The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Shell Material | Supplier Device Package | Material | Insert Material | Body Material | Number of Terminals | Surface Mount Land Size | Base Product Number | Brand | Contact Materials | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Insert Arrangement | Inside Diameter After Shrinking | Inside Diameter Before Shrinking | L1 Cache Data Memory | L1 Cache Instruction Memory | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Product Thickness | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Service Rating | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Termination | Connector Type | Type | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | Applications | Gender | HTS Code | Capacitance | Fastening Type | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Number of Contacts | ESR (Equivalent Series Resistance) | Lead Spacing | Power Supplies | Contact Style | Temperature Grade | Current - Supply (Disable) (Max) | Sealing | Polarization | Impedance | Speed | RAM Size | Ripple Current @ Low Frequency | Core Processor | Ripple Current @ High Frequency | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Shell Plating | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Shrink Ratio | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No XCVC1502-1MSIVSVA2197 | AMD | Datasheet | 673 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 586 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R16A2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Polyolefin | 0.64 | 1.98 | Intel | 384 | Tray | Active | 0.41 | 0°C ~ 100°C (TJ) | Agilex F | TUBING | Clear | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | 3:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-3FFVB1156E | AMD | Datasheet | 180 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Metal | XCZU6 | AMD | 328 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225C | AMD | Datasheet | 96 |
| Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z007 | AMD | 54 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C4U19E3LG | ALTERA | Datasheet | 712 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | YES | 484-UBGA (19x19) | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C4U19E3LG | 1.2 GHz | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964677 | Active | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-L1SFVA625I | AMD | Datasheet | 408 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | AMD | 180 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2E3VR0 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA019R25A2I2V | Intel | Datasheet | 469 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA019R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256IX94 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 50 microinches Gold Plate | Wall - Front Mount - Thru Holes | Stainless Steel | Hard Dielectric | Copper Alloy | 53#20 | H53 | I | Yes | Socket | Meets IP67 | Electroless Nickel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-1FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | KPSE | ITT Cannon, LLC | MCU - 136, FPGA - 108 | Bulk | Active | -40°C ~ 125°C (TJ) | KPSE | - | 230.4KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 23K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-2SFVA625E | AMD | Datasheet | 494 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | MIK0 | ITT Cannon, LLC | 180 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1SBVA484I | AMD | Datasheet | 2343 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FB484I | AMD | Datasheet | 2193 |
| Min: 1 Mult: 1 | Gold | Free Hanging | 484-BBGA, FCBGA | 66 | 484-FCBGA (23x23) | XC7Z030 | AMD | 130 | Bulk | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Bulk | Zynq®-7000 | Crimp | Plug | 66 | 175 °C | -65 °C | Male | Threaded | 66 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | Shielded | Environment Resistant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225I | AMD | Datasheet | 9 |
| Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z007 | AMD | 54 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-2SFVA625I | AMD | Datasheet | 401 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | AMD | 180 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-1FFVB1156I | AMD | Datasheet | 792 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCZU9 | AMD | 328 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | Active | XO (Standard) | 3.3V | 16MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C3U19I2SG | ALTERA | Datasheet | 513 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-UBGA (19x19) | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 964673 | Non-Compliant | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0.423288 oz | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 160K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z012S-1CLG485I | AMD | Datasheet | 1788 |
| Min: 1 Mult: 1 | Surface Mount | Radial, Can - SMD | 485-CSPBGA (19x19) | 0.260 L x 0.260 W (6.60mm x 6.60mm) | XC7Z012 | 2000 Hrs @ 105°C | United Chemi-Con | 150 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | 6.3 V | -55°C ~ 105°C | Alchip™- MZA | 0.248 Dia (6.30mm) | ±20% | Automotive | 100 µF | - | - | Polar | 360 mOhms | 667MHz | 256KB | 96 mA @ 120 Hz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 240 mA @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Artix™-7 FPGA, 55K Logic Cells | - | 0.240 (6.10mm) | AEC-Q200 |
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XCVC1502-1MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
21,228.762446
-
AGFA008R16A2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6EG-3FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-1CLG225C
AMD
Package:Embedded - System On Chip (SoC)
59.594164
-
10AS016C4U19E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
651.925636
-
XCZU3EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
767.207569
-
AGFA008R24C2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB027R31B2E3VR0
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA019R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
18,535.317115
-
AGFA019R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FG256IX94
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS025T-1FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3EG-2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
765.366767
-
XCZU2EG-1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
418.393592
-
XC7Z030-1FB484I
AMD
Package:Embedded - System On Chip (SoC)
406.735584
-
XC7Z007S-2CLG225I
AMD
Package:Embedded - System On Chip (SoC)
88.057554
-
XCZU3EG-2SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU9CG-1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
4,103.973877
-
10AS016C3U19I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
800.935967
-
XC7Z012S-1CLG485I
AMD
Package:Embedded - System On Chip (SoC)
135.749177