The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Number of Pins | Supplier Device Package | Material | Resistive Material | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Part # Aliases | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Tradename | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Color | Gender | Power (Watts) | Subcategory | Voltage - Supply | Orientation | Reach Compliance Code | Frequency | Frequency Stability | Output | Termination Style | Function | Base Resonator | Current - Supply (Max) | Number of Contacts | Actuator Type | Operating Supply Voltage | Failure Rate | Current - Supply (Disable) (Max) | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Bushing Thread | Adjustment Type | Number of Logic Elements/Cells | Product Type | Number of Turns | Taper | Core Architecture | Speed Grade | Built in Switch | Number of Transceivers | Absolute Pull Range (APR) | Actuator Diameter | Primary Attributes | Rotation | Number of Gangs | Number of Cores | Resistance (Ohms) | LED | Flash Size | Features | Product Category | Height Seated (Max) | Length | Actuator Length | Radiation Hardening | Ratings |
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 | Mfr Part No 10AS048K1F35I1HG | ALTERA | Datasheet | 710 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K1F35I1HG | 1.2 GHz | + 100 C | Omron Automation and Safety | - 40 C | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | Bulk | 965067 | Active | Obsolete | 5.68 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 36 Tranceiver | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048K2F35E1HG | ALTERA | Datasheet | 776 |
| Min: 1 Mult: 1 | 0402 (1005 Metric) | 0402 | RK73B1E | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K2F35E1HG | 1.2 GHz | + 100 C | KOA Speer Electronics, Inc. | 0 C | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 965068 | Active | Active | 5.68 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -55°C ~ 155°C | Tray | RK73B | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±5% | Active | 2 | ±200ppm/°C | 3.9 kOhms | Thick Film | 0.1W, 1/10W | SOC - Systems on a Chip | unknown | 950 mV | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 36 Tranceiver | FPGA - 480K Logic Elements | 2 Core | -- | Automotive AEC-Q200 | SoC FPGA | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U23C8N | ALTERA | Datasheet | 2400 |
| Min: 1 Mult: 1 | Cable | 672-FBGA | 484 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Bulk | Cyclone® V SE | Active | Crimp | 85 °C | 0 °C | Male | Straight | 600 MHz | 14 | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 25000 | ARM | FPGA - 25K Logic Elements | -- | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCVG484E | Microchip | Datasheet | 1910 |
| Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | Microchip Technology / Atmel | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-L1SBVA484I | AMD | Datasheet | 704 |
| Min: 1 Mult: 1 | Surface Mount | 6-SMD, No Lead | 484-FCBGA (19x19) | XCZU3 | AMD | 82 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 3.3V | 166.6MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 55mA | 35mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVC1760I | AMD | Datasheet | 599 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU11 | AMD | 512 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | Active | XO (Standard) | 1.8V | 33.33333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVC1760I | AMD | Datasheet | 657 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | -- | AMD | 512 | Tray | Active | -40°C ~ 100°C (TJ) | * | Active | -- | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-1FFVB1517I | AMD | Datasheet | 550 | - | Min: 1 Mult: 1 | Panel Mount | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Carbon | XCZU19 | -- | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Bulk | RV4 | ±10% | Active | -- | -- | 2W | Solder Lug | Slotted | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3/8-32 | User Defined | 1 | Linear | None | 0.249 (6.32mm) | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | 314° | 1 | 100k | - | 0.875 (22.23mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Nylon | XCZU4 | -- | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | RL2 | Active | -- | White | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | All Rectangular LEDs | - | 0.330 (8.38mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LLEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSIVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MLIVSVD1760 | AMD | Datasheet | 400 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 748 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MSIVSVA2197 | AMD | Datasheet | 640 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2HSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MSENBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LSENBVB1024 | AMD | Datasheet | 597 |
| Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LSEVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD Xilinx | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
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10AS048K1F35I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
6,681.767889
-
10AS048K2F35E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
5,010.601509
-
5CSEBA2U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
100.701060
-
MPFS250T-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
361.760038
-
XCZU3EG-L1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
730.569639
-
XCZU11EG-1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-2FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
9,326.420757
-
XCZU19EG-1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2LLEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1LSIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
11,103.578433
-
XCVM1802-1MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
11,439.568702
-
XCVM1402-2HSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1MSENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2LSENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
4,892.527368
-
XCZU43DR-1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-1LSEVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire