The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Package / Case | Surface Mount | Supplier Device Package | Weight | Number of Terminals | Brand | Case Code - in | Case Code - mm | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Illuminated | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Lifecycle Status | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Termination | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Case Code (Metric) | Case Code (Imperial) | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Lamp Type | Product Category | Diameter | Height | Length | Width | REACH SVHC |
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 | Mfr Part No 10AS027H4F34I3LG | ALTERA | Datasheet | 594 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F34I3LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965287 | Active | NOT SPECIFIED | 5.43 | Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 200 V | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 1 % | Active | SMD/SMT | 210 kΩ | 155 °C | -55 °C | Thick Film | 8542.39.00.01 | SOC - Systems on a Chip | 1 W | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 3246 | 1218 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 550 µm | 3.2 mm | 4.6 mm | |||||||||||||||||||||||||||
| Mfr Part No 10AS032E4F29I3SG | ALTERA | Datasheet | 775 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E4F29I3SG | 1.2 GHz | Yes | SMD/SMT | 360 | 40000 LAB | 320000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964848 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H4F35I3SG | ALTERA | Datasheet | 621 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H4F35I3SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965052 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E1F27I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 year ago) | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | INTEL CORP | Intel Corporation | PRODUCTION (Last Updated: 1 year ago) | 10AS027E1F27I1SG | 240 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | SQUARE | GRID ARRAY | Obsolete | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | -- | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A1E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 metric) | - | ATC / KYOCERA AVX | 0402 | 1005 | 1000 | KYOCERA AVX | + 125 C | Intel | - 40 C | 480 | Tray | Active | Details | UBR | 0.000053 oz | 0°C ~ 100°C (TJ) | Reel | 504L | 1 % | Ultra-Boardband Resistor | High Frequency | Resistors | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | High Frequency/RF Resistors | FPGA - 2.3M Logic Elements | - | High Frequency/RF Resistors | 0.5 mm | 1 mm | 05 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1502-1LSEVSVA3340 | AMD | Datasheet | 777 | - | Min: 1 Mult: 1 | 3340-BFBGA | 3340-BGA (55x55) | Panjit | 1250 | Panjit | AMD | 486 | Tray | Active | Details | 0.040283 oz | 0°C ~ 100°C (TJ) | Ammo Pack | Versal® Premium | Diodes & Rectifiers | Si | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Schottky Diodes & Rectifiers | Versal™ Premium FPGA, 3.7M Logic Cells | - | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U23C7SN | ALTERA | Datasheet | 1691 |
| Min: 1 Mult: 1 | Box | 672-FBGA | 672-UBGA (23x23) | 580 g | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | Unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASTMD3E3F31I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASTMD3E3F31I5N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.29 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASTMD3 | S-PBGA-B896 | 540 | Not Qualified | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASTFD5K3F40I5NES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | MCU - 208, FPGA - 540 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | Obsolete | 5ASTFD5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Amphenol Nexus Technologies | Non-Illuminated | Amphenol | AMD Xilinx | 366 | Active | Details | -40°C ~ 100°C (TJ) | NX300 | Switches | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Pushbutton Switches | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | Pushbutton Switches | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Honeywell | 1 | Non-Illuminated | Honeywell | AMD Xilinx | 366 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Switches | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Limit Switches | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | Limit Switches | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2LSEVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Measurement Specialties | 1 | TE Connectivity | 2 oz | Bulk | R60D | Sensors | Linear Displacement Sensors | Linear Displacement Sensors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MLIVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Telemecanique | 1 | Schneider Electric | AMD Xilinx | 770 | Tray | Active | Details | -40°C ~ 100°C (TJ) | XUB | Sensors | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | Proximity Sensors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MSIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | EPCOS / TDK | 400 | EPCOS / TDK | + 155 C | AMD Xilinx | - 55 C | PCB Mount | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Bulk | B58100 | 2 % | NTC | 1.465 kOhms | Thermistors | 60 mW | Radial | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | NTC Thermistors | Versal™ AI Core FPGA, 1.9M Logic Cells | - | NTC Thermistors | 11 mm | 12 mm | 12.6 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MSEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | 0 C | MIL-Spec / MIL-Type | 800 mV | Rectangular MIL Spec Connectors | Rectangular MIL Spec Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LSEVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LLEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | Glenair | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1LLIVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | - 40 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2LSEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | 0 C | MIL-Spec / MIL-Type | 700 mV | Rectangular MIL Spec Connectors | Rectangular MIL Spec Connectors |
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10AS027H4F34I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,807.737249
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10AS032E4F29I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,613.741199
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10AS027H4F35I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,445.935351
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10AS027E1F27I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID023R18A1E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVP1502-1LSEVSVA3340
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA4U23C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
134.924429
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5ASTMD3E3F31I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTFD5K3F40I5NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-L2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2LSEVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-1MLIVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2MSIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2MSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2LSEVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2LLEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2LSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1LLIVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2LSEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire