The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Length | Width |
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![]() | Mfr Part No M2S050-FCSG325I | Microchip Technology | Datasheet | 1632 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050-FCSG325I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 200 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||
![]() | Mfr Part No M2S005-1VFG400 | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S005 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 169 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-1VFG400I | Microchip Technology | Datasheet | 1601 |
| Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S050 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S050TS-1VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150TS-FCSG536I | Microchip Technology | Datasheet | 2008 |
| Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | 1.2, 1.5, 1.8, 2.5, 3.3 V | MICROSEMI CORP | RISC | Yes | - | - | M2S150TS-FCSG536I | 166 MHz | Microchip Technology | Yes | 3 | 1 | 293 | 12177 LAB | 146124 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | 536 | S-PBGA-B536 | 1.2 V | INDUSTRIAL | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | FIELD PROGRAMMABLE GATE ARRAY | Industrial | FPGA - 150K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-1VF400 | Microchip Technology | Datasheet | 1735 |
| Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S050 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 207 | 4695 LAB | 56340 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090TS-FCSG325 | Microchip Technology | Datasheet | 1781 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090TS-FCSG325 | 166 MHz | Microchip Technology | Yes | 3 | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-1FCS325 | Microchip Technology | Datasheet | 1976 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | M2S025 | ARM Cortex M3 | 64 kB | 176 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-FGG484I | Microchip Technology | Datasheet | 1654 | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | Details | 1.2000 V | 0.314524 oz | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-1FG676 | Microchip Technology | Datasheet | 1700 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-VFG400I | Microchip Technology | Datasheet | 2124 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S050 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S050TS-VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-FG484 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 23988 | 60 | - | - | 166 MHz | 267 | Microchip Technology | Yes | Surface Mount | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | FBGA | 1.2000 V | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Commercial | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150-FCV484 | Microchip Technology | Datasheet | 1729 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | ARM Cortex M3 | 64 kB | 84 | MICROSEMI CORP | - | - | M2S150-FCV484 | 166 MHz | Microchip Technology | Yes | 273 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-VF400I | Microchip Technology | Datasheet | 2078 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 207 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-1TQG144 | Microchip Technology | Datasheet | 2147 | - | Min: 1 Mult: 1 | TQFP-144 | YES | 144-TQFP (20x20) | 144 | M2S010 | ARM Cortex M3 | 64 kB | 60 | 1.2, 1.5, 1.8, 2.5, 3.3 V | MICROSEMI CORP | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | M2S010-1TQG144 | 166 MHz | Microchip Technology | Yes | 3 | Surface Mount | SMD/SMT | 1 | 84 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | TQFP | 1.26 V | 1.14 V | 1.2 V | 0.046530 oz | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | Pure Matte Tin (Sn) | 8542.39.00.01 | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | 144 | S-PQFP-G144 | 84 | Not Qualified | 0.95, 1.05 V | 1.2 V | OTHER | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | Commercial | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | ARM Cortex-M3 | 20 mm | 20 mm | |||||||||||||
![]() | Mfr Part No M2S010TS-1VFG400I | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010TS-1VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-FCS325 | Microchip Technology | Datasheet | 2104 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060TS-FCS325 | 166 MHz | Microchip Technology | Yes | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-FG676 | Microchip Technology | Datasheet | 2322 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050-1FGG484I | Microchip Technology | Datasheet | 2398 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060-1VF400I | Microchip Technology | Datasheet | 1686 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 207 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025TS-1VF400I | Microchip Technology | Datasheet | 1968 |
| Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025TS-1VF400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | 17 mm | 17 mm |
M2S050-FCSG325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
164.053789
M2S005-1VFG400
Microchip Technology
Package:Embedded - System On Chip (SoC)
23.100795
M2S050TS-1VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
204.477879
M2S150TS-FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
308.113699
M2S050T-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
224.446486
M2S090TS-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025T-1FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-1FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
288.158862
M2S050TS-VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
249.365905
M2S025-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S150-FCV484
Microchip Technology
Package:Embedded - System On Chip (SoC)
475.992965
M2S060TS-VF400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
245.638516
M2S010-1TQG144
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010TS-1VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
157.794802
M2S060T-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
230.532279
M2S050-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
243.857926
M2S060-1VF400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
244.377926
M2S025TS-1VF400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
133.762026
