The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | # I/Os (Max) | Base Product Number | Base/Housing Material | Body Orientation | Brand | Contact Materials | Data RAM Size | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | Family Name | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Switching Regulator | Termination Method | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage Rating (DC) | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Gender | Power (Watts) | Additional Feature | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Lead Pitch | Number of Contacts | Output Voltage | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Power Supplies | Temperature Grade | Lead Diameter | Interface | Ripple Current | Memory Size | Life (Hours) | Number of Ports | Speed | RAM Size | Output Current | Core Processor | Peripherals | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Total RAM Bits | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Resistance Tolerance | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Repetitive Peak Reverse Voltage | Flash Size | Features | Input Voltage | Product Category | Product Length | Product Width | Device Core | Diameter | Height Seated (Max) | Length | Width |
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 | Mfr Part No 5CSXFC6D6F31I7NES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0603 (1608 Metric) | 896 | 0603 | RN731J | KOA Speer Electronics, Inc. | MCU - 181, FPGA - 288 | Tape & Reel (TR) | Obsolete | Compliant | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.05% | Obsolete | 2 | ±25ppm/°C | 1.91 kOhms | 100 °C | -40 °C | Thin Film | 0.063W, 1/16W | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 6 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 41509 | 7 | 9 | FPGA - 110K Logic Elements | -- | Moisture Resistant | 0.022 (0.55mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2E3VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1802-2MLELSVC4072 | AMD | Datasheet | 501 |
| Min: 1 Mult: 1 | AMD | 780 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | - | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Tin | Through Hole | - | - | Intel | 744 | Tray | Active | Compliant | 200 V | -40°C ~ 100°C (TJ) | Bulk | Agilex F | 20 % | Radial | 105 °C | -40 °C | 47 µF | 7.5 mm | 4 Ω | 800 µm | 210 mA | 3000 hours | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-1FBVB900I | AMD | Datasheet | 435 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-2FBG484I | AMD | Datasheet | 1895 |
| Min: 1 Mult: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | XC7Z030 | 1.2, 3.3 V | Thumb-2 | AMD | Surface Mount | 2 | 130 | Tray | Active | FCBGA | -40 to 100 °C | Zynq®-7000 | 200 ppm/K | 20 Ohm | 0.2 W | Pulse Proof, High Power | 484 | 5.5, 3 V | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | 5 | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-L2FFG900I | AMD | Datasheet | 583 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z045 | 350,000 | 362 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Tray | Active | FCBGA | 1.0000 V | Industrial grade | -40 to 100 °C | Zynq®-7000 | 200 ppm/K | 1 MOhm | 0.25 W | General Purpose | 900 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | 5 | Kintex™-7 FPGA, 350K Logic Cells | 437,200 | - | 3.2 | 1.6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-1FBG676C | AMD | Datasheet | 610 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z035 | 275,000 | 130 | AMD | Surface Mount | 130 | Tray | Active | FCBGA | 1.0000 V | Commercial grade | 0 to 85 °C | Zynq®-7000 | 50.0000 ppm/°C | 825 Ohm | 0.5 W | Industrial | 676 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Commercial | 1 | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | 6.1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z015-L1CLG485I | AMD | Datasheet | 167 | - | Min: 1 Mult: 1 | 485-LFBGA, CSPBGA | 485-CSPBGA (19x19) | XC7Z015 | 74,000 | 130 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Tray | Active | CSBGA | 1.0000 V | Industrial grade | -40 to 100 °C | Zynq®-7000 | 100 ppm/°C | 3.65 kOhm | 0.8 W | High Reliability | 485 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | 1 | Artix™-7 FPGA, 74K Logic Cells | 92,400 | - | 5 | 2.49 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD72874AGC-YEB-A | Renesas | Datasheet | 55 |
| Min: 1 Mult: 1 | Renesas Electronics America Inc | Bulk | Active | * | 50 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676I | Microchip | Datasheet | 1779 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152I | Microchip | Datasheet | 1843 |
| Min: 1 Mult: 1 | Gold | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 15 | M2S150 | PCT (Polychlorinated Terphenyl) | Right Angle | Microchip Technology / Atmel | Copper Alloy | 64 kB | 24 | MICROSEMI CORP | - | - | Microchip | M2S150T-1FC1152I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | 1.26 V | 1.14 V | 1.2 V | Solder | 1.2 V | 1.234218 oz | -55 to 125 °C | Tray | SmartFusion®2 | e0 | D-Subminiature | Tin/Lead (Sn/Pb) | Receptacle | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | 15 POS | 1.2 V | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG400I | Microchip | Datasheet | 2042 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | Through Hole | SMD/SMT | 207 | 27696 LE | Tray | Active | Eighth-Brick | Yes | -40 to 125 °C | SmartFusion®2 | Step Down | 8 | 1 | 3.3 V | 166MHz | 64KB | 20 A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 66 W | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | 36 to 75 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VFG400 | Microchip | Datasheet | 2049 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | 207 | M2S050 | 64 kB | SMARTFUSION2 | - | - | 56340 | 166 MHz | + 85 C | Microchip Technology | 0 C | Surface Mount | SMD/SMT | 207 | 56340 | 56340 LE | 1.26(V) | 1.14(V) | 1.2(V) | 0C to 85C | 85C | 0C | COMMERCIALC | Tray | VFBGA | 65nm | Active | Yes | No | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | 400 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG484I | Microchip | Datasheet | 1762 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1FGG484I | Microchip | Datasheet | 4000 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-1FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | MSL 3 - 168 hours | 209 | 6060 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.79 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 191Kbit | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-TQ144 | Microchip | Datasheet | 2143 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S005-TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256I | Microchip | Datasheet | 134 | - | Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S005 | Microchip Technology / Atmel | 64 kB | 119 | MICROSEMI CORP | - | - | Microchip | M2S005S-VFG256I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 2.4 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 50 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | 8.06 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | 0.125 W | CMOS | BOTTOM | BALL | 250 | 0.8 mm | General Purpose | compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | SoC FPGA | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-FGG484 | Microchip | Datasheet | 39 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | 64 kB | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 233 | 12084 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB |
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5CSXFC6D6F31I7NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB014R24C2E3VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVP1802-2MLELSVC4072
AMD
Package:Embedded - System On Chip (SoC)
61,841.631936
-
AGFB014R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,076.706500
-
XC7Z030-2FBG484I
AMD
Package:Embedded - System On Chip (SoC)
331.691375
-
XC7Z045-L2FFG900I
AMD
Package:Embedded - System On Chip (SoC)
3,027.415502
-
XC7Z035-1FBG676C
AMD
Package:Embedded - System On Chip (SoC)
1,086.980682
-
XC7Z015-L1CLG485I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
UPD72874AGC-YEB-A
Renesas
Package:Embedded - System On Chip (SoC)
14.709431
-
M2S090-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
311.754501
-
M2S150T-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
528.956497
-
M2S025T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
125.949537
-
M2S090-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire