The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | CoilResistance | Contact Materials | Data RAM Size | Device Logic Units | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Power Rating | Mfr | Minimum Dropout Voltage | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Relay Construction | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Typical Operating Supply Voltage | Wire Size | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Temperature Coefficient | Type | Resistance | Terminal Finish | Gender | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Speed | RAM Size | Cable Length | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Operate Time | Screening Level | Speed Grade | Resistance Tolerance | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Contact Arrangement | Flash Size | Product Length | Device Core | Length | Width |
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 | Mfr Part No XC7Z045-1FFG900I | AMD | Datasheet | 684 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z045 | 1.2, 3.3 V | Thumb-2 | AMD | Surface Mount | 2 | 130 | Tray | Active | FCBGA | -40 to 100 °C | Zynq®-7000 | 900 | 1 V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-2FB484I | AMD | Datasheet | 2310 |
| Min: 1 Mult: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | XC7Z030 | 1.2, 3.3 V | RISC | AMD | Surface Mount | 1 | 130 | Tray | Active | FCBGA | -40 to 100 °C | Zynq®-7000 | 484 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-2FFG676E | AMD | Datasheet | 712 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z035 | 275,000 | 250 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Tray | Active | FCBGA | 1.0000 V | 0 to 100 °C | Zynq®-7000 | 676 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS460T-FCG1152EPP | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | Microchip Technology | MCU - 136, FPGA - 468 | Tray | Active | 0°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FGG484I | Microchip | Datasheet | 12 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1FGG484I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 233 | 12084 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | 100 ppm/K | 60.4 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | 1 W | CMOS | BOTTOM | BALL | 250 | 1 mm | General Purpose | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MSEVSVA2197 | AMD | Datasheet | 485 | - | Min: 1 Mult: 1 | 178 Ohm | Palladium Ruthenium/Gold | 60/62.5 W/VA | AMD | 0.5 Vdc | Surface Mount | Tray | Active | Non-Latching | -40 to 85 °C | * | Signal Relay | 1 ms | SPST-NO | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MLINSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Gold | 1369-BFBGA | 1369-BGA (35x35) | Phosphor Bronze | AMD | 316 | Tray | Active | Crimp | 26 AWG | -55 to 150 °C | Versal™ Prime | Receptacle | 600MHz, 1.3GHz | - | 0.45 m | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2MSEVSVD1760 | AMD | Datasheet | 800 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1LLIVIVA1596 | AMD | Datasheet | 614 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-L2FBVB900E | AMD | Datasheet | 572 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-L1UBVA494I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 492 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 570K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C2I3E | Intel | Datasheet | 612 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FBG484C | AMD | Datasheet | 44 | - | Min: 1 Mult: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | XC7Z030 | AMD | 130 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVF1517I | AMD | Datasheet | 757 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 464 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2LLEVSVD1760 | AMD | Datasheet | 779 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-2MSIVSVA2197 | AMD | Datasheet | 587 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2I1V | Intel | Datasheet | 711 |
| Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - |
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XC7Z045-1FFG900I
AMD
Package:Embedded - System On Chip (SoC)
2,191.376738
-
XC7Z030-2FB484I
AMD
Package:Embedded - System On Chip (SoC)
431.261167
-
XC7Z035-2FFG676E
AMD
Package:Embedded - System On Chip (SoC)
1,807.582523
-
MPFS460T-FCG1152EPP
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1502-2MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1MLINSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-2MSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1LLIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
39,642.323438
-
XCZU5EV-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,503.562015
-
XCZU1CG-L1UBVA494I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS057H2F34E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R31C2I3E
Intel
Package:Embedded - System On Chip (SoC)
32,315.562334
-
XC7Z030-1FBG484C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-2FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2LLEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA012R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-2MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
32,066.560217
-
AGFA006R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
12,473.684216