The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Base Product Number | Brand | Contact Sizes | Data RAM Size | Dedicated DSP | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Family Name | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Multipliers | Operating Temperature-Max | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | Additional Feature | HTS Code | Fastening Type | Subcategory | Contact Type | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Base Part Number | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Note | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Load Capacitance | Speed | RAM Size | Shell Size, MIL | Core Processor | Number of Resistors | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Circuit Type | Seated Height-Max | Power Per Element | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Includes | Total RAM Bits | Number of Gates | Max Frequency | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Resistor-Ratio-Drift | Number of Registers | Number of Logic Cells | Number of Cores | Resistance (Ohms) | Resistor Matching Ratio | Output Level | Flash Size | Features | Product Category | Device Core | Height Seated (Max) | Length | Width | Material Flammability Rating |
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 | Mfr Part No M2S005S-TQG144I | Microchip | Datasheet | 50 | - | Min: 1 Mult: 1 | TQFP-144 | 144-TQFP (20x20) | M2S005 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 84 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0.046530 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144 | Microchip | Datasheet | 2146 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S010 | Microchip Technology / Atmel | 64 kB | 400 kbit | 60 | - | - | Microchip | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 84 | 1007 LAB | 12084 LE | Tray | Active | Details | 0.035380 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQ144I | Microchip | Datasheet | 2151 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-TQ144I | Microchip Technology | 3 | Surface Mount | 84 | 38.4 MHz | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | SMD | 1.26 V | 1.14 V | 1.2 V | -40 to 85 °C | SmartFusion®2 | e0 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | 4 | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 10 pF | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | Clipped Sinewave | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6F31C8N | ALTERA | Datasheet | 2223 |
| Min: 1 Mult: 1 | Surface Mount | 1206 (3216 Metric), Concave, Long Side Terminals | 8 | -- | Yes | Cyclone V SE | 3.3 V | +85 °C | 1.8 V | 0 °C | MCU - 181, FPGA - 288 | 224 (18 x 18) | FBGA | Compliant | -55°C ~ 155°C | Tape & Reel (TR) | RACF | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±5% | Active | ±200ppm/°C | 85 °C | 0 °C | Automotive AEC-Q200 | 5CSEMA6 | 896 | 1.13 V | 3.3 V | 1.8 V | 773.9 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 4 | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Isolated | 62.5mW | 110000 | 110000 | 800 MHz | 41509 | 8 | FPGA - 110K Logic Elements | -- | 166036 | 110000 | 5.1k | -- | -- | 0.030 (0.75mm) | 31mm | 31mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384GUIFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | BCM3384 | Broadcom Limited | Tray | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MLIVSVA1596 | AMD | Datasheet | 557 |
| Min: 1 Mult: 1 | Panel Mount | 1596-BFBGA, FCBGA | Flange | Circular | Composite | - | CTVPS00RF | 22D (97), 8 Twinax (2) | Amphenol Aerospace Operations | 478 | Bulk | Active | -65°C ~ 200°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Male Pins | 99 (97 + 2 Twinax) | Threaded | Crimp | D | Shielded | Environment Resistant | Electroless Nickel | 25-7 | Silver | Contacts Not Included | 600MHz, 1.4GHz | 256KB | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | Versal™ AI Core FPGA, 800k Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-2UBVA530E | AMD | Datasheet | 2338 |
| Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU1EG-L1SFVA625I | AMD | Datasheet | 1781 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 82K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1LSEVFVC1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2MLIVFVC1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LSEVFVC1596 | AMD | Datasheet | 759 | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1VF256 | Microchip | Datasheet | 91 | - | Min: 1 Mult: 1 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010-1VF256 | 166 MHz | Microchip Technology | SMD/SMT | 138 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 2.49 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 400Kbit | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FFVE1156E | AMD | Datasheet | 768 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FFVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 1.8/2.5/3.3 V | RISC | Yes | AMD | Surface Mount | 6 | 561 | Tray | Active | FCBGA | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1517 | 3.3 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FFVE1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AMN3Q1AEM | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676 | Microchip | Datasheet | 1919 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | Microchip Technology | 387 | Tray | Active | Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCV484 | Microchip | Datasheet | 1679 | - | Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150TS-FCV484 | 166 MHz | Microchip Technology | 273 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.87 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | No | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B484 | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 1 Core | 512KB | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C3U19E2SG | ALTERA | Datasheet | 588 |
| Min: 1 Mult: 1 | Axial | Axial | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 964674 | Non-Compliant | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/07, RNC50 | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | ±1% | Active | 2 | ±25ppm/°C | 6.81 kOhms | Metal Film | 0.1W, 1/10W | SOC - Systems on a Chip | S (0.001%) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 160K Logic Elements | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LLENBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - |
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M2S005S-TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA6F31C8N
ALTERA
Package:Embedded - System On Chip (SoC)
261.514854
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BCM3384GUIFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2MLIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
25,010.181952
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XCZU3CG-2UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
523.810814
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XAZU1EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
391.998486
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XCVM1802-1LSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-2MLIVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-1LSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-1FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-2FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-2FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
LS1046AMN3Q1AEM
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FGG676
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FCV484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016C3U19E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
690.483581
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XCVM1302-2LLENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire