The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Antenna Connector Type | Base Product Number | Core | Data RAM Size | Data RAM Type | Dimensions | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Description | Part Life Cycle Code | Power Class | Product Status | Risk Rank | RoHS | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | Type | Voltage - Supply | Reach Compliance Code | Frequency | Pin Count | Operating Supply Voltage | Number of Channels | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Utilized IC / Part | Protocol | Frequency Range | Screening Level | Telecom IC Type | Power - Output | RF Family/Standard | Number of Transceivers | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Modulation | Number of Cores | Flash Size | ADC Resolution | Height | Length | Width |
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![]() | Mfr Part No XA7Z010-1CLG400Q4835 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex A9 | - | 750 | 2 x 32 kB | 2 x 32 kB | 667 MHz | 2200 LAB | 2800 LE | Zynq | XA7Z010 | - | 2 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2EG-L1SFVC784I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 1.2 Mbit | 5.3 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 252 I/O | 5904 LAB | 103320 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU2EG | 720 mV/850 mV | - | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7CG-L1FFVF1517I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1517 | ARM Cortex A53, ARM Cortex R5 | - | 6.2 Mbit | 11 Mbit | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 600 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 464 I/O | 28800 LAB | 504000 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU7CG | 720 mV/850 mV | - | 24 Transceiver | 4 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU17EG-L1FFVB1517I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1517 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 8 Mbit | 28 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 644 I/O | 52925.38 LAB | 926194 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU17EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU4EV-1SFVC784I4879 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 2.6 Mbit | 4.5 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | SMD/SMT | 252 I/O | 10980 LAB | 192150 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU4EV | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EV-1SFVC784I4863 | Xilinx | Datasheet | 59 | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 3.5 Mbit | 5.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 252 I/O | 14640 LAB | 256200 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU15EG | 0.85 V | - | 4 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UC200TGLAA-N06-MN0AA | Quectel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Module | - | UC200 | 32 mm x 29 mm x 2.4 mm | 100 | ADC, I2C, PCM, SDIO, UART, USB 2.0 | + 75 C | Quectel | - 35 C | Surface Mount | Tray | Obsolete | Details | LCC | 4.5 V | 3.4 V | Wireless communication module | 0.370377 oz | Industrial grade | -35 to 75 °C | Cut Tape | UC200T | UMTS/HSPA Module | 3.4V ~ 4.5V | 850MHz, 900MHz, 1.8GHz, 1.9GHz | 3.8 V | - | - | 21Mbps | - | EDGE, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 2100/1900/850/900/850/900/1800/1900 MHz | Industrial | - | Cellular | Antenna Not Included | - | ADC, I²C, PCM, SDIO, UART, USB | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EM05EFA-512-SGAS | Quectel | Datasheet | 88 | - | Min: 1 Mult: 1 | Card Edge | Module | EM05 | 100 | USB 2.0 | Quectel | Socket Mount | Tray | Active | Details | Wireless communication module | 0.222931 oz | -40 to 85 °C | Reel | - | IoT/M2M-Optimized LTE Cat 4 M.2 Module | 3.135V ~ 4.4V | - | 3.6, 3 V | - | 150 Mbps | - | BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, WCDMA | 700, 800, 900, 1800, 2100, 2600 MHz | Extended | - | Cellular, Navigation | Antenna Not Included | -109.5 dBm | USB | 20mA | 20mA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DA14585-00T00AT2 | Dialog Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 5000 | DIALOG SEMICONDUCTOR GMBH | DA14585-00T00AT2 | Yes | , | Active | 5.65 | Details | Reel | unknown | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095T-1FCVG484I | Microchip Technology | Datasheet | 1642 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095TL-FCSG536E | Microchip Technology | Datasheet | 2256 |
| Min: 1 Mult: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250TS-1FCVG784I | Microchip Technology | Datasheet | 780 |
| Min: 1 Mult: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250TLS-FCVG784I | Microchip Technology | Datasheet | 2274 |
| Min: 1 Mult: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095TS-FCSG325I | Microchip Technology | Datasheet | 2183 |
| Min: 1 Mult: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 276 I/O | 93000 LE | Bulk | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU47DR-2FSVE1156I5112 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 394 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS2083BM-232 | Microchip Technology | Datasheet | 544 | - | Min: 1 Mult: 1 | Surface Mount | BGA-82 | IS2083 | 8051 | 96 kB | SRAM | 3000 | I2C, UART, USB | 2 Mbps | + 85 C | Microchip Technology | - 40 C | Surface Mount | SMD/SMT | 19 I/O | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Class I/Class II | Active | VFBGA | 4.2 V | 3.2 V | Industrial grade | -40 to 85 °C | Reel | - | Bluetooth | 3.2V ~ 4.2V | 2.4GHz | 82 | 3.3 V | 2 | 16MB Flash, 512kB RAM, 832kB ROM | Flash | 2 MB | 9.5 dBm | 3Mbps | 8 bit | IS2083BM | Bluetooth v5.0 | Industrial | - | Bluetooth | Antenna Not Included | - 90 dBm | 2 Channel | GPIO, I²C, I²S, PWM, UART, USB | - | - | 8DPSK, DQPSK, GFSK | 10 bit, 16 bit | 0.9 mm | 5.5 mm | 5.5 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3EG-1SFVC784I5165 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | - 40 C | SMD/SMT | 252 I/O | 8820 LAB | 154350 LE | 850 mV | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1802-2MLIVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | - 40 C | 500 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1902-2MSEVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | 1 | + 110 C | AMD Xilinx | 0 C | 500 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU43DR-1FFVE1156I5082 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 386 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core |
XA7Z010-1CLG400Q4835
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU2EG-L1SFVC784I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU7CG-L1FFVF1517I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU17EG-L1FFVB1517I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU4EV-1SFVC784I4879
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU5EV-1SFVC784I4863
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
UC200TGLAA-N06-MN0AA
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
EM05EFA-512-SGAS
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
DA14585-00T00AT2
Dialog Semiconductor
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS095T-1FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
215.673044
MPFS095TL-FCSG536E
Microchip Technology
Package:Embedded - System On Chip (SoC)
197.300364
MPFS250TS-1FCVG784I
Microchip Technology
Package:Embedded - System On Chip (SoC)
601.792330
MPFS250TLS-FCVG784I
Microchip Technology
Package:Embedded - System On Chip (SoC)
492.711176
MPFS095TS-FCSG325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
286.331439
XCZU47DR-2FSVE1156I5112
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
IS2083BM-232
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU3EG-1SFVC784I5165
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1802-2MLIVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1902-2MSEVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU43DR-1FFVE1156I5082
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
