The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pressure Port | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Tolerance | Part Status | Type | Resistance | Max Operating Temperature | Min Operating Temperature | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Output Voltage | Output Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Lead Diameter | Voltage | Interface | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Accuracy | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Operating Pressure | Pressure Type | Port Size | Number of Logic Elements/Cells | Product Type | Core Architecture | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Product Category | Diameter | Height | Length | Width |
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![]() | Mfr Part No XCVC1502-2LLEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-2LLEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Cable | 700 mV | Multi-Conductor Cables | Multi-Conductor Cables | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2MSIVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | - 40 C | Circular Connectors | 800 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-1MLIVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | Glenair | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-1LSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 100 C | 0 C | MIL-Spec / MIL-Type | 700 mV | Rectangular MIL Spec Connectors | Rectangular MIL Spec Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1802-2MSIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | Measurement Specialties | 1 | TE Connectivity | AMD Xilinx | 500 | Tray | Active | Details | 0.780119 oz | -40°C ~ 100°C (TJ) | Tube | 154N | Sensors | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Pressure Sensors | Versal™ AI Core FPGA, 1.5M Logic Cells | - | Industrial Pressure Sensors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1902-2MSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | EPCOS / TDK | 1000 | EPCOS / TDK | + 200 C | AMD Xilinx | - 55 C | PCB Mount | 692 | Tray | B57540G0303F000 | Active | Details | 0°C ~ 100°C (TJ) | Bulk | B57540G | 1 % | NTC | 30 kOhms | Thermistors | 18 mW | Radial | 0.15 mm | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | NTC Thermistors | Versal™ AI Core FPGA, 1.9M Logic Cells | - | NTC Thermistors | 0.8 mm | 1.4 mm | 0.8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1802-2MLEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Vishay / Dale | 500 | Vishay | + 125 C | AMD Xilinx | - 40 C | PCB Mount | 692 | Tray | Active | N | 0.008245 oz | 0°C ~ 100°C (TJ) | Bulk | M / C / T | 0.2 % | NTC | 30 kOhms | Thermistors | Radial | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | NTC Thermistors | Versal™ AI Core FPGA, 1.5M Logic Cells | - | NTC Thermistors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU48DR-2FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Amphenol Positronic | 5 | Positronic | AMD Xilinx | 366 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | D-Sub Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Mixed Contact D-Sub Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | D-Sub Mixed Contact Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU47DR-L2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Active | Non-Compliant | -40°C ~ 100°C (TJ) | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1802-2MLEVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | Measurement Specialties | 10 | TE Connectivity | + 125 C | AMD Xilinx | - 40 C | 500 | Tray | Port | Active | In Transition | 1.340411 oz | 0°C ~ 100°C (TJ) | Bulk | EB100 | Sensors | 500 mV to 4.5 V | Analog | 30 V | 5 mA | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.1 % | MPU, FPGA | 5000 psi | Absolute | M10x1 Male | Pressure Sensors | Versal™ AI Core FPGA, 1.5M Logic Cells | - | Transducers | Industrial Pressure Sensors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H2F35I2SG | ALTERA | Datasheet | 542 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | TAIWAN SEMICONDUCTOR | 10AS027H2F35I2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965283 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | TO-252 (D-PAK) | Arria 10 SX | Active | 8542.39.00.01 | Ciss - 257.3pF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | VDS - 600V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEBA4U23C8N | ALTERA | Datasheet | 2242 |
| Min: 1 Mult: 1 | 672-FBGA | 484 | 672-UBGA (23x23) | TAIWAN SEMICONDUCTOR | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | SOT-23 | Cyclone® V SE | Active | 85 °C | 0 °C | 600 MHz | 1.1 V | Supply Voltage Maximum - 6V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R25A3E3E | Intel | Datasheet | 543 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z100-L2FFG900I | AMD | Datasheet | 464 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z100 | AMD | 130 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 444K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA023R25A2I2V | Intel | Datasheet | 596 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX040HH1F35E2LG | Intel | Datasheet | 512 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA022R25A2E3V | Intel | Datasheet | 628 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | No | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z045-2FFG676I | AMD | Datasheet | 472 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z045 | AMD | 130 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVP1502-1LSEVSVA2785 | AMD | Datasheet | 562 |
| Min: 1 Mult: 1 | 2785-BFBGA | 2785-BGA (50x50) | AMD | 702 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Versal® Premium | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - |
XCVC1502-2LLEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-2LLEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2MSIVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-1MLIVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1LSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1802-2MSIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1902-2MSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1802-2MLEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU48DR-2FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU47DR-L2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1802-2MLEVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS027H2F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,275.795723
5CSEBA4U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
128.226749
AGFB027R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
16,057.750722
XC7Z100-L2FFG900I
AMD
Package:Embedded - System On Chip (SoC)
3,321.594565
AGFA023R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
19,122.853072
1SX040HH1F35E2LG
Intel
Package:Embedded - System On Chip (SoC)
3,726.322882
AGFA022R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
16,327.776758
XC7Z045-2FFG676I
AMD
Package:Embedded - System On Chip (SoC)
2,578.186659
XCVP1502-1LSEVSVA2785
AMD
Package:Embedded - System On Chip (SoC)
25,508.825600
