The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Terminal Material | Base Product Number | Data RAM Size | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Insulation Materials | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Voltage-Input | Wire Size | Operating Temperature | Series | JESD-609 Code | Pbfree Code | Part Status | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Current - Output | Core Processor | Peripherals | Program Memory Size | Connectivity | Voltage - Output | Architecture | Data Bus Width | Frequency - Switching | Number of Inputs | Seated Height-Max | Utilized IC / Part | Supplied Contents | Programmable Logic Type | Terminal Type | Wire Strip Length | Wire Size (AWG) | Screening Level | Board Type | Speed Grade | Main Purpose | Primary Attributes | Outputs and Type | Regulator Topology | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Insulated | Length | Width |
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 | Mfr Part No XCVC1902-1MSEVSVA2197 | AMD | Datasheet | 495 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | Adaptive Compute Acc | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MSEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM47622A1KFEBG | Broadcom | Datasheet | 3116 |
| Min: 1 Mult: 1 | - | - | Aluminum | Nylon | Burndy | ES4W8W | Broadcom Limited | - | Tray | Active | Side A 4 AWG, Side B 8 AWG | - | - | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Splice Reducer | 0.88 | 4 AWG, 8 AWG | - | - | Insulated | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050S-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100T-FC1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100T-FC1152 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090S-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 676 | MICROSEMI CORP | Microsemi Corporation | M2S090S-1FG676I | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.83 | No | 1.26 V | 1.14 V | 1.2 V | No | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 676 | S-PBGA-B676 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100T-FCG1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100T-FCG1152 | 4 | 85 °C | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FGG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | Microchip Technology | 233 | Tray | Active | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100T-1FCG1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100T-1FCG1152 | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256I | Microchip | Datasheet | 2084 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IMX8XMIPI4CAM | NXP | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIMX8UX6AVLFZAB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVB1156E | AMD | Datasheet | 713 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | 0.892 V | AMD | 0.808 V | 328 | Bulk | Active | 0.8500 V | 0 to 100 °C | * | Active | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-2CLG484I | AMD | Datasheet | 1800 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | XC7Z014 | 1.05 V | AMD | 0.95 V | 200 | Tray | Active | 1.0000 V | 5 V ~ 15 V | -40 to 100 °C | -- | Active | LT1425 | 766MHz | 256KB | -- | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ±15V | MCU, FPGA | -- | LT1425 | Board(s) | Fully Populated | 2 | DC/DC Converter | Artix™-7 FPGA, 65K Logic Cells | 2, Isolated | Flyback | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L1FSVG1517I | AMD | Datasheet | 452 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FSVF1760I | AMD | Datasheet | 785 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 1.8/2.5/3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | Surface Mount | 6 | 622 | Tray | Active | FCBGA | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 0.85 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/Arm Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCVG484 | Microchip | Datasheet | 1614 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FCVG484 | 166 MHz | Microchip Technology | 4 | 273 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1VFG400I | Microchip | Datasheet | 2057 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-1VFG400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCG1152I | Microchip | Datasheet | 2125 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCG1152I | 166 MHz | + 100 C | Microchip Technology | - 40 C | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.77 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm |
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XCVC1902-1MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1902-2MSEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM47622A1KFEBG
Broadcom
Package:Embedded - System On Chip (SoC)
36.363438
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M2S050S-1VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S100T-FC1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090S-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090S-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S100T-FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S100T-1FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
133.851570
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IMX8XMIPI4CAM
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
PIMX8UX6AVLFZAB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6CG-2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
3,332.575404
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XC7Z014S-2CLG484I
AMD
Package:Embedded - System On Chip (SoC)
155.264966
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XCZU43DR-L1FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
22,635.772664
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XCZU49DR-2FSVF1760I
AMD
Package:Embedded - System On Chip (SoC)
32,684.182238
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M2S150-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
228.172952
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M2S060T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
519.887643