The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Data RAM Type | Development Kit | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processor Series | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Frequency | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Utilized IC / Part | Programmable Logic Type | Protocol | Frequency Range | Screening Level | Power - Output | Speed Grade | RF Family/Standard | Number of Transceivers | Antenna Type | Sensitivity | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Logic Cells | Number of Timers | Modulation | Number of Cores | Flash Size | ADC Resolution | Device Core | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No EFR32MG1B231F256GM32-C0 | Silicon Labs | Datasheet | 4 |
| Min: 1 Mult: 1 | QFN-32 | ARM Cortex M4 | 32 kB | RAM | SLWRB4154A | 490 | I2C, I2S, SMBus, SPI, UART, USART | 40 MHz | 1 Mbps | + 85 C | - 40 C | Yes | SMD/SMT | EFR32MG1 | Details | 8.7 mA, 9.8 mA | 8.2 mA | 3.3 V | 3.3 V | EFR32 | Tray | EFR32MG1 | Bluetooth, Zigbee | 2.4 GHz | Flash | 256 kB | 19.5 dBm | 32 bit | - 94 dBm | 2 Timer | 12 bit | 0.85 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM85652IFSBG | MaxLinear | Datasheet | - | - | Min: 1 Mult: 1 | - | 24 | + 110 C | - 40 C | Details | Bulk | BCM85652 | Radar | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EG21GGB-MINIPCIE-S | Quectel | Datasheet | 92 |
| Min: 1 Mult: 1 | Card Edge | Module | EG21 | 100 | Quectel | Socket Mount | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | Details | Mini PCIe | Wireless communication module | 0.368613 oz | Industrial grade | -40 to 80 °C | Reel | - | LTE Cat 1 Module | 3V ~ 3.6V | - | 3.8 V | - | 42Mbps | - | BeiDou, EDGE, Galileo, GLONASS, GPS, GNSS, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 700/800/850/900/1700/1800/1900/2100/2600 MHz | Industrial | 33dBm | Cellular, Navigation | Antenna Not Included | -110.5dBm | I²C, PCM, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150TS-1FCSG536I | Microchip Technology | Datasheet | 748 |
| Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | 1.2, 1.5, 1.8, 2.5, 3.3 V | RISC | Yes | - | - | 166 MHz | Microchip Technology | Yes | 1 | 293 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | 536 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Industrial | FPGA - 150K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-1FGG676 | Microchip Technology | Datasheet | 1648 |
| Min: 1 Mult: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-1FGG676 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-FG484 | Microchip Technology | Datasheet | 2007 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-FG484 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EG-L1FBVB900I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 6.2 Mbit | 11 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 204 I/O | 28800 LAB | 504000 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU7EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6EG-L1FFVB1156I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 6.9 Mbit | 25.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 328 I/O | 26825.5 LAB | 469446 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU6EG | 720 mV/850 mV | - | 24 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU4EG-L1FBVB900I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 2.6 Mbit | 4.5 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 204 I/O | 10980 LAB | 192150 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU4EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7CG-L1FBVB900I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5 | - | 6.2 Mbit | 11 Mbit | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 600 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 204 I/O | 28800 LAB | 504000 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU7CG | 720 mV/850 mV | - | 16 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z035-2FFG676E4860 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex A9 | - | 1 | 2 x 32 kB | 2 x 32 kB | 766 MHz | 21487.5 LAB | 275000 LE | Zynq | XC7Z045 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-1FFVC1760I4870 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 9.8 Mbit | 34.6 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 512 I/O | 65340 LAB | 1143450 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU19EG | 0.85 V | - | 48 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z020-3CLG400E4893 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex A9 | - | 1 | 2 x 32 kB | 2 x 32 kB | 866 MHz | 6650 LAB | 85000 LE | Zynq | XC7Z045 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EV-1SFVC784E4887 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 3.5 Mbit | 5.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | 0 C | SMD/SMT | 252 I/O | 14640 LAB | 256200 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU5EV | 0.85 V | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-2FFVC1760I4498 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 9.8 Mbit | 34.6 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 512 I/O | 65340 LAB | 1143450 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU19EG | 0.85 V | - | 48 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z007S-1CLG400I4873 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex A9 | - | 1 | 32 kB | 32 kB | 667 MHz | SMD/SMT | 1800 LAB | 23000 LE | Zynq | XC7Z045 | - | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2FFVC900I4895 | Xilinx | Datasheet | 556 | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5 | - | 8.8 Mbit | 32.1 Mbit | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 600 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 204 I/O | 34260 LAB | 599550 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU9CG | 0.85 V | - | 16 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU11EG-L1FFVC1156I4524 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 9.1 Mbit | 21.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 360 I/O | 37320 LAB | 653100 LE | Zynq UltraScale+ | XCZU11EG | 720 mV/850 mV | - | 20 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z030-2SB485I4872 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex A9 | - | 1 | 2 x 32 kB | 2 x 32 kB | 766 MHz | 9825 LAB | 125000 LE | Zynq | XC7Z045 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z007S-2CLG225I4539 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex A9 | - | 1 | 32 kB | 32 kB | 766 MHz | SMD/SMT | 1800 LAB | 23000 LE | Zynq | XC7Z045 | - | 1 Core |
EFR32MG1B231F256GM32-C0
Silicon Labs
Package:Embedded - System On Chip (SoC)
8.519423
BCM85652IFSBG
MaxLinear
Package:Embedded - System On Chip (SoC)
Price: please inquire
EG21GGB-MINIPCIE-S
Quectel
Package:Embedded - System On Chip (SoC)
72.326211
M2S150TS-1FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
685.169153
M2S090-1FGG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
411.392253
M2S050T-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU7EG-L1FBVB900I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU6EG-L1FFVB1156I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU4EG-L1FBVB900I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU7CG-L1FBVB900I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z035-2FFG676E4860
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU19EG-1FFVC1760I4870
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z020-3CLG400E4893
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU5EV-1SFVC784E4887
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU19EG-2FFVC1760I4498
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z007S-1CLG400I4873
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU9CG-2FFVC900I4895
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU11EG-L1FFVC1156I4524
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z030-2SB485I4872
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z007S-2CLG225I4539
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
