The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Connectivity
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Surface Mount Land Size | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Number of Rows | Power (Watts) | HTS Code | Capacitance | Subcategory | Current Rating (Amps) | Pitch | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Number of Positions Loaded | Reach Compliance Code | Base Part Number | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Memory Size | Polarization | Impedance | Connector Style | Speed | RAM Size | Lead Style | Core Processor | Ripple Current @ High Frequency | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Connector Usage | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness | Lead Free | Ratings |
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 | Mfr Part No XCVC1902-1MSIVIVA1596 | AMD | Datasheet | 446 | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2SBVA484I | AMD | Datasheet | 1970 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2LSEVFVC1760 | AMD | Datasheet | 431 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MSINSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LLINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MSEVSVD1760 | AMD | Datasheet | 700 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MSEVSVD1760 | AMD | Datasheet | 476 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z015-1CLG485C | AMD | Datasheet | 1902 |
| Min: 1 Mult: 1 | Through Hole | Radial, Can | 485-CSPBGA (19x19) | - | XC7Z015 | 5000 Hrs @ 105°C | EPCOS - TDK Electronics | 130 | Bulk | Obsolete | 25 V | -55°C ~ 105°C | B41858 | 0.492 Dia (12.50mm) | ±20% | Automotive | 2200 µF | 30mOhm @ 10kHz | 0.197 (5.00mm) | Polar | 25 mOhms | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 2.858 A @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | 1.654 (42.00mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z020-2CLG484I | AMD | Datasheet | 36 | - | Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | 093338 | Molex | 130 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FFG900C | AMD | Datasheet | 601 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | DIV40E15 | TE Connectivity Deutsch Connectors | 130 | Bag | Active | 0°C ~ 85°C (TJ) | * | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-1FBVB900I | AMD | Datasheet | 434 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | KEMET | 204 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A3I3E | Intel | Datasheet | 468 |
| Min: 1 Mult: 1 | - | - | 120122 | Molex | 480 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA019R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial, Disc | - | Vishay Beyschlag/Draloric/BC Components | 480 | Bulk | Active | 440VAC | -40°C ~ 125°C | WYO | 0.256 Dia (6.50mm) | ±20% | Y5U (E) | Safety | 1000 pF | - | 0.197 (5.00mm) | 1.4GHz | 256KB | Straight | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | - | 0.374 (9.50mm) | - | X1, Y2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R31C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | DL66G12 | TE Connectivity Deutsch Connectors | 720 | Bag | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R16A2I2V | Intel | Datasheet | 731 |
| Min: 1 Mult: 1 | - | - | 173114 | Molex | 384 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | RN732B | KOA Speer Electronics, Inc. | 720 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±50ppm/°C | 111 Ohms | Thin Film | 0.125W, 1/8W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Moisture Resistant | 0.028 (0.70mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U23C7N | ALTERA | Datasheet | 2081 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | 121064 | INTEL CORP | Intel Corporation | 5CSEBA6U23C7N | Molex | MCU - 181, FPGA - 145 | 85 °C | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2.01 | Compliant | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | * | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 7 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | RN731J | INTEL CORP | Intel Corporation | 10AS048H2F34E1SG | KOA Speer Electronics, Inc. | 492 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Obsolete | NOT SPECIFIED | 5.68 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 16.4 kOhms | Thin Film | 0.063W, 1/16W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | Moisture Resistant | 0.022 (0.55mm) | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066N4F40I3SGES | ALTERA | Datasheet | 407 |
| Min: 1 Mult: 1 | - | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N4F40I3SGES | KYOCERA AVX | 588 | 100 °C | -40 °C | Bag | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | 0.93 V | 0.87 V | 0.9 V | 250VAC/DC | -55°C ~ 125°C | Tray | 8071, Kyocera | Discontinued at Digi-Key | - | Receptacle, Female Sockets | 55 | - | 8542.39.00.01 | 1 A | 0.079 (2.00mm) | BOTTOM | BALL | 1 mm | All | compliant | - | S-PBGA-B1517 | INDUSTRIAL | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 660K Logic Elements | -- | - | 40 mm | 40 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057K3F40E2SG | ALTERA | Datasheet | 436 |
| Min: 1 Mult: 1 | 2512 (6432 Metric) | YES | 2512 | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057K3F40E2SG | 1.2 GHz | Stackpole Electronics Inc | Yes | SMD/SMT | 696 | 71250 LAB | 570000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | 965069 | Active | Active | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RMCF | 0.248 L x 0.126 W (6.30mm x 3.20mm) | ±1% | Active | 2 | ±400ppm/°C | 7.32 Ohms | Thick Film | 1W | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | - | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 2 Core | -- | Automotive AEC-Q200 | SoC FPGA | 0.028 (0.70mm) | 40 mm | 40 mm | AEC-Q200 |
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XCVC1902-1MSIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU1EG-2SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-2LSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1MSINSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1LLINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1MSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
22,841.761335
-
XC7Z015-1CLG485C
AMD
Package:Embedded - System On Chip (SoC)
149.969512
-
XC7Z020-2CLG484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-1FFG900C
AMD
Package:Embedded - System On Chip (SoC)
2,069.579267
-
XCZU7EV-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,223.581632
-
AGFA023R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
13,592.132687
-
AGFA019R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB027R31C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA008R16A2I2V
Intel
Package:Embedded - System On Chip (SoC)
10,703.191949
-
AGFA027R31C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA6U23C7N
ALTERA
Package:Embedded - System On Chip (SoC)
323.461694
-
10AS048H2F34E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066N4F40I3SGES
ALTERA
Package:Embedded - System On Chip (SoC)
4,034.621995
-
10AS057K3F40E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,255.783809