The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Surface Mount Land Size | Base Product Number | Brand | Data Converters | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lifetime @ Temp. | Manufacturer | Manufacturer Lifecycle Status | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Case Code (Metric) | Case Code (Imperial) | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Memory Size | Oscillator Type | Polarization | Load Capacitance | Impedance | Speed | RAM Size | Lead Style | Voltage - Supply (Vcc/Vdd) | Core Processor | Ripple Current @ High Frequency | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | EEPROM Size | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Output Format | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Lead Free | Ratings |
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![]() | Mfr Part No 10AS032H1F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LQFP | YES | 100-LQFP (14x20) | 1152 | R5F100 | A/D 20x8/10b | INTEL CORP | Intel Corporation | 10AS032H1F35E1SG | Renesas Electronics America Inc | 82 | 100 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 85°C (TA) | Tray | RL78/G13 | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | Internal | 32MHz | 20K x 8 | 1.6V ~ 5.5V | RL78 | DMA, LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CSI, I²C, LINbus, UART/USART | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 8K x 8 | FPGA - 320K Logic Elements | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA023R25A3I3E | Intel | Datasheet | 468 |
| Min: 1 Mult: 1 | - | - | 120122 | Molex | 480 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA019R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial, Disc | - | Vishay Beyschlag/Draloric/BC Components | 480 | Bulk | Active | 440VAC | -40°C ~ 125°C | WYO | 0.256 Dia (6.50mm) | ±20% | Y5U (E) | Safety | 1000 pF | - | 0.197 (5.00mm) | 1.4GHz | 256KB | Straight | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | - | 0.374 (9.50mm) | - | X1, Y2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E3F29E2SG | ALTERA | Datasheet | 680 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | 10AS016E3F29E2SG | 288 | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 1.97 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | -- | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H4F34I3LG | ALTERA | Datasheet | 594 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F34I3LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965287 | Active | NOT SPECIFIED | 5.43 | Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 200 V | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 1 % | Active | SMD/SMT | 210 kΩ | 155 °C | -55 °C | Thick Film | 8542.39.00.01 | SOC - Systems on a Chip | 1 W | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 3246 | 1218 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 550 µm | 3.2 mm | 4.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E4F29I3SG | ALTERA | Datasheet | 775 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E4F29I3SG | 1.2 GHz | Yes | SMD/SMT | 360 | 40000 LAB | 320000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964848 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H4F35I3SG | ALTERA | Datasheet | 621 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F35I3SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965052 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E1F27I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 year ago) | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | INTEL CORP | Intel Corporation | PRODUCTION (Last Updated: 1 year ago) | 10AS027E1F27I1SG | 240 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | SQUARE | GRID ARRAY | Obsolete | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | -- | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1LLINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2.5 mm x 2 mm | 1024-BGA (31x31) | CTS Electronic Components | 3000 | CTS | + 85 C | AMD Xilinx | - 40 C | 316 | Tray | Active | Details | 3.63 V | 2.97 V | -40°C ~ 100°C (TJ) | MouseReel | 625 | Oscillators | 3.6864 MHz | 50 PPM | SMD/SMT | 700 mV | 15 pF | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | HCMOS | Versal™ Prime FPGA, 70k Logic Cells | - | Standard Clock Oscillators | 1 mm | 2.5 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-2LSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2.5 mm x 2 mm | 1024-BGA (31x31) | CTS Electronic Components | 3000 | CTS | + 70 C | AMD Xilinx | - 20 C | 424 | Tray | Active | Details | 3.3 V | 3.3 V | 0°C ~ 100°C (TJ) | Reel | 625 | Oscillators | 30 MHz | 25 PPM | SMD/SMT | 700 mV | 15 pF | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | Versal™ Prime FPGA, 1.2M Logic Cells | - | Standard Clock Oscillators | 1 mm | 2.5 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEBA6U23C7N | ALTERA | Datasheet | 2081 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 121064 | INTEL CORP | Intel Corporation | 5CSEBA6U23C7N | Molex | MCU - 181, FPGA - 145 | 85 °C | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2.01 | Compliant | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | * | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 7 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA027R31C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | RN732B | KOA Speer Electronics, Inc. | 720 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±50ppm/°C | 111 Ohms | Thin Film | 0.125W, 1/8W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Moisture Resistant | 0.028 (0.70mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z045-1FFG900C | AMD | Datasheet | 601 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | DIV40E15 | TE Connectivity Deutsch Connectors | 130 | Bag | Active | 0°C ~ 85°C (TJ) | * | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z015-1CLG485C | AMD | Datasheet | 1902 |
| Min: 1 Mult: 1 | Through Hole | Radial, Can | 485-CSPBGA (19x19) | - | XC7Z015 | 5000 Hrs @ 105°C | EPCOS - TDK Electronics | 130 | Bulk | Obsolete | 25 V | -55°C ~ 105°C | B41858 | 0.492 Dia (12.50mm) | ±20% | Automotive | 2200 µF | 30mOhm @ 10kHz | 0.197 (5.00mm) | Polar | 25 mOhms | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 2.858 A @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | 1.654 (42.00mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H4F34I3LG | ALTERA | Datasheet | 491 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H4F34I3LG | 1.2 GHz | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965100 | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z030-L2SBG485I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS160T-1FCVG784T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Microchip Technology | MCU - 136, FPGA - 312 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1802-2MLIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1802-1LSIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1802-1LLIVFVC1760-5189 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA |
10AS032H1F35E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFA023R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
13,592.132687
AGFA019R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS016E3F29E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
853.199633
10AS027H4F34I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,807.737249
10AS032E4F29I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,613.741199
10AS027H4F35I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,445.935351
10AS027E1F27I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-1LLINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-2LSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
5CSEBA6U23C7N
ALTERA
Package:Embedded - System On Chip (SoC)
323.461694
AGFA027R31C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z045-1FFG900C
AMD
Package:Embedded - System On Chip (SoC)
2,069.579267
XC7Z015-1CLG485C
AMD
Package:Embedded - System On Chip (SoC)
149.969512
10AS066H4F34I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
4,554.555466
XC7Z030-L2SBG485I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS160T-1FCVG784T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1802-2MLIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1802-1LSIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1802-1LLIVFVC1760-5189
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
