The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Weight | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Data Converters | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage-Input | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Composition | Color | Applications | Number of Rows | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Pitch | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Number of Positions Loaded | Reach Compliance Code | Frequency | Frequency Stability | Output | Shell Finish | Shell Size - Insert | Contact Finish | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Approval Agency | Efficiency | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Oscillator Type | Polarization | Current - Output (Max) | Connector Style | Speed | RAM Size | Shell Size, MIL | Lead Style | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Input Type | Cable Opening | Voltage - Output | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | EEPROM Size | Form | Region Utilized | Cord Length | Input Connector | Output Connector | Number of Transceivers | No Load Power Consumption | Connector Usage | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No AGFB012R24B2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | - | - | Stainless Steel | - | Fluorosilicone Elastomer | - | D38999/25HE | Gold | Nickel Iron Alloy | TE Connectivity Deutsch Connectors | 768 | Bulk | Metal | Active | 600VAC, 850VDC | -65°C ~ 200°C | MIL-DTL-38999 Series III, DTS | Solder | Receptacle, Female Sockets | 23 | Silver | Aviation, Communication Systems, Industrial | Threaded | - | D | Shielded | Environment Resistant | Electroless Nickel | 17-99 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 1.2M Logic Elements | - | Hermetically Sealed | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057H2F34I2SG | ALTERA | Datasheet | 479 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 121024 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057H2F34I2SG | 1.2 GHz | Molex | Yes | SMD/SMT | 492 | 71250 LAB | 570000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965012 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K4F35I3LG | ALTERA | Datasheet | 570 |
| Min: 1 Mult: 1 | YES | - | 1152 | INTEL CORP | Intel Corporation | 10AS048K4F35I3LG | Advantech Corp | 396 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | 230VAC | - | Tray | - | 2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm) | Active | ITE (Commercial) | 6 W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | CE, TUVgs | - | 0.9 V | INDUSTRIAL | Positive Tip, Negative Sleeve | 500mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Fixed Blade | 12V | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | Wall Mount (Class II) | Europe | 72 (1.83m) | CEE 7/16 | Phono Plug, 2.5mm O.D. x 11.5mm | - | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K3F35I2SG | ALTERA | Datasheet | 771 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC60 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K3F35I2SG | 1.2 GHz | Vishay Dale | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965306 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/03, RNC60 | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±0.1% | Active | 2 | ±50ppm/°C | 124 Ohms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K3F35E2LG | ALTERA | Datasheet | 556 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K3F35E2LG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965076 | Active | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RNCS | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | Active | 2 | ±50ppm/°C | 15.4 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVP1202-2MLEVSVA2785 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0805 (2012 Metric) | Vishay Vitramon | Tape & Reel (TR) | Obsolete | 50V | -55°C ~ 150°C | GA | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1pF | C0G, NP0 | Automotive | 3.3 pF | - | - | - | Epoxy Mountable, High Temperature | - | 0.057 (1.45mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB008R16A2E3E | Intel | Datasheet | 727 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RS73G2A | KOA Speer Electronics, Inc. | 384 | Tape & Reel (TR) | Active | -55°C ~ 155°C | RS73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 4.22 MOhms | Thick Film | 0.25W, 1/4W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29E1HG | ALTERA | Datasheet | 787 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | Intel / Altera | - | 36 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F29E1HG | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 973472 | Active | 5.67 | Details | Yes | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | RN731J | INTEL CORP | Intel Corporation | 10AS048H2F34E1SG | KOA Speer Electronics, Inc. | 492 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Obsolete | NOT SPECIFIED | 5.68 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 16.4 kOhms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | Moisture Resistant | 0.022 (0.55mm) | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066N4F40I3SGES | ALTERA | Datasheet | 407 |
| Min: 1 Mult: 1 | - | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N4F40I3SGES | KYOCERA AVX | 588 | 100 °C | -40 °C | Bag | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | 0.93 V | 0.87 V | 0.9 V | 250VAC/DC | -55°C ~ 125°C | Tray | 8071, Kyocera | Discontinued at Digi-Key | - | Receptacle, Female Sockets | 55 | - | 8542.39.00.01 | 1 A | 0.079 (2.00mm) | BOTTOM | BALL | 1 mm | All | compliant | - | S-PBGA-B1517 | INDUSTRIAL | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 660K Logic Elements | -- | - | 40 mm | 40 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057K3F40E2SG | ALTERA | Datasheet | 436 |
| Min: 1 Mult: 1 | 2512 (6432 Metric) | YES | 2512 | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057K3F40E2SG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 696 | 71250 LAB | 570000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | 965069 | Active | Active | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RMCF | 0.248 L x 0.126 W (6.30mm x 3.20mm) | ±1% | Active | 2 | ±400ppm/°C | 7.32 Ohms | Thick Film | 1W | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | - | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 2 Core | -- | Automotive AEC-Q200 | SoC FPGA | 0.028 (0.70mm) | 40 mm | 40 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K1F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | QL3P41 | INTEL CORP | Intel Corporation | 10AS066K1F35E1SG | Broadcom Limited | 396 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX250LU2F50I2LG | ALTERA | Datasheet | 773 |
| Min: 1 Mult: 1 | Surface Mount | 52-TQFP | 52-TQFP (10x10) | ML620Q156 | A/D 12x10b SAR | Rohm Semiconductor | 34 | Bulk | Last Time Buy | -40°C ~ 105°C (TA) | Tray | - | Active | External, Internal | 8.4MHz | 2K x 8 | 1.8V ~ 5.5V | nX-U16/100 | POR, PWM, WDT | FLASH | 16-Bit | 64KB (32K x 16) | I²C, SSP, UART/USART | MCU, FPGA | 2K x 8 | FPGA - 2500K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048H3F34I2LG | ALTERA | Datasheet | 409 |
| Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | SG731J | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H3F34I2LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965303 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | SG73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±20% | Active | 2 | ±200ppm/°C | 18 Ohms | Thick Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | SoC FPGA | 0.022 (0.55mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EV-1FBVB900I | AMD | Datasheet | 434 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | KEMET | 204 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z020-2CLG484I | AMD | Datasheet | 36 | - | Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | 093338 | Molex | 130 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R31C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | DL66G12 | TE Connectivity Deutsch Connectors | 720 | Bag | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA008R16A2I2V | Intel | Datasheet | 731 |
| Min: 1 Mult: 1 | - | - | 173114 | Molex | 384 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H2F34I2SGES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 1152-FCBGA (35x35) | 1152 | 500SAB | INTEL CORP | Intel Corporation | 10AS066H2F34I2SGES | Skyworks Solutions Inc. | 492 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 85°C | Tray | Si500S | 0.157 L x 0.126 W (4.00mm x 3.20mm) | Discontinued at Digi-Key | XO (Standard) | 8542.39.00.01 | 3.3V | BOTTOM | BALL | 1 mm | compliant | 70.3125 MHz | ±20ppm | CMOS | S-PBGA-B1152 | Enable/Disable | Crystal | 24mA | INDUSTRIAL | 10.7mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 660K Logic Elements | -- | 0.035 (0.90mm) | 35 mm | 35 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K4F35I3SG | ALTERA | Datasheet | 771 |
| Min: 1 Mult: 1 | YES | 1152 | INTEL CORP | Intel Corporation | 10AS048K4F35I3SG | Panduit Corp | 396 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm |
AGFB012R24B2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS057H2F34I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,055.307808
10AS048K4F35I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
3,960.412137
10AS048K3F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,064.269913
10AS066K3F35E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
5,979.501498
XCVP1202-2MLEVSVA2785
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB008R16A2E3E
Intel
Package:Embedded - System On Chip (SoC)
10,017.666767
10AS022E3F29E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,192.741066
10AS048H2F34E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS066N4F40I3SGES
ALTERA
Package:Embedded - System On Chip (SoC)
4,034.621995
10AS057K3F40E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,255.783809
10AS066K1F35E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
1SX250LU2F50I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
24,747.053467
10AS048H3F34I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
4,047.873383
XCZU7EV-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,223.581632
XC7Z020-2CLG484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB027R31C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFA008R16A2I2V
Intel
Package:Embedded - System On Chip (SoC)
10,703.191949
10AS066H2F34I2SGES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS048K4F35I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,566.734819
