 Mult: 1 | BGA-896 | 896-FBGA (31x31) | M2S050 | ARM Cortex M3 | 64 kB | 1.314 Mbit | 64 kB | 27 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | Tray | Obsolete | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQG144 | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | TQFP-144 | 144-TQFP (20x20) | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FGG484M | Microchip Technology | Datasheet | 1836 | - | Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060T-1FGG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484M | Microchip Technology | Datasheet | 480 | - | Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060TS-1FGG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ESP32-C3FH4 | Espressif Systems | Datasheet | - |
| Min: 1 Mult: 1 | Surface Mount | QFN-32 | RISC-V | 400 kB | SRAM | 5000 | GPIO, I2C, I2S, SPI, UART | 160 MHz | 150 Mbps | + 105 C | Espressif Systems | - 40 C | Yes | SMD/SMT | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | Details | 87 mA | 325 mA | 3.6 V | 3 V | -40°C ~ 105°C (TA) | Cut Tape | ESP32 | Bluetooth, Wi-Fi | 3V ~ 3.6V | 2.402GHz ~ 2.48GHz | 2.4 GHz | 4MB Flash, 400kB SRAM, 384kB ROM | Flash | 4 MB | 18 dBm | 54Mbps | 32 bit | - | 802.11b/g/n, Bluetooth v5.0 | 21dBm | Bluetooth, WiFi | Antenna Not Included | - 105 dBm | 6 Channel | GPIO, I²C, I²S, SPI, JTAG, UART, USB | 84mA ~ 87mA | 276mA ~ 335mA | - | 12 bit | 0.85 mm | 5 mm | 5 mm |
-
M2S060TS-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
259.345635
-
M2S025T-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
185.956428
-
M2S090TS-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
448.307501
-
M2S025-VF400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
90.221744
-
M2S150TS-1FC1152I
Microchip Technology
Package:Embedded - System On Chip (SoC)
650.665386
-
M2S010TS-VFG256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
84.901132
-
M2S025-VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
116.903289
-
M2S005S-1VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
41.903247
-
M2S025-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
67.240402
-
M2S005-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
49.040818
-
M2S010-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
259.345635
-
M2S060T-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FG896
Microchip Technology
Package:Embedded - System On Chip (SoC)
185.008912
-
M2S010S-TQG144
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
ESP32-C3FH4
Espressif Systems
Package:Embedded - System On Chip (SoC)
1.604915