The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Actuator Material | ActuatorColor | Base Product Number | Contact Materials | Data RAM Size | Frequency-Max | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Capacitance | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Base Part Number | Output | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Polarity | Power Supplies | Temperature Grade | Interface | Number of Circuits | Ripple Current | Memory Size | Life (Hours) | Impedance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Mating Cycles | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Input | Ratio - Input:Output | Core Architecture | PLL | Differential - Input:Output | Flat Flex Type | Speed Grade | Connector/Contact Type | Number of Transceivers | Cable End Type | Locking Feature | Divider/Multiplier | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Features | Diameter | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness | Height Above Board | FFC, FCB Thickness | Material Flammability Rating | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 5ASXFB5H6F40C6NES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | MCU - 208, FPGA - 540 | 0°C ~ 85°C (TJ) | Bulk | Arria V SX | Obsolete | 5ASXFB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23C8NES | ALTERA | Datasheet | 28 | - | Min: 1 Mult: 1 | Through Hole | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 100 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 20 % | Obsolete | Soldering | 105 °C | -40 °C | 330 µF | 5CSXFC6 | 380 mΩ | Polar | 880 mA | 10000 hours | 240 mΩ | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | 18 mm | 30 mm | 32.9946 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC4C6U23I7N | ALTERA | Datasheet | 2159 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSXFC4C6U23I7N | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.03 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSXFC4 | S-PBGA-B672 | 145 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 40000 | ARM | 6 | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U23I7SN | ALTERA | Datasheet | 2370 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA4U23I7SN | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U19C7SN | ALTERA | Datasheet | 1906 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA5U19C7SN | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.55 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F40I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB5D4F40I5N | MCU - 208, FPGA - 540 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1517 | 540 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6F31A7N | ALTERA | Datasheet | 2275 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSEMA6F31A7N | 3 | MCU - 181, FPGA - 288 | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.04 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U19C7N | ALTERA | Datasheet | 1799 |
| Min: 1 Mult: 1 | 484-FBGA | 484-UBGA (19x19) | INTEL CORP | Intel Corporation | 5CSEBA4U19C7N | MCU - 151, FPGA - 66 | FBGA, BGA484,22X22,32 | Active | Yes | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | compliant | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXMB3G4F40C4N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXMB3G4F40C4N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXMB3 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D6F40C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB3D6F40C6N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | 5.28 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | Active | BOTTOM | BALL | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXFB3G4F35I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXFB3G4F35I5N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1152 | 385 | Not Qualified | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400 | Microchip | Datasheet | 2162 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | 16-TSSOP | M2S025 | 64 kB | 133MHz | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 207 | 27696 LE | Tray | Active | Compliant | 0°C ~ 70°C | Tape & Reel (TR) | -- | Active | -- | Zero Delay Buffer | 3 V ~ 3.6 V | IDT2309-1 | LVTTL | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | LVTTL | 1:9 | Yes with Bypass | No/No | No/No | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG676I | Microchip | Datasheet | 1709 | - | Min: 1 Mult: 1 | Surface Mount, Right Angle | 676-BGA | YES | 676-FBGA (27x27) | Thermoplastic, Glass Filled | 676 | -- | -- | M2S090 | Phosphor Bronze | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090T-FGG676I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 50V | -20°C ~ 85°C | Tape & Reel (TR) | -- | e1 | Active | -- | Solder | 26 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | 0.039 (1.00mm) | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 0.5A | Tin | S-PBGA-B676 | 425 | Not Qualified | Black | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | -- | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPC | Contacts, Bottom | Straight | -- | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | Solder Retention | 27 mm | 27 mm | 120.0µin (3.05µm) | 0.126 (3.20mm) | 0.30mm | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MLEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24C2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVD1760I | AMD | Datasheet | 680 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | AMD | 308 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-1FFVB1156I | AMD | Datasheet | 460 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | 0.892 V | AMD | 0.808 V | 328 | Bulk | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVB1517E | AMD | Datasheet | 628 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU19 | AMD | 644 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FFVE1156I | AMD | Datasheet | 692 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
-
5ASXFB5H6F40C6NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6C6U23C8NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC4C6U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
264.869075
-
5CSEBA4U23I7SN
ALTERA
Package:Embedded - System On Chip (SoC)
182.429431
-
5CSEBA5U19C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
192.318288
-
5ASXBB5D4F40I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA6F31A7N
ALTERA
Package:Embedded - System On Chip (SoC)
514.940244
-
5CSEBA4U19C7N
ALTERA
Package:Embedded - System On Chip (SoC)
150.324973
-
5ASXMB3G4F40C4N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D6F40C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXFB3G4F35I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-2MLEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB012R24C2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-1FFVD1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
3,327.794785
-
XCZU19EG-2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
7,482.908314
-
XCZU43DR-L2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
30,185.227739