The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No XCZU7EV-2FFVC1156E | Xilinx Inc. | Datasheet | 240 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z014S-1CLG400I | Xilinx Inc. | Datasheet | 2400 |
| Min: 1 Mult: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 125 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 65K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z035-L2FFG676I | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA2U23C7N | Intel | Datasheet | 8000 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S060TS-1FG484M | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | - | - | 166 MHz | + 125 C | - 55 C | Yes | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | This product may require additional documentation to export from the United States. | SmartFusion2 | 0.326090 oz | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG484M | Microchip Technology | Datasheet | 2176 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484M | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-1FFVB1156I | Xilinx Inc. | Datasheet | 1024 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 328 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U23C8SN | Intel | Datasheet | 183 |
| Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FG676I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | BGA-676 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Yes | SMD/SMT | 7193 LAB | 86316 LE | N | 1.071118 oz | Tray | SmartFusion2 | 512 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU2CG-1SFVC784I | Xilinx Inc. | Datasheet | 688 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23C6N | Intel | Datasheet | 4 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-L1SFVC784I | Xilinx Inc. | Datasheet | 13 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B784 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FCSG325 | Microchip Technology | Datasheet | 8 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | M2S025 | ARM Cortex M3 | 64 kB | 176 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z007S-2CLG225E | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z012S-1CLG485C | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 150 | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 485 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B485 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 55K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-L1CLG225I | Xilinx Inc. | Datasheet | 404 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | 86 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | S-PBGA-B225 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-2SFVC784E | Xilinx Inc. | Datasheet | 666 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U23C8N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC2C6U23C7N | Intel | Datasheet | 96 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSXFC6D6F31C6N | Intel | Datasheet | 2126 | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 896 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant |
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XCZU7EV-2FFVC1156E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z014S-1CLG400I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
93.325422
-
XC7Z035-L2FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
155.462460
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5CSEBA2U23C7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FG484M
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
395.846955
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XCZU15EG-1FFVB1156I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA4U23C8SN
Intel
Package:Embedded - System On Chip (SoC)
71.887350
-
M2S090TS-1FG676I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-1SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC6C6U23C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-L1SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-1FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
106.881475
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XC7Z007S-2CLG225E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z012S-1CLG485C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
134.380320
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XC7Z010-L1CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4CG-2SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,354.012737
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5CSEBA4U23C8N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC2C6U23C7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC6D6F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire