The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Supplier Device Package | Base Product Number | Brand | Data Converters | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Number of I/Os | Package | Product Status | RoHS | Operating Temperature | Packaging | Series | Part Status | Moisture Sensitivity Level (MSL) | Subcategory | Operating Supply Voltage | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Architecture | Product Type | EEPROM Size | Primary Attributes | Flash Size | Product Category | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AMA3B1KK-KCR-TB | Ambiq Micro, Inc. | Datasheet | 17491 |
| Min: 1 Mult: 1 | 66-UFBGA, CSPBGA | 66-CSP (3.38x3.25) | AMA3B1KK | 37 | -40°C ~ 85°C (TA) | Tape & Reel (TR) | Apollo3 Blue | Active | 96MHz | 384KB | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | I2C, SPI, UART/USART | MCU | 1MB | |||||||||||||||||||||||||||
| Mfr Part No AGFA023R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2I1VB | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | ||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2E1VB | Intel | Datasheet | 685 |
| Min: 1 Mult: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | ||||||||||||||||||||||||||||
 | Mfr Part No 10AS048H2F34I1HG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1152-BBGA, FCBGA | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||
| Mfr Part No XCVH1542-2LLELSVA4737 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24B3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 3 | Intel | Intel | 768 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | Intel | ||||||||||||||||||||
| Mfr Part No XCVM1802-2MLIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1LSIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1LLIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MLIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MSIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-1FCVG784T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Microchip Technology | MCU - 136, FPGA - 312 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C2E1V | Intel | Datasheet | 600 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-L1FBVB900I | AMD | Datasheet | 794 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||
| Mfr Part No XCVC1502-1MSEVSVA1596 | AMD | Datasheet | 698 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | AMD | 478 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||
| Mfr Part No CY8C4147LQA-S283 | Infineon | Datasheet | 25 |
| Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | CY8C4147 | Infineon Technologies | A/D 16x10b, 20x12b SAR | 4900 | Infineon | Infineon Technologies | Yes | 34 | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||
| Mfr Part No CY8C4146LQE-S263T | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | A/D 16x10b, 16x12b SAR; D/A 2x7b | 2500 | Infineon | Infineon Technologies | Yes | 34 | Tape & Reel (TR) | Active | Details | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 48MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||
| Mfr Part No CY8C4126LQS-S453 | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | A/D 16x10b, 20x12b SAR | 4900 | Infineon | Infineon Technologies | Yes | 34 | Tray | Active | Details | -40°C ~ 105°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA |
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AMA3B1KK-KCR-TB
Ambiq Micro, Inc.
Package:Embedded - System On Chip (SoC)
5.467381
-
AGFA023R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA006R24C2I1VB
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA008R24C2E1VB
Intel
Package:Embedded - System On Chip (SoC)
11,191.195794
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10AS048H2F34I1HG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVH1542-2LLELSVA4737
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB014R24B3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-2MLIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-1LSIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1LLIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1MLIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1MSIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS160T-1FCVG784T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R31C2E1V
Intel
Package:Embedded - System On Chip (SoC)
34,852.439854
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AGFA027R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EV-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,625.722987
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XCVC1502-1MSEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
15,061.083444
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CY8C4147LQA-S283
Infineon
Package:Embedded - System On Chip (SoC)
5.459441
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CY8C4146LQE-S263T
Infineon
Package:Embedded - System On Chip (SoC)
Price: please inquire
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CY8C4126LQS-S453
Infineon
Package:Embedded - System On Chip (SoC)
Price: please inquire