The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Base Product Number | Body Orientation | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Instruction Set Architecture | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Package | Product Status | Qualification | Supplier Package | Termination Method | Voltage, Rating | Operating Temperature | Packaging | Series | Part Status | Temperature Coefficient | Resistance | Gender | Subcategory | Power Rating | Resistor Type | Pin Count | Operating Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Product Type | Resistance Tolerance | Primary Attributes | Number of Cores | Flash Size | Product Category | Product Length | Product Width | Device Core |
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 | Mfr Part No XCVE2002-2MLISBVA484 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 50.0000 ppm/°C | 1.5 | SOC - Systems on a Chip | 10.0000 W | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 32.51 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU65DR-1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | 700 V | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2202-2MSIVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 50.0000 ppm/°C | 634 Ohm | SOC - Systems on a Chip | 0.5 W | Industrial | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 6.1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU55DR-1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 100 ppm/K | 680 Ohm | SOC - Systems on a Chip | 0.05 W | General Purpose | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 1 | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | 0.6 mm | 0.3 mm | |||||||||||||||||||||||||||||
| Mfr Part No XQVP1202-1MLIVSQA2785 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | AEC-Q200 | 100 ppm/K | 2.2 Ohm | SOC - Systems on a Chip | 0.75 W | General Purpose | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 5 mm | 2.5 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2002-1MSESBVA625 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | AEC-Q200 | 75 V | 50 ppm/K | 18 | SOC - Systems on a Chip | 0.1 W | Semi-Precision | 800 mV | System-On-Modules - SOM | 0.5 | SoC FPGA | 1.55 mm | 0.85 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2102-2MLESBVA625 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 125 mW | High Reliability, MIL-PRF-39017 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2502-2MSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | 250 V | 25.0000 ppm/°C | 100 | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-55182 | 800 mV | System-On-Modules - SOM | 0.1 | SoC FPGA | 8.89 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU67DR-L1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | SOC - Systems on a Chip | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FBG676E | AMD | Datasheet | 21 | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z045 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A3E4X | Intel | Datasheet | 788 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-DIE4058 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FFVG1517IES9819 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | - | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 533 MHz, 1.3 GHz | 930300 LE | XCZU47DR | - | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R31C2E3E | Intel | Datasheet | 549 |
| Min: 1 Mult: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIC035R39A2E3E | Intel | Datasheet | 721 |
| Min: 1 Mult: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R8A77970LA01BA#GB | Renesas Electronics Corporation | Datasheet | 16 |
| Min: 1 Mult: 1 | Tray | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIA035R39A2E3E | Intel | Datasheet | 682 |
| Min: 1 Mult: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD019R31C2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z100-1FF900I | AMD | Datasheet | 478 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z100 | Straight | 1.5, 2, 2.5 V | RISC | CAN/I2C/SPI/UART | AMD | Flange Mount | 2 | 130 | Tray | Active | FBGA | Solder | -40 to 100 °C | Zynq®-7000 | Plug | 900 | 1, 1.8 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | 86.1 mm | ARM Cortex A9 |
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XCVE2002-2MLISBVA484
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU65DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM2202-2MSIVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU55DR-1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XQVP1202-1MLIVSQA2785
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE2002-1MSESBVA625
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE2102-2MLESBVA625
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM2502-2MSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU67DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-2FBG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
21,590.445224
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XCZU46DR-DIE4058
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FFVG1517IES9819
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB023R31C2E3E
Intel
Package:Embedded - System On Chip (SoC)
24,319.219108
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AGIC035R39A2E3E
Intel
Package:Embedded - System On Chip (SoC)
41,762.245687
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R8A77970LA01BA#GB
Renesas Electronics Corporation
Package:Embedded - System On Chip (SoC)
50.986010
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AGIA035R39A2E3E
Intel
Package:Embedded - System On Chip (SoC)
43,086.047480
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AGFD019R31C2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z100-1FF900I
AMD
Package:Embedded - System On Chip (SoC)
3,649.555373