The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Display | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Applications | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Output | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | IP Rating | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU2CG-L1SBVA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU5EV-L1SFVC784I | AMD | Datasheet | 673 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU5 | 0.742 V | AMD | 0.698 V | 252 | Tray | Active | 0.7200 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microchip | Datasheet | 2145 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S025 | No Display | Honeywell | C7772G1004/U | Microchip Technology | 138 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | Indoor | 10 kOhm NTC | Temperature | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-L2FBVB900E | AMD | Datasheet | 788 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | Miscellaneous | 0.876 V | AMD | 0.825 V | 204 | Tray | Active | 0.8500 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L2SBVA484E | AMD | Datasheet | 507 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Aluminum | XCZU3 | Grace Technologies | P-D4-H3R3 | AMD | 82 | (1) 120V Receptacle | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | IP65 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG896I | Microchip | Datasheet | 1696 |
| Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | Electri-Flex | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 896 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | 100 MHz | 200000 | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-1PQG208I | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 5.59 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | Yes | Pure Matte Tin (Sn) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVB1517E | AMD | Datasheet | 750 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Turck | RSM40RKM50-10M/S1587/BL67 | 0.892 V | AMD | 0.808 V | 488 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-L1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU3 | Murrelektronik | 7000-08701-3170750 | 0.742 V | AMD | 0.698 V | 128 | Tray | Active | 0.7200 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-TQG144 | Microchip | Datasheet | 300 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S005 | Microchip Technology / Atmel | 64 kB | 191 kbit | 60 | - | - | Microchip | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 84 | 505 LAB | 6060 LE | Tray | Active | Details | 0.035380 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-CSG288 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-CSG288 | 85 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 8.46 | 1.575 V | 1.425 V | 1.5 V | 8542.39.00.01 | CMOS | BOTTOM | BALL | 0.5 mm | compliant | S-PBGA-B288 | OTHER | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1FGG256 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.8 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG484I | Microchip | Datasheet | 2048 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1CSG288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1CSG288I | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 30 | 5.25 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 260 | 0.5 mm | compliant | S-PBGA-B288 | 68 | Not Qualified | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG400I | Microchip | Datasheet | 1859 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 207 | 56520 LE | Tray | Active | Non-Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG400I | Microchip | Datasheet | 1925 | - | Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S025 | Microchip Technology / Atmel | 64 kB | 90 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | Active | Details | 0.227784 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-CS288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-CS288I | PLASTIC/EPOXY | TFBGA | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, BGA-288 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 20 | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 68 | Not Qualified | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1FG256 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG256I | Microchip | Datasheet | 39 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-TQG144I | 3 | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 30 | 8.63 | Yes | 1.575 V | 1.425 V | 1.5 V | e3 | PURE MATTE TIN (394) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | S-PQFP-G144 | 33 | Not Qualified | 1.5,1.8,2.5,3.3 V | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 20 mm | 20 mm |
-
XCZU2CG-L1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU5EV-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
2,309.755113
-
M2S025TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
207.875762
-
XCZU7EV-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
4,650.399802
-
XCZU3CG-L2SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FG896I
Microchip
Package:Embedded - System On Chip (SoC)
223.451275
-
A2F200M3F-1PQG208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-1FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-CSG288
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-CS288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire