The category is 'Embedded - System On Chip (SoC)'
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- Series
- Package / Case
- Number of I/Os
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- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Architecture | Data Bus Width | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Core Architecture | Number of Gates | Boundary Scan | RAM (words) | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Bus Compatibility | Number of Equivalent Gates | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No XA7Z010-1CLG400I | Xilinx Inc. | Datasheet | 240 | - | Min: 1 Mult: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 400 | 130 | Automotive grade | -40°C~100°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 28K Logic Cells | N | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F200M3F-1CS288I | Microchip Technology | Datasheet | 70 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CS288I | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 2000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 1.56 | N | No | 1.575 V | 1.425 V | 1.5 V | SmartFusion | -40°C ~ 100°C (TJ) | Tray | A2F200 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-PQ208I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | 80 MHz | ARM Cortex M3 | 64 kB | 24 | MICROSEMI CORP | - | - | A2F200M3F-PQ208I | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 113 I/O | - | 2000 LE | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 20 | 5.61 | N | No | 1.575 V | 1.425 V | 1.5 V | SmartFusion | -40°C ~ 100°C (TJ) | Tray | A2F200 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1VFG400I | Microchip Technology | Datasheet | 2056 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 207 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2FBVB900E | Xilinx Inc. | Datasheet | 105 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS016E4F27E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.25mm | 27mm | 27mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7Z010-1CLG400Q | Xilinx Inc. | Datasheet | 648 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | 400 | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 28K Logic Cells | N | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z030-1FB484I | Xilinx Inc. | Datasheet | 2107 |
| Min: 1 Mult: 1 | 11 Weeks | 484-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Bulk | 2009 | Zynq®-7000 | no | Active | 2A (4 Weeks) | 484 | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | S-PBGA-B484 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXFB5H4F40I3N | Intel | Datasheet | 3 | - | Min: 1 Mult: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | -40°C~100°C TJ | Tray | Arria V SX | e1 | Active | 3 (168 Hours) | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | NOT SPECIFIED | 5ASXFB5 | S-PBGA-B1517 | 1.18V | 1.12V | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 2.7mm | 40mm | 40mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEMA6F31C8N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-VFG400I | Microchip Technology | Datasheet | 1626 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060TS-VFG400I | 166 MHz | Microchip Technology | Yes | 3 | 207 | 4710 LAB | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA5U23C8N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 672 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU4EG-L2SFVC784E | Xilinx Inc. | Datasheet | 77 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B784 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC2C6U23I7N | Intel | Datasheet | 2007 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC2 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-2SFVC784I | Xilinx Inc. | Datasheet | 746 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23A7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Yes | SMD/SMT | 2308 LAB | 27696 LE | Details | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31C6N | Intel | Datasheet | 2269 | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 896 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS066H3F34E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z100-L2FFG900I | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 900 | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 120 ps | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 444K Logic Cells | 554800 | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | 31mm | ROHS3 Compliant |
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XA7Z010-1CLG400I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-1CS288I
Microchip Technology
Package:Embedded - System On Chip (SoC)
85.354438
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A2F200M3F-PQ208I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-2FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E4F27E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XA7Z010-1CLG400Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
79.963123
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XC7Z030-1FB484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
414.952827
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5ASXFB5H4F40I3N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA6F31C8N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
169.207005
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5CSEBA5U23C8N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-L2SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC2C6U23I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EG-2SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,681.720945
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5CSXFC6C6U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1VFG400I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC5D6F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066H3F34E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z100-L2FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
290.290336