The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Current - Saturation (Isat) | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Frequency-Self-Resonant | Ihs Manufacturer | Inductance Frequency-Test | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material-Core | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Inductance | DC Resistance (DCR) | Speed | RAM Size | Shell Size, MIL | Lead Style | Core Processor | Peripherals | Program Memory Size | Connectivity | Q @ Freq | Cable Opening | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Voltage - I/O | Primary Attributes | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Logic Cells | Co-Processors/DSP | Number of Cores | Security Features | Display & Interface Controllers | Flash Size | SATA | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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![]() | Mfr Part No 10AS032H4F35E3SG | ALTERA | Datasheet | 704 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 1812 (4532 Metric) | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H4F35E3SG | 1.2 GHz | Vishay Vitramon | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965298 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 100V | -55°C ~ 150°C | Tray | GA | 0.177 L x 0.126 W (4.50mm x 3.20mm) | ±5% | Active | C0G, NP0 | Automotive | 8542.39.00.01 | 150 pF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | - | SoC FPGA | - | 35 mm | 35 mm | 0.086 (2.18mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048H2F34E2LG | ALTERA | Datasheet | 617 |
| Min: 1 Mult: 1 | YES | 1152 | MS27497T14F | INTEL CORP | Intel Corporation | 10AS048H2F34E2LG | Corsair | 492 | 100 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H1F34I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS032H1F34I1SG | Vishay Vitramon | 384 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 50V | -55°C ~ 150°C | Tray | GA | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | Discontinued at Digi-Key | X8R | Automotive | 8542.39.00.01 | 1200 pF | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | - | - | INDUSTRIAL | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | -- | - | - | 35 mm | 35 mm | 0.067 (1.70mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29E2SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | FBGA-780 | YES | - | Composite | Thermoplastic | 780 | - | D38999/26JH | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F29E2SG | 1.2 GHz | TE Connectivity Deutsch Connectors | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 973473 | Active | Composite | Discontinued at Digi-Key | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | - | -65°C ~ 175°C | Tray | Military, MIL-DTL-38999 Series III, ACT | Active | Crimp | Plug, Female Sockets | 55 | Olive Drab | Aerospace, Military | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | 7.5A | CMOS | BOTTOM | B | BALL | Shielded | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Olive Drab Cadmium | 23-55 | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | H | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | - | SoC FPGA | 29 mm | 29 mm | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K3F35E2SG | ALTERA | Datasheet | 612 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | DL66R | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K3F35E2SG | 1.2 GHz | TE Connectivity Deutsch Connectors | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | 100 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964910 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H3F34I2SG | ALTERA | Datasheet | 589 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RLR05 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H3F34I2SG | 1.2 GHz | Vishay Dale | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965379 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 150°C | Tray | Military, MIL-PRF-39017/05, RLR05 | 0.066 Dia x 0.150 L (1.68mm x 3.81mm) | ±2% | Active | 2 | ±100ppm/°C | 30 Ohms | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | YAFD54 | INTEL CORP | Intel Corporation | 10AS032H2F34E1SG | TE Connectivity Deutsch Connectors | 384 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Active | NOT SPECIFIED | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E4F29I3SG | ALTERA | Datasheet | 424 |
| Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 780 | RNCF0603B | INTEL CORP | Intel Corporation | 10AS048E4F29I3SG | Stackpole Electronics Inc | 360 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RNCF | 0.061 L x 0.031 W (1.55mm x 0.80mm) | ±0.1% | Active | 2 | ±25ppm/°C | 23.2 Ohms | Thin Film | 0.167W, 1/6W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | Automotive AEC-Q200 | 0.022 (0.55mm) | 29 mm | 29 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E4F29I3LG | ALTERA | Datasheet | 685 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | DJT16E25 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048E4F29I3LG | 1.2 GHz | TE Connectivity Deutsch Connectors | Yes | SMD/SMT | 360 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 965352 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H4F34I3SG | ALTERA | Datasheet | 520 |
| Min: 1 Mult: 1 | 1206 (3216 Metric) | YES | 1206 | 1152 | RN732B | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F34I3SG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964944 | Active | Obsolete | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | Active | 2 | ±50ppm/°C | 25.5 kOhms | Thin Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.028 (0.70mm) | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H1F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | RJMG1 | INTEL CORP | Intel Corporation | 10AS066H1F34E1SG | Amphenol ICC (Commercial Products) | 492 | 100 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057N3F40E2LG | ALTERA | Datasheet | 488 |
| Min: 1 Mult: 1 | Surface Mount | 783-BBGA, FCBGA | YES | 783-FCPBGA (29x29) | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057N3F40E2LG | 1.2 GHz | Freescale Semiconductor | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965072 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 90°C (TA) | Tray | MPC85xx | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | OTHER | 1GHz | 256KB | PowerPC e500 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1.8V, 2.5V, 3.3V | FPGA - 570K Logic Elements | 10/100/1000Mbps (3) | 1 Core, 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I²C, MMC/SD, PCI, SPI | 570000 | Security; SEC | 2 Core | Cryptography | - | -- | SATA 3Gbps (2) | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F27E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0402 (1005 Metric) | YES | 672-FBGA (27x27) | 672 | VJ0402 | INTEL CORP | Intel Corporation | 10AS022E3F27E1SG | Vishay Vitramon | 240 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | BGA672,26X26,40 | SQUARE | GRID ARRAY | Obsolete | Active | NOT SPECIFIED | 5.67 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 50V | -55°C ~ 125°C | Tray | VJ HIFREQ | 0.040 L x 0.020 W (1.02mm x 0.51mm) | ±0.5pF | Discontinued at Digi-Key | C0G, NP0 | RF, Microwave, High Frequency | 8542.39.00.01 | 3.3 pF | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 220K Logic Elements | 220000 | -- | High Q, Low Loss | - | 27 mm | 27 mm | 0.024 (0.61mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | ERC50 | INTEL CORP | Intel Corporation | 10AS066H2F34E1SG | Vishay Dale | 492 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Active | NOT SPECIFIED | 5.15 | Yes | 0.93 V | 0.87 V | 0.9 V | -65°C ~ 175°C | Tray | ERC | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | ±1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 19.1 Ohms | Metal Film | 0.1W, 1/10W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | Moisture Resistant | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K4F40I3LG | ALTERA | Datasheet | 432 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 0805 (2012 Metric) | YES | 1517-FBGA (40x40) | 1517 | 0805D | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K4F40I3LG | 1.2 GHz | Knowles Novacap | Yes | SMD/SMT | 696 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | 978990 | Active | Active | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 250V | -55°C ~ 200°C | Tray | - | 0.080 L x 0.050 W (2.03mm x 1.27mm) | ±5% | Active | C0G, NP0 | General Purpose | 8542.39.00.01 | 56 pF | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | - | - | INDUSTRIAL | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | High Temperature | SoC FPGA | - | 40 mm | 40 mm | 0.054 (1.37mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | 10AS022E3F29E1SG | Vishay Vitramon | 288 | 100 °C | Box | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Obsolete | Obsolete | NOT SPECIFIED | 5.67 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 220K Logic Elements | 220000 | -- | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H2F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | INTEL CORP | Intel Corporation | 10AS032H2F35I1SG | Vishay Dale | 384 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 10 Ohms | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | R (0.01%) | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | -- | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E4F27E3LG | ALTERA | Datasheet | 744 |
| Min: 1 Mult: 1 | YES | 672 | 090879 | INTEL CORP | Intel Corporation | 10AS032E4F27E3LG | Molex | 240 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.45 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | -- | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E3F29I2LG | ALTERA | Datasheet | 752 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048E3F29I2LG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 360 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 965034 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | CSR | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | Active | 2 | ±200ppm/°C | 620 mOhms | Thick Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Current Sense | SoC FPGA | 0.026 (0.65mm) | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E2F27E2LG | ALTERA | Datasheet | 757 |
| Min: 1 Mult: 1 | Through Hole | Radial, Vertical Cylinder | YES | Radial | 672 | Intel / Altera | - | - | 1 | - | INTEL CORP | 1 kHz | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E2F27E2LG | - | 1.2 GHz | Central Technologies | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964832 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -25°C ~ 85°C | Tray | CTDR2F | 0.866 Dia (22.00mm) | ±10% | Active | Drum Core, Wirewound | 8542.39.00.01 | SOC - Systems on a Chip | 4 A | CMOS | BOTTOM | BALL | Unshielded | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 150 µH | 98mOhm Max | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | - | SoC FPGA | 0.866 (22.00mm) | 27 mm | 27 mm | - |
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2,396.777868
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Package:Embedded - System On Chip (SoC)
3,002.094567
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS066K4F40I3LG
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Package:Embedded - System On Chip (SoC)
5,904.573630
10AS022E3F29E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
Price: please inquire
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Package:Embedded - System On Chip (SoC)
1,536.424965
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Package:Embedded - System On Chip (SoC)
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Package:Embedded - System On Chip (SoC)
2,210.781588
