The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Material | Insert Material | Number of Terminals | Backshell Material, Plating | # I/Os (Max) | Base Product Number | Brand | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Core | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Primary Material | Process Technology | Processing Unit | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Termination | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Shell Size, MIL | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Cable Opening | Family | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Screening Level | Speed Grade | Legend | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Features | Product Category | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S150T-FC1152I | Microchip Technology | Datasheet | 1887 |
| Min: 1 Mult: 1 | FCBGA-1152 | 1152-FCBGA (35x35) | M2S150 | ARM Cortex M3 | 64 kB | 24 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1FGG484I | Microchip Technology | Datasheet | 70 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S010 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 233 | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG484 | Microchip Technology | Datasheet | 1612 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FG484I | Microchip Technology | Datasheet | 1684 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S090TS-1FG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.78 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FG484I | Microchip | Datasheet | 2372 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount, Through Hole | 484-BGA | Flange | Aluminum | 484-FPBGA (23x23) | - | - | TVP00DT | Gold | Copper Alloy | Amphenol Aerospace Operations | 267 | Bulk | Metal | Active | Non-Compliant | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ HD | Solder | Receptacle, Male Pins | 55 | - | Military | Threaded | - | A | Shielded | Environment Resistant | Durmalon™ | 15-55 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | Alignment Disc | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1VF400 | Microchip | Datasheet | 2199 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | Polystyrene | 400 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Brady | 119817 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 207 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Fire/Emergency Signs | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | Emergency Fire Alarm | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM33843EUKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | ABB | ACH580-BCR-017A-2+E213+K451+L501 | Broadcom Limited | - | Tray | Obsolete | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MSCMMX6XYCM08AA | NXP | Datasheet | - | - | Min: 1 Mult: 1 | NXP SEMICONDUCTORS | NXP Semiconductors | MSCMMX6XYCM08AA | Surface Mount | , | BGA | Obsolete | Microprocessor | Yes | No | 5.77 | Industrial grade | 8542.31.00.01 | unknown | 265 | MICROPROCESSOR, RISC | MSCMMX6XYCM08 | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-FG256 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.88 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | OTHER | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-FG256I | 3 | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 8.76 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG256I | Microchip | Datasheet | 1695 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | Microchip Technology / Atmel | 64 kB | 119 | - | - | Microchip | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | SMD/SMT | 138 I/O | 2308 LAB | 27696 LE | Tray | Active | Non-Compliant | 8542390000 | 1.2000 V | 0.241494 oz | -40 to 100 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1CSG288I | Microchip | Datasheet | 16 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F200 | 200000 | 1.575 V | Microchip Technology | 1.425 V | MCU - 31, FPGA - 78 | Tray | Active | 1.5000 V | -40 to 100 °C | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FCSG325I | Microchip | Datasheet | 276 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S025 | 64 kB | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 180 | 27696 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484T2 | Microchip | Datasheet | 2151 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S060 | Microchip Technology | 267 | Tray | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484T2 | Microchip | Datasheet | 2046 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | Microchip Technology | 267 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1TQG144 | 85 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 5.81 | Yes | 1.575 V | 1.425 V | 1.5 V | 8542.39.00.01 | CMOS | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484I | Microchip | Datasheet | 1792 | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | 267 | M2S050 | Microchip Technology / Atmel | 64 kB | 60 | SMARTFUSION2 | - | - | 56340 | Microchip | 166 MHz | Microchip Technology | Yes | Surface Mount | SMD/SMT | 267 | 4695 LAB | 56340 | 56340 LE | 1.26(V) | 1.14(V) | 1.2(V) | -40C to 100C | 100C | -40C | Industrial | Tray | FPBGA | 65nm | Active | Yes | No | Details | This product may require additional documentation to export from the United States. | 0.489749 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-TQG144 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 30 | 8.63 | Yes | 1.575 V | 1.425 V | 1.5 V | e3 | PURE MATTE TIN (394) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | S-PQFP-G144 | 33 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU65DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | EDAC Inc. | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVE1924E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU17 | ABB | ACH580-BCR-088A-2+B058+F267+K452 | AMD | 668 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1924 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - |
-
M2S150T-FC1152I
Microchip Technology
Package:Embedded - System On Chip (SoC)
527.322441
-
M2S010TS-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
68.888904
-
M2S060-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
228.969932
-
M2S090TS-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM33843EUKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MSCMMX6XYCM08AA
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
85.421105
-
M2S025-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
103.125453
-
M2S060TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU65DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-2FFVE1924E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire