The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Case Code - in | Case Code - mm | Colour outer sheath | Connection 1 | Connection 2 | Data RAM Size | Degree of protection (IP) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Illuminated | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material outer sheath | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Nominal cross section conductor | Nominal current | Nominal voltage | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Outer diameter approx. | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Protective conductor | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Spiralized cable | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Temperature resistance | Tradename | Unit Weight | Voltage Rating (DC) | Voltage, Rating | With cord switch | With protective conductor | Operating Temperature | Packaging | Series | Tolerance | Part Status | Temperature Coefficient | Type | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Applications | HTS Code | Subcategory | Power Rating | Pitch | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Interface | Memory Size | Speed | RAM Size | Core Processor | Number of Poles | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Height | Length | Width |
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 | Mfr Part No AGFB008R16A2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | PCB | 384 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | COMBICON MKKDS | 5 mm | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A2E3V | Intel | Datasheet | 483 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCVG484E | Microchip | Datasheet | 2054 |
| Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | AIRPAX | - | 3 | Not Illuminated | 4 x 32 kB | 16 kB, 4 x 32 kB | Sensata | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | Panel Mount | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | AIRPAX | 6.349313 oz | 0°C ~ 100°C | Tray | LEL/LML | Hydraulic-Magnetic | Circuit Breakers | 60 A | Stud | Handle | 1 V | - | 2.2MB | RISC-V | 2 Pole | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Circuit Breakers | FPGA - 254K Logic Modules | 5 Core | 128kB | Circuit Protectors | Circuit Breakers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F29E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | Royalohm | 1210 | 3225 | 5000 | INTEL CORP | Royalohm | 10AS016E3F29E1SG | + 155 C | - 55 C | PCB Mount | 288 | 100 °C | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.67 | Details | Yes | 0.93 V | 0.87 V | 0.9 V | 0.000564 oz | 200 V | 0°C ~ 100°C (TJ) | Reel | General Purpose Thick Film | 1 % | Discontinued at Digi-Key | 100 PPM / C | 16.5 Ohms | General Purpose | 8542.39.00.01 | Resistors | 500 mW (1/2 W) | Thick Film | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | SMD/SMT | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | Thick Film Resistors | FPGA - 160K Logic Elements | 160000 | -- | Wrap-Around Termination | Thick Film Resistors - SMD | 0.55 mm | 3.1 mm | 2.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-L1FBVB900I | AMD | Datasheet | 513 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R31C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM47622LA1KFEBG | AVAGO | Datasheet | - | - | Min: 1 Mult: 1 | 200 V | 500 mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U23C8SN | ALTERA | Datasheet | 40 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA2U23C8SN | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.04 | Non-Compliant | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE SNGL -core ARM Cortex-A9 | 8542390000 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 600 MHz | S-PBGA-B672 | 145 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27E2LG | ALTERA | Datasheet | 556 |
| Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F27E2LG | 1.2 GHz | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964683 | Active | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVG1517E | Xilinx | Datasheet | 288 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FFG900E | AMD | Datasheet | 407 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z045 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R31C2E2VAA | Intel | Datasheet | 438 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LLIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | RAM, SRAM | AMD | 692 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Versal™ AI Core | 85 °C | -40 °C | Parallel | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 50 V | 0°C ~ 100°C (TJ) | Agilex F | 1 % | 100 ppm/°C | 1.93 kΩ | 155 °C | -55 °C | Thin Film | 100 mW | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | 550 µm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Grey | Other | Other | Other | Other | AMD Xilinx | 1.5 | 6.6 | 380 - 480 | 366 | 10 | Tray | Active | Yes | No | -10 - 55 | No | Yes | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 50 - 60 | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 1.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | Microchip Technology | 574 | Tray | Active | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 512KB |
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AGFB008R16A2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
16,343.684043
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XCZU43DR-2FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-1FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
300.485945
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10AS016E3F29E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA012R24B2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7CG-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,615.670010
-
AGFB027R31C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM47622LA1KFEBG
AVAGO
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EV-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U23C8SN
ALTERA
Package:Embedded - System On Chip (SoC)
76.232800
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10AS016E3F27E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,119.641021
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XCZU47DR-2FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-2FFG900E
AMD
Package:Embedded - System On Chip (SoC)
2,522.973237
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AGFB027R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
30,497.470363
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XCVC1802-1LLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB027R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCG1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire