The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
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- Series
- Package / Case
- Number of I/Os
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- Connectivity
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Base Product Number | Contact Sizes | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Connector Type | Type | Number of Positions | Terminal Finish | HTS Code | Fastening Type | Subcategory | Contact Type | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Housing Color | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Note | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Includes | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Features | Height Seated (Max) | Length | Width | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU7EG-2FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1517-FCBGA (40x40) | XCZU7 | AMD | 464 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 2.5V | 24MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 70µA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-L2SFVC784E | AMD | Datasheet | 688 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 2.8V | 24MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 70µA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | -- | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVB1517E | AMD | Datasheet | 611 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 1.8V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 10µA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-L1SBVA484I | AMD | Datasheet | 704 |
| Min: 1 Mult: 1 | Surface Mount | 6-SMD, No Lead | 484-FCBGA (19x19) | XCZU3 | AMD | 82 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 3.3V | 166.6MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 55mA | 35mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVC1760I | AMD | Datasheet | 599 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU11 | AMD | 512 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | Active | XO (Standard) | 1.8V | 33.33333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SFVC784I | AMD | Datasheet | 2111 |
| Min: 1 Mult: 1 | Panel Mount | 784-BFBGA, FCBGA | Flange | Circular | Aluminum | 784-FCBGA (23x23) | - | TVP00RW | 20 | Amphenol Aerospace Operations | 252 | Bulk | Active | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Male Pins | 41 | Threaded | Crimp | A | Shielded | Environment Resistant | Cadmium | 21-41 | Olive Drab | Contacts Not Included | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D4F31I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXBB3D4F31I5N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B896 | 250 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG484 | Microchip | Datasheet | 2006 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | A2F200 | Microchip Technology | MCU - 41, FPGA - 94 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F35C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXBB5D4F35C6N | MCU - 208, FPGA - 385 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1152 | 385 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2MLEVSVA2197 | AMD | Datasheet | 720 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-3FFVD1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | AMD | 308 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-1SFVC784I | AMD | Datasheet | 500 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVD1760E | AMD | Datasheet | 588 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 308 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-L1FFVB1517I | AMD | Datasheet | 602 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG484I | Microchip | Datasheet | 1981 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-L2FBVB900E | AMD | Datasheet | 518 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-VFG400 | Microchip | Datasheet | 32 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010TS-VFG400 | 166 MHz | Microchip Technology | 3 | 195 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSENBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU57DR-L1FSVE1156I | AMD | Datasheet | 757 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MSINSVF1369 | AMD | Datasheet | 708 | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - |
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XCZU7EG-2FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5EV-L2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
2,580.425931
-
XCZU17EG-1FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
4,302.548580
-
XCZU3EG-L1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
730.569639
-
XCZU11EG-1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU2CG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
480.939949
-
5ASXBB3D4F31I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB5D4F35C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-2MLEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-3FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,254.148268
-
XCZU17EG-1FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-L1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EG-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
2,392.315318
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M2S010TS-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
92.122374
-
XCVM1302-1LSENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU57DR-L1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
18,744.376740
-
XCVM1302-2MSINSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire