The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Supplier Device Package | Dielectric Material | Body Material | Number of Terminals | Center Contact Plating | Center Contact Material | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Lifecycle Status | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Turn Off Delay Time | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Termination | Connector Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Number of Rows | Gender | HTS Code | Fastening Type | Subcategory | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Depth | Reach Compliance Code | Current Rating | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Output Voltage | Housing Color | Lead Length | Operating Supply Voltage | Power Supplies | Temperature Grade | Inductance | DC Resistance (DCR) | Operating Supply Current | Impedance | Connector Style | Number of Ports | Speed | RAM Size | Output Current | Max Supply Current | Accessory Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Turn On Delay Time | Lead/Base Style | Architecture | Mating Cycles | Contact Termination | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Nominal Input Voltage | Product Type | Evaluation Kit | Includes | Max Dual Supply Voltage | Min Dual Supply Voltage | Insertion Loss | Number of Cells | Body Finish | Cable Group | Shield Termination | Primary Attributes | Isolation Voltage | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Max Charge Current | Product Category | Turns Ratio | Height | Length | Width | Radiation Hardening | Lead Free | Ratings |
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 | Mfr Part No XCVP1502-1LLIVSVA2785-ES9789 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-1LSIVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2002-1LLISFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2302-1MSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 16 | Xilinx | 1 | Xilinx | + 100 C | 0 C | Compliant | 450 ns | 75 Ω | 125 °C | -55 °C | SOC - Systems on a Chip | 800 mW | 18 V | 200 µA | 500 ns | System-On-Modules - SOM | 20 V | 4.5 V | SoC FPGA | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2302-3HSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 24 | Xilinx | 1 | Xilinx | + 100 C | 0 C | Compliant | Tape and Reel | SMD/SMT | 85 °C | -40 °C | SOC - Systems on a Chip | 15.88 mm | 880 mV | 1.5 mH | 800 mΩ | Gull Wing | System-On-Modules - SOM | 1.5 kV | SoC FPGA | 1:2.3 | 5.84 mm | 17.78 mm | 12.19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R24C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Silver | Free Hanging | - | 3 | - | Intel | 744 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | Solder | Plug | 3 | 125 °C | -55 °C | Bayonet | 46 A | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | Environment Proof | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | - | - | - | - | - | - | CBMUHF | TE Connectivity Laird | 720 | Bulk | Obsolete | - | - | Plug, Male Pin | Threaded | - | - | - | UHF, Mini | 1 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | Crimp | - | - | - | RG-58 | - | FPGA - 2.7M Logic Elements | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | Yazaki | 10000 | Yazaki | Intel | 720 | Tray | 7158-3721-90 | Active | Details | 0°C ~ 100°C (TJ) | Agilex F | - | Automotive Connectors | 1.4GHz | 256KB | Wire Seal | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Automotive Connectors | FPGA - 2.2M Logic Elements | - | Accessories | Automotive Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31C7N | ALTERA | Datasheet | 2319 |
| Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Non-Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 69.8 kΩ | 5CSEMA5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 85K Logic Elements | -- | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31C7N | ALTERA | Datasheet | 2068 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSXFC5D6F31C7N | 3 | MCU - 181, FPGA - 288 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.57 | Non-Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D4F40C4N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 46 | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB3D4F40C4N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 2 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | 15.5956 mm | COMMERCIAL EXTENDED | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5C6U23I7N | ALTERA | Datasheet | 1634 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | 672-FBGA | YES | 28 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | PRODUCTION (Last Updated: 1 month ago) | 5CSXFC5C6U23I7N | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.57 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | 17.65 V | 28 V | 1.1,1.2/3.3,2.5 V | 2.7 mA | 800MHz | 64KB | 4 A | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 28 V | Yes | 4 | FPGA - 85K Logic Elements | 85000 | -- | 5 A | 23 mm | 23 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F34E2SG | ALTERA | Datasheet | 485 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Glenair | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Glenair | 10AS027H3F34E2SG | 1.2 GHz | Yes | 3 | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964932 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 5.607090 oz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | Circular MIL Spec Tools, Hardware & Accessories | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | Circular MIL Spec Tools, Hardware & Accessories | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LSEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MSEVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | 0 C | Circular Connectors | 800 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | - 40 C | Details | Circular Connectors | 800 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 100 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1MSEVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 100 C | 0 C | Cable | 800 mV | Multi-Conductor Cables | Multi-Conductor Cables | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MLEVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 800 mV | Circular MIL Spec Tools, Hardware & Accessories | Circular MIL Spec Tools, Hardware & Accessories | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-3HSEVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 100 C | 0 C | Wire & Cable Management | 880 mV | System-On-Modules - SOM | Cable Mounting & Accessories |
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XCVP1502-1LLIVSVA2785-ES9789
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE1752-1LSIVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE2002-1LLISFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2302-1MSESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2302-3HSESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB027R31B2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R31C2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA5F31C7N
ALTERA
Package:Embedded - System On Chip (SoC)
246.268498
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5CSXFC5D6F31C7N
ALTERA
Package:Embedded - System On Chip (SoC)
348.785458
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5ASXBB3D4F40C4N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC5C6U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
293.364069
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10AS027H3F34E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,593.881149
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XCVM1302-2LSEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2MSEVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2MLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-1LSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1MSEVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2MLEVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-3HSEVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire