The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Number of Terminals | Angle | Approvals | Base Product Number | Brand | Cable Style | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | Grip Type | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of I/Os | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Shaft Type | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | Size / Dimension | Part Status | Termination | Type | Composition | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Output | Pin Count | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Output Voltage | Output Type | Operating Supply Voltage | Temperature Grade | Current - Supply (Disable) (Max) | Speed | RAM Size | Core Processor | Peripherals | Spread Spectrum Bandwidth | Connectivity | Architecture | Data Bus Width | Seated Height-Max | Programmable Logic Type | Product Type | Screening Level | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Number of Registers | Number of Cores | Flash Size | Connection Type | Input Voltage | Product Category | Bearings | IP Rating | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No XCVC1502-2LLEVSVA1596 | AMD | Datasheet | 650 |
| Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MSENBVB1024 | AMD | Datasheet | 423 |
| Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MLEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z020-3CLG484E | AMD | Datasheet | 1832 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | CE | XC7Z020 | Honeywell | VH3G7LEF2/M | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 866MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | Lug | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R16A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Nickel Plated Brass | Straight | CSA, UL | Round | Bushing Grip | Pepperl Fuchs | 291378 | 11.94 mm | Intel | 4.06 mm | 384 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Metallic | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | IP66, IP68 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-2SFVC784I | AMD | Datasheet | 544 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | Miscellaneous | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX065HH3F35I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Hubbell | IN430FS1 | Intel | 392 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MSENSVG1369 | AMD | Datasheet | 776 |
| Min: 1 Mult: 1 | CE, CSA, UL | Cutler Hammer, Div of Eaton Corp | PDG23F0150P3YK | AMD | Panel | 478 | Tray | Active | Versal™ AI Core | 150 A | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1FBVB900E | AMD | Datasheet | 513 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | CE | XCZU4 | Dynapar | HS35R05009141 | AMD | Hollowshaft | 204 | Tray | Active | Yes | Hollow | -40 to 85 Degrees C | Zynq® UltraScale+™ MPSoC EV | 7 Pin Connector | 5~26 VDC | Differential | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 5~26 VDC | Yes | IP67 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVC900E | AMD | Datasheet | 579 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVB1156E | AMD | Datasheet | 603 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | 0.892 V | AMD | 0.808 V | 328 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SFVA625I | AMD | Datasheet | 1892 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | 154,350 | 180 | 0.892 V | AMD | 0.808 V | 180 | Bulk | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 625 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 141,120 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-3FFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | 599,550 | 1.03 V | AMD | 0.97 V | 204 | Tray | Active | FCBGA | 1.0000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 900 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 548,160 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-L2FFVB1156E | AMD | Datasheet | 673 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU15 | 0.742, 0.892 V | AMD | 0.698, 0.808 V | 328 | Tray | Active | 0.72, 0.85 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FGG484I | Microchip | Datasheet | 1612 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A06G037GNP#AA0 | Renesas | Datasheet | 8026 |
| Min: 1 Mult: 1 | 64-VFQFN Exposed Pad | Renesas Electronics | 25 | 128 kB | 128 kB | Renesas Electronics | 138 MHz, 276 MHz | + 85 C | Renesas Electronics America Inc | - 40 C | Yes | SMD/SMT | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 85°C (TA) | Tray | - | Microprocessors - MPU | 1.1 V | 128KB | ARM® Cortex®-M3 | PWM | 32 bit | Microprocessors - MPU | - | 2 Core | - | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-1FFVC900E | AMD | Datasheet | 502 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | Acme Electric | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H1F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-SMD, No Lead | YES | 1152-FBGA (35x35) | 1152 | 580 | INTEL CORP | Intel Corporation | 10AS027H1F34E1SG | CTS-Frequency Controls | 384 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 85°C | Tray | 580 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Discontinued at Digi-Key | TCXO | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1 mm | compliant | 16 MHz | ±280ppb | Clipped Sine Wave | S-PBGA-B1152 | Standby (Power Down) | Crystal | 6mA | OTHER | 10µA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 270K Logic Elements | -- | 0.079 (2.00mm) | 35 mm | 35 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-L1FFVC900I | AMD | Datasheet | 623 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1SFVA625E | AMD | Datasheet | 35 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU2 | 103,320 | 180 | 0.892 V | AMD | 0.808 V | 180 | Tray | Active | FCBGA | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 1 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 94,464 | - |
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XCVC1502-2LLEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
27,201.807602
-
XCVM1302-2MSENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
4,086.638955
-
XCVC1802-2MLEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z020-3CLG484E
AMD
Package:Embedded - System On Chip (SoC)
186.189058
-
AGFB008R16A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,371.141576
-
1SX065HH3F35I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1502-2MSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
15,337.474405
-
XCZU4EV-1FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
1,660.140669
-
XCZU9CG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
4,073.397248
-
XCZU3CG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
518.469506
-
XCZU9EG-3FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU15EG-L2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
418.394854
-
R9A06G037GNP#AA0
Renesas
Package:Embedded - System On Chip (SoC)
5.390683
-
XCZU6EG-1FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H1F34E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9EG-L1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
3,903.442446
-
XCZU2EG-1SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire