The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Base Product Number | Core | Data RAM Size | Data RAM Type | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Product Status | RoHS | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Operating Temperature | Packaging | Series | Type | Operating Frequency | Operating Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Architecture | Data Bus Width | Operating Temperature Range | Number of Transceivers | Sensitivity | Number of ADC Channels | Primary Attributes | Number of Timers | Number of Cores | Flash Size | ADC Resolution | Height | Length | Width |
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![]() | Mfr Part No XCZU3CG-1UBVA530I | Xilinx | Datasheet | 20000 | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Active | -40°C ~ 100°C (TJ) | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2EG-1UBVA530E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3EG-1UBVA530EES9819 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | 0 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | 850 mV | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3CG-1UBVA530E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-2FFVC1760E5132 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 9.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | 0 C | SMD/SMT | 560 I/O | 65340 LAB | 1143450 LE | 850 mV | 72 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2EG-2UBVA530E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2CG-2UBVA530I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Tray | Active | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2CG-2UBVA530E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Active | 0°C ~ 100°C (TJ) | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQZU47DR-L1FFQG1517I5149 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1517 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC32CX1012BZ25048-I/MYX | Microchip Technology | Datasheet | 793 |
| Min: 1 Mult: 1 | QFN-48 | PIC32CX1012 | ARM Cortex M4 | 128 kB | SRAM | 416 | GPIO, I2C, QSPI, SPI, UART | 64 MHz | 2 Mb/s | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 29 I/O | Tray | Active | Details | 40.6 mA | 96.7 mA | 3.6 V | 1.9 V | Tray | - | Bluetooth, Zigbee | 2.4 GHz | 1.9 V to 3.6 V | Flash | 1 MB | 12 dBm | 32 bit | - 40 C to + 85 C | - 96 dBm | 8 Channel | 4 Timer | 12 bit | 0.9 mm | 7 mm | 7 mm | |||||||||||||||||||||
![]() | Mfr Part No PIC32MZ1025W104132-I/NX | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | DQFN-132 | MIPS32 | 256 kB | SRAM | 168 | CAN, I2C, SPI, UART | 80 MHz | 54 Mbps | + 85 C | - 40 C | Yes | SMD/SMT | 64 I/O | 88 mA | 287 mA | 3.63 V | 2.97 V | Tray | Wi-Fi | 2.4 GHz | Flash | 1 MB | 21.5 dBm | 32 bit | - 76 dBm | 20 Channel | 12 bit | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250T-1FCSG536EES | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FCSG-536 | 536-LFBGA | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 667 MHz | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250T-1FCVG784EES | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FCVG-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 667 MHz | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250T-FCVG484EES | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 667 MHz | + 100 C | Microchip Technology | 0 C | Yes | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z030-3FBG676E5212 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-676 | ARM Cortex A9 | 256 kB | 1 | 32 kB | 32 kB | 866 MHz | + 100 C | 0 C | SMD/SMT | 130 I/O | 9825 LAB | 125000 LE | 2 Core | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQZU47DR-2FFQE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQZU49DR-L1FSQF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQZU48DR-1FFQE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU49DR-L1FSVF1760IES9818 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 674 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQZU49DR-L1FSRF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core |
XCZU3CG-1UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU2EG-1UBVA530E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU3EG-1UBVA530EES9819
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU3CG-1UBVA530E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU19EG-2FFVC1760E5132
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU2EG-2UBVA530E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU2CG-2UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU2CG-2UBVA530E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQZU47DR-L1FFQG1517I5149
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
PIC32CX1012BZ25048-I/MYX
Microchip Technology
Package:Embedded - System On Chip (SoC)
2.482454
PIC32MZ1025W104132-I/NX
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS250T-1FCSG536EES
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS250T-1FCVG784EES
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS250T-FCVG484EES
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z030-3FBG676E5212
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQZU47DR-2FFQE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQZU49DR-L1FSQF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQZU48DR-1FFQE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU49DR-L1FSVF1760IES9818
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQZU49DR-L1FSRF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
