The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Number of Terminals | Base Product Number | Brand | Capacitance - nF | Capacitance - uF | Case Code - in | Case Code - mm | Class | Data RAM Size | Degree of protection (IP) | Degree of protection (NEMA) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Ir - Maximum Reverse Leakage Current | Ir - Reverse Current | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material quality | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pd - Power Dissipation | Product Status | Qualification | Reflow Temperature-Max (s) | Resistor Values | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Suitable for wall mounting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage Rating DC | Vz - Zener Voltage | Zz - Zener Impedance | Operating Temperature | Packaging | Series | Tolerance | Part Status | Termination | Temperature Coefficient | Max Operating Temperature | Min Operating Temperature | Number of Rows | HTS Code | Capacitance | Subcategory | Pitch | Technology | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Housing Color | Dielectric | Lead Spacing | Power Supplies | Temperature Grade | Configuration | ELV | Number of Circuits | Speed | RAM Size | Core Processor | Number of Resistors | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Circuit Type | Test Current | Seated Height-Max | Programmable Logic Type | Product Type | Operating Temperature Range | Primary Attributes | Zener Current | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Height | Length | Width | Radiation Hardening | Flammability Rating |
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 | Mfr Part No MCIMX351AVM5B | NXP | Datasheet | - | - | Min: 1 Mult: 1 | 400 | BI Technologies / TT Electronics | 1820 | TT Electronics | Details | Tray | 85 °C | -40 °C | Potentiometers, Trimmers & Rheostats | Potentiometers | Potentiometers | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU59DR-L2FSQF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | SOM-16 | 16 | Bourns | 2000 | Bourns | + 125 C | - 55 C | AEC-Q200 | 3.9 kOhms | Details | 0.035274 oz | Reel | 4800P | 2 % | 100 PPM / C | Resistors | SMD/SMT | 1.27 mm | 8 | Isolated | Resistor Networks & Arrays | - 55 C to + 125 C | Networks | Resistor Networks & Arrays | 2.03 mm | 9.53 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH3F35I2VG | Intel | Datasheet | 680 |
| Min: 1 Mult: 1 | 1206 (3216 metric) | 1152-FBGA (35x35) | Vishay / Vitramon | 1.5 nF | 0.0015 uF | 1206 | 3216 | Class 1 | 15000 | Vishay | + 125 C | Intel | - 55 C | 374 | Tray | Active | Details | 0.000952 oz | 100 VDC | -40°C ~ 100°C (TJ) | Reel | VJ W1BC Basic Comm | 1 % | Flexible (Soft) | 1500 pF | Capacitors | SMD/SMT | C0G (NP0) | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ceramic Capacitors | FPGA - 400K Logic Elements | - | General Type MLCCs | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 0.8 mm | 3.2 mm | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM53570B0IFSBG | Broadcom | Datasheet | 118 | - | Min: 1 Mult: 1 | - | - | Amphenol Positronic | 1 | Positronic | Broadcom Limited | - | Tray | Active | Details | - | - | D-Sub Connectors | Si | 1.25GHz | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | SERDES | ACL, MAC, QSGMII | MPU | Mixed Contact D-Sub Connectors | - | - | D-Sub Mixed Contact Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM53570B0KFSBG | Broadcom | Datasheet | 151 | - | Min: 1 Mult: 1 | - | - | Amphenol Positronic | 189 | Positronic | Broadcom Limited | - | Tray | Active | N | - | - | D-Sub Connectors | Si | 1.25GHz | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | SERDES | ACL, MAC, QSGMII | MPU | Mixed Contact D-Sub Connectors | - | - | D-Sub Mixed Contact Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB023R18A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | - | - | Intel | 480 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex I | Solder | 1 | 6.35 mm | Right Angle | 18 | Black | Compliant | 18 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MSEVSVD1760-ES9919 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | Yes | Versal | XCVM1802 | SOC - Systems on a Chip | FPGA - Field Programmable Gate Array | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384DUIFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | BCM3384 | Broadcom Limited | Tray | Obsolete | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35E2SG | ALTERA | Datasheet | 432 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H2F35E2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965334 | Active | NOT SPECIFIED | 5.43 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA019R25A2I3V | Intel | Datasheet | 711 | - | Min: 1 Mult: 1 | - | - | Steel | IP30 | Other | Other | Intel | 480 | Tray | Active | No | -40°C ~ 100°C (TJ) | Agilex F | 315 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | 1780 | 1215 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Intel | Bulk | Active | Non-Compliant | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C2E3V | Intel | Datasheet | 711 |
| Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1202-2MLEVSVA2785 | AMD | Datasheet | 599 | - | Min: 1 Mult: 1 | 2785-BFBGA | 2785-BGA (50x50) | ADLINK Technology | 1 | ADLINK Technology | AMD | 780 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | I/O Modules | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | I/O Modules | Versal™ Premium FPGA, 2M Logic Cells | - | Rear I/O Modules | I/O Modules | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVE1156I | AMD | Datasheet | 772 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Carlo Gavazzi | 4 | Carlo Gavazzi | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | GMB63 | Circuit Breakers | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Circuit Breakers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L2FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | TE Connectivity / Raychem | 1 | TE Connectivity | AMD | 464 | Tray | 328770-000 | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Circular Connectors | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Circular MIL Spec Strain Reliefs & Adapters | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | Circular MIL Spec Strain Reliefs & Adapters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-1SFVC784I | AMD | Datasheet | 605 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | TE Connectivity / Laird External Antennas | 1 | TE Connectivity | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | PT | Cable Assemblies | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | RF Cable Assemblies | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | RF Cable Assemblies | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-1SFVC784E | AMD | Datasheet | 770 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | Welwyn Components / TT Electronics | 250 | TT Electronics | AMD | PCB Mount | 252 | Tray | Active | Details | 0.008466 oz | 0°C ~ 100°C (TJ) | Ammo Pack | RC | Resistors | Metal Film | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Metal Film Resistors | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | Metal Film Resistors - Through Hole | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Welwyn Components / TT Electronics | 1206 | 3216 | 3000 | TT Electronics | Intel | PCB Mount | 480 | Tray | Active | 0.000705 oz | 0°C ~ 100°C (TJ) | Reel | PWC | Resistors | Thick Film | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Thick Film Resistors | FPGA - 2.3M Logic Elements | - | - | Thick Film Resistors - SMD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FSVG1517E | Xilinx | Datasheet | 288 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C2I1V | Intel | Datasheet | 658 | - | Min: 1 Mult: 1 | SOT-23-3 | - | Panjit | 12000 | 0.1 uA | 0.1 uA | Panjit | + 150 C | Intel | - 55 C | SMD/SMT | 576 | Tray | 300 mW | Active | Details | 0.000296 oz | 22 V | 55 Ohms | -40°C ~ 100°C (TJ) | Reel | Agilex F | Diodes & Rectifiers | Dual Common Anode | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 5 mA | Zener Diodes | FPGA - 573K Logic Elements | 0.1 uA | - | Zener Diodes | 1 mm | 3.04 mm | 1.4 mm |
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MCIMX351AVM5B
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XQZU59DR-L2FSQF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX040HH3F35I2VG
Intel
Package:Embedded - System On Chip (SoC)
2,258.272480
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BCM53570B0IFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM53570B0KFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB023R18A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-1MSEVSVD1760-ES9919
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3384DUIFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H2F35E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,955.759400
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AGFA019R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24C2E3V
Intel
Package:Embedded - System On Chip (SoC)
13,135.567891
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XCVP1202-2MLEVSVA2785
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
17,655.618585
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XCZU7EG-L2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
2,069.211570
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XCZU5EV-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
1,614.951989
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AGID023R18A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire