The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Material | Insert Material | Number of Terminals | Approvals | Base Product Number | Brand | Contact Sizes | Data RAM Size | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | I/O Voltage | Ihs Manufacturer | Input Frequency | Instruction Set Architecture | Isolation Voltage (Min) | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature Max Deg. C | Operating Temperature Min Deg. C | Operating Temperature-Max | Operating Temperature-Min | Output Power (Max) | Outside Length | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Depth (mm) | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Usage Level | Voltage Rated | Voltage-Input | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Composition | Color | Applications | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Shell Finish | Pin Count | Shell Size - Insert | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Efficiency | Output Voltage | Housing Color | Output Type | Operating Supply Voltage | Circuit | Lead Spacing | Power Supplies | Temperature Grade | Note | Voltage | Speed | RAM Size | Output Current | Shell Size, MIL | Lead Style | Core Processor | Number of Poles | Peripherals | Program Memory Size | Connectivity | Output Power | Switch Type | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Voltage - Load | Max Frequency | Screening Level | Speed Grade | Load Current | Primary Attributes | Number of Bands | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Disconnect Type | Features | Nominal Input Voltage (AC) | Input Voltage | Product Category | IP Rating | Product Length (mm) | Height Seated (Max) | Length | Width | Thickness (Max) | Product Height (mm) | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU6CG-1FFVC900I | AMD | Datasheet | 672 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVB1156I | AMD | Datasheet | 404 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | 0.892 V | AMD | 0.808 V | 328 | Bulk | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-1FFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU15 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVC900I | AMD | Datasheet | 480 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Continental Belt | 11/5V2650 | Microchip Technology | MCU - 25, FPGA - 66 | 265 Inches | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484M | Microchip | Datasheet | 481 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | CUL, UL | M2S090 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DH361UGK | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | Metallic | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 30 A | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 600 V | 166MHz | 64KB | ARM® Cortex®-M3 | 3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Heavy Duty | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100S-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | ABB | ACH580-BCR-046A-2+B056 | Panel | ACH580BX122 | 500 Hz | Circuit Breaker | 240 VAC | IP55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-L2FFG676I | AMD | Datasheet | 642 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 0402 (1005 Metric) | 676-FCBGA (27x27) | XC7Z030 | 125,000 | Contains lead / RoHS non-compliant | 250 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Tray | Active | FCBGA | 1.0000 V | Industrial grade | 25V | -55°C ~ 125°C | Tape & Reel (TR) | VJ HIFREQ | 0.040 L x 0.020 W (1.02mm x 0.51mm) | ±0.5pF | 1 (Unlimited) | C0G, NP0 | RF, Microwave, High Frequency | 0.9pF | 676 | - | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | Kintex™-7 FPGA, 125K Logic Cells | 157,200 | - | High Q, Low Loss | - | 0.024 (0.61mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R16A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-L2FFVH1760I | AMD | Datasheet | 524 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD60802F1-A11-BND-E2-A | Renesas | Datasheet | 1600 |
| Min: 1 Mult: 1 | Panel Mount | Bulkhead - Front Side Nut | Circular | Aluminum Alloy | Plastic | 22D | -- | Renesas Electronics America Inc | Bulk | Active | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, DTS | Active | -- | Receptacle Housing | For Male Pins | 128 | Threaded | Crimp | D | Shielded | Environment Resistant | Electroless Nickel | 25-35 | Silver | Contacts Not Included | -- | -- | -- | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5C6U23I7LN | ALTERA | Datasheet | 1726 |
| Min: 1 Mult: 1 | ABB | MP3-42L10F8 | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E4F29I3LG | ALTERA | Datasheet | 728 |
| Min: 1 Mult: 1 | Back Mount | FBGA-780 | YES | 5 | 780 | CSA, UL | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Turck | U-31412 | 1.2 GHz | 300 VAC, 300 VDC | Yes | SMD/SMT | 360 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964969 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5 A | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | IP67 | 0.5 m | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-3FBG676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | Plastic, ABS/PC Blend | XC7Z045 | DMB-4774 | 1.2, 3.3 V | Thumb-2 | -- | AMD | 2 | 130 | Tray | Active | 0 to 100 °C | DMB | -- | Active | Cover, Lid | Clear | 676 | 5.25, 4.75, 5 V | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-1FFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | DIN Rail | Module | -- | XCZU9 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 18 ~ 36VAC | -40 to 100 °C | Bulk | DR | Active | Screw Terminal | AC | SPST-NO (1 Form A) | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 24V ~ 280V | 1 | 3A | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | 47 to 63(Hz) | 3000VAC(V) | Microsemi Corporation | M2S050S-1FGG484I | 3 | Desktop | 60C | -10C | 120 W | Active | 97(mm) | No | 30 | 5.26 | Yes | Commercial grade | e1 | Regulated | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 250 | compliant | 1 | 85(%) | 24(V) | 5(A) | 120(W) | FIELD PROGRAMMABLE GATE ARRAY | Commercial | 85 to 132/170 to 265(V) | 110(mm) | 60(mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676IX417 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Non-Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1LSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1LSIVSVA2197 | AMD | Datasheet | 520 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MLENSVF1369 | AMD | Datasheet | 558 | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - |
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XCZU6CG-1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
2,581.108071
-
XCZU6CG-2FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
3,788.667774
-
XCZU15EG-1FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
3,352.744742
-
A2F500M3G-FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S100S-1FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z030-L2FFG676I
AMD
Package:Embedded - System On Chip (SoC)
571.891573
-
AGFA008R16A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-L2FFVH1760I
AMD
Package:Embedded - System On Chip (SoC)
36,751.758922
-
UPD60802F1-A11-BND-E2-A
Renesas
Package:Embedded - System On Chip (SoC)
13.329468
-
5CSXFC5C6U23I7LN
ALTERA
Package:Embedded - System On Chip (SoC)
359.316277
-
10AS027E4F29I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,498.138837
-
XC7Z045-3FBG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050S-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FG676IX417
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1LSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1LSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
12,235.729225
-
XCVM1402-2MLENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire