The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Material | Housing Material | Shape | Number of Terminals | Base Product Number | Brand | Contact Finish Mating | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Product Style | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Composition | Color | Power (Watts) | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Pitch | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Interface | Plating | Attachment Method | Connector Style | Speed | RAM Size | Shell Size, MIL | Accessory Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Terminal Type | Product Type | Includes | Speed Grade | Convert From (Adapter End) | Convert To (Adapter End) | Housing Finish | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Number of Positions (Convert From) | Orientation (Convert From) | Shell Size - Insert (Convert From) | Orientation (Convert To) | Number of Positions (Convert To) | Features | Shell Size - Insert (Convert To) | Product Category | Height | Height Seated (Max) | Length | Width | Plating Thickness | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No XCZU7EV-L2FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1156-BBGA, FCBGA | - | Aluminum Alloy | 1156-FCBGA (35x35) | CA310 | Silver | ITT Cannon, LLC | 360 | Bulk | Metal | Active | 50V | -55°C ~ 125°C | MIL-DTL-5015, CA | Crimp | Plug, Male Pins | 10 | Olive Drab | Threaded | 22A | N (Normal) | - | IP65 - Dust Tight, Water Resistant | Olive Drab Cadmium | 18-19 | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | Shrink Boot Adapter | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 366 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FSVH1760E | AMD | Datasheet | 653 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | -- | AMD | 574 | Tray | Active | 0°C ~ 100°C (TJ) | -- | Active | 533MHz, 1.333GHz | 256KB | -- | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-3FBVB900E | AMD | Datasheet | 417 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-1SBVA484Q | AMD | Datasheet | 568 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XAZU3 | AMD | 128 | Tray | Active | -40°C ~ 125°C (TJ) | * | Active | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AMN3T1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225I | AMD | Datasheet | 90 | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | Beryllium Copper | -- | XC7Z007 | AMD | 54 | Tray | Active | 121°C | Slot Mount | Active | Fingerstock | Zinc + Clear Chromate | Slot | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | 0.130 (3.30mm) | 0.975 (24.77mm) | 0.370 (9.40mm) | 299.21µin (7.60µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LSEVSVA2197 | AMD | Datasheet | 558 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C3E3E | Intel | Datasheet | 578 |
| Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-1FCSG325T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 325-TFBGA | - | 325-BGA (11x11) | Thermoplastic | YAA | Amphenol LTW | MCU - 102, FPGA - 80 | Bulk | Active | - | - | M12 | Threaded | - | Unshielded | IP68 - Dust Tight, Waterproof | - | Distributor Y-Shaped | - | 230.4KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | Male Pins | Female Sockets (2) | - | FPGA - 23K Logic Modules | 128KB | 6 | A | M12 | A | 6 (2) | Coupling Nut | M12 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSEVFVC1760 | AMD | Datasheet | 432 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Glenair | 378 | Retail Package | Active | 0°C ~ 100°C (TJ) | * | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-3FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MIMX8MQ7DVAJZAB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | IC Socket Adapters | SIP Sockets Adapters | 2.54mm Pitch | Serial I2C/PCIe/SPI/ | 64 Bit | 188 | SIP Sockets Adapters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FC1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | MICROSEMI CORP | Microsemi Corporation | M2S150TS-1FC1152M | Vishay Dale | 574 | 125 °C | -55 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | e0 | 2 | 3A001.A.2.C | ±25ppm/°C | 3.65 kOhms | Tin/Lead (Sn/Pb) | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | S (0.001%) | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCVG484E | Microchip | Datasheet | 1910 |
| Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | Microchip Technology / Atmel | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | Microchip | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34E1HG | ALTERA | Datasheet | 531 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H2F34E1HG | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 973530 | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-1MSIVSVA1596 | AMD | Datasheet | 528 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | INTEL CORP | Brady | RAG24150 | 240 | 100 °C | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | BGA672,26X26,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.68 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | -- | 27 mm | 27 mm |
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XCZU7EV-L2FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-2FSVH1760E
AMD
Package:Embedded - System On Chip (SoC)
27,281.099924
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XCZU5EG-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,972.092654
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XAZU3EG-1SBVA484Q
AMD
Package:Embedded - System On Chip (SoC)
1,108.279114
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LS1046AMN3T1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z007S-1CLG225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
6,534.327505
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MPFS025T-1FCSG325T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-1LSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MIMX8MQ7DVAJZAB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-1FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS250T-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
361.760038
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AGIB027R31B2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066H2F34E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
4,540.869585
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XCVC1702-1MSIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
22,915.337335
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10AS016E3F27E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire